• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.49-54
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• 2020

To attach a stretchable/flexible electrode to something or something to on electrode, conductive adhesives must be stretchable/flexible to suit the properties of the electrode. In particular, conductive adhesive require durability and heat resistance, and unlike conventional adhesives, they should also have conductivity. To this end, Epoxy, which has good strength and adhesion, was selected as an adhesive, and a plasticizer and a reinforcement were mixed instead of a two-liquid material consisting of a conventional theme and a hardener, and a four-liquid material was used to give stretchability/flexibility to high molecules. The conductive filler was selected as silver, a material with low resistance, and for high conductivity, three shapes of Ag particles were used to increase packing density. Conductivity was compared with these developed conductive adhesives and two epoxy-based conductive adhesives being sold in practice, and about 10 times better conductivity results were obtained than products being actually sold. In addition, conductivity, mechanical properties, adhesion and strength were evaluated according to the presence of plasticizers and reinforcement agent. There was also no problem with 60% tensile after 5 minutes of curing at 120℃, and pencil hardness was excellently measured at 6H. As a result of checking the adhesion of electrodes through 3M tape test, all of them showed excellent results regardless of the mixing ratio of binders. After attaching the Cu sheet on top of the electrode through conductive adhesive, the contact resistance was checked and showed excellent performance with 0.3 Ω.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.1
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• pp.35-38
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• 2015

LEDs are considered to be an alternative for enhancement of energy efficiency, applied for numerous areas such as display, automotive headlight not only lights. Yellow phosphor is generally utilized with blue LEDs to generate WLED, $Y_3Al_{5}O_{12}:Ce^{3+}$ is typically used as the yellow phosphor. The phosphor, mixed with epoxy resin, has been used by being spread and hardened on the blue LED chip. This paste-based packaging gives rise to problems of degradation of phosphor by heat and decrease of luminous efficiency. Although phosphor plate is used instead of the epoxy-phosphor mixture to solve these problems, loss of luminous efficacy by total internal reflection inside the plate also should be solved. In this study, we coated the side of the plate with silver as one of the solution.

• Journal of the Korean Institute of Telematics and Electronics
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• v.19 no.5
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• pp.5-11
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• 1982

The dielectric slab waveguide is fabricated on the slide glass or oxidized silicon wafer, by spin coating polyurethane, epoxy or photoresist, and the phenomenon of dielectric waveguiding is oboerved. Using the fact that the refractive index of K.P.R. is larger than that of polyurethane, thin film prism with two layered structure is fabricated, and the refraction of light is observed.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1599-1600
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• 2011

현재 사용되는 전력기기와 전기에너지로 구동되는 기기등은 환경 조화와 에너지 절약을 목표로 고전압 대용량화, 축소 소형화 및 고효율화가 진행되는 과정에 있다. 이런 기기들은 전위를 유지하기 위해서 전기절연기술이 필수적이다. 특히 전기절연재료의 역할이 중요해서 재료의 특성이 기기전체의 종합성능을 지배하기도 한다. 본 연구에서는 몰드 변압기의 절연수지로 사용되는 에폭시 복합체와 마이크로 $SiO_2$와 Ag 각 시편의 열팽창률과 유전 특성 및 온도에 따른 절연파괴강도를 측정하여 열적 특성 및 전기적 특성을 검토하고 분석한다.

• Journal of Information Display
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• v.13 no.1
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04a
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• pp.88-95
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• 2002

Recent development in the field of RE-Ba-Cu-O (REBCO, RE: Y or rare earth elements) bulk high-Tc superconductors (HTS) is reviewed in the present paper. After the fatal weak link problem of sintered REBCO superconductors has been overcome by melt processing, this field has been greatly advanced during last ten years. The critical current density $J_c$ at 77 K has been enhanced by introducing effective flux pinning sites into the $REBa_2Cu_3O_y$ (RE123) superconducting matrix. Large melt-textured REBCO bulk crystals have been fabricated with the TSMG(top-seeded melt growth) technique. Mechanical properties of REBCO bulks have been improved by using the Ag additive or epoxy resin. Real bulk applications such as current lead, fault current limiter, flywheel energy storage system, magnetic field source, magnetic separation system, and etc., surely come true near future.

• Progress in Superconductivity
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• v.3 no.1
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• pp.115-119
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• 2001

For the fabrication of HTS power cable, multifilamentary Bi-2223/Ag tapes have been prepared using the powder-in-tube (PIT) process. After final heat treatment, these tapes have $I_{c}$ value of 43A, and$ J_{c}$ value of $28,000A/\textrm{cm}^2$(77K, 0T). Prototype 1000A class multistrand conductor(length~1m) was fabricated using these tapes(length~300m). This multistrand conductor was impregnated with low-temperature epoxy. The transportation properties of prototype 1000A class multistrand conductor has been evaluated at 77K, and yielding a current capacity up to 1200A.A.A.

• Journal of Dental Rehabilitation and Applied Science
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• v.30 no.1
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• pp.16-22
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• 2014

Purpose: The purpose of this study was to assess the marginal and mesial fitness of zirconia single copings and 3-unit fixed partial dentures (FPDs) manufactured with an identical model. Materials and Methods: An epoxy model in which the maxillary right 2nd premolar is lost and maxillary 1st premolar and 2nd molar are formed as abutments was manufactured and scanned by using a laser scanner. A ten units of zirconia single copings were manufactured for maxillary 1st premolar and 2nd molar, respectively and the same number of 3-unit FPDs were manufactured. For the measurements of fitness, the manufactured silicone replicas were divided into four parts and the fitness were measured by digital microscope at measurement points (P1, P2, P3, P4 and P5) of each plane. The measured gaps were classified into three categories: marginal gap (MG, P1), axial gap (AG, average of P2 and P3), occlusal gap (OG, average of P4 and P5). Results: The ranges of MG, AG and OG for single copings were 18.47 - 40.54 ${\mu}m$, 39.73 - 73.61 ${\mu}m$ and 116.90 - 134.69 ${\mu}m$, respectively. The ranges of MG, AG and OG for 3-unit FPDs were 45.95 - 87.44 ${\mu}m$, 23.78 - 57.00 ${\mu}m$ and 99.89 - 131.06 ${\mu}m$, respectively. Conclusion: The result of the study shows that the MGs for 3-unit FPDs were higher than those of single copings, though they are within the range of clinical acceptance, indicating that the use of more homogeneous zirconia block and modification of sintering processes are needed to ensure the prevention of increase of gap in 3-unit FPDs.

• Journal of Conservation Science
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• v.31 no.1
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• pp.21-27
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• 2015

The Phoenix-shaped Glass Ewer, which is No. 193 National Treasure, was seriously damaged by a unique form of green glass pieces when excavated among a number of burial accessories of Hwangnamdaechong known to have been formed in the 5th century. While it has long been exhibited at the National Museum of Korea since its treatment for conservation treatment at conservation science laboratory in 1984, the existing adhesive materials seriously deteriorated for the 30 years, and the condition was quite unstable. The epoxy resin used as a restorative materials turned yellowing due to the light and heat so much that it was no longer able to exhibit it in a stable and effective manner. As a result, a re-treatment for conservation was conducted lately. This study focuses on the three pieces of Gold wires used to carefully wrap up the handle of the Phoenix-shaped Glass Ewer broken into three pieces, which has not been studied so far. As for the analysis method for Gold wires, SEM-EDS and Stereo Microscope were used for nondestructive analysis. First of all, the result of the SEM-EDS analysis shows that the composition was Au 91.9 wt.%-Au 92.8 w.t% and Ag 5.9 wt.%-Ag 6.5 wt.%, which indicates that it was an alloy made of Au and Ag. The production technique of Gold wires was also observed by means of optical microscopes. In general, Gold wires were manufactured by a drawing process in which a lump of gold was beaten or pulled out of a hole or by a process of twisting a gold plate. However, Gold wires separated from the handle of the Phoenix-shaped Glass Ewer did not involve any trace of twisting on the surface. Rather, fine vertical stripes were observed with the sections filled up. Hence, it is thought that this Ewer went through a drawing process and then was mended. As a result, no certain relation with the golden mending material used for the Phoenix-shaped Glass Ewer was verified. The findings above indicate that most of the existing researches on Gold wires recognized them, not as separate remains, but merely as a component of other golden remains. Thus, there has been little systematic study on the manufacturing techniques of Gold wires. The future study on Gold wires may verify the correlation between the Gold wires used to fix the handle of the Phoenix-shaped Glass Ewer, which is examined in this study, with that of golden remains in the Silla era.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.8
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• pp.501-507
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• 2017

A unimorph piezoelectric cantilever generator with an interdigitated electrode (IDE) was developed for vibration energy harvester applications driven in the longitudinal mode. Hard lead zirconate titanate (PZT) ceramic with a high $Q_m$ of 1,280 was used as the piezoelectric active material. Ten PZT sheets produced by tape casting were laminated and co-fired with an Ag/Pd IDE at $1,050^{\circ}C$ for 2 h. The approximately $280{\mu}m$-thick co-fired PZT laminate with the IDE was attached to a stainless steel substrate with an adhesive epoxy for the fabrication of an IDE unimorph cantilever. Its energy harvesting characteristics were evaluated: an output power of $1.1{\mu}W$ at 120 Hz across the resistive load of $700k{\Omega}$ was obtained, corresponding to a normalized power factor of $4.1{\mu}W/(G^2{\cdot}cm^3)$.