• Progress in Superconductivity
• /
• v.4 no.2
• /
• pp.180-183
• /
• 2003

We evaluated the effect of alloying-element additions to Ag sheath on thermal conductivity of Bi-2223 superconductor tapes. In order to evaluate the effect of sheath alloys and their configuration on the properties of tape, various combinations of Ag and Ag alloys were selected as inner and outer sheath. Thermal conductivity of the tapes was measured by using thermal integral method at 10∼120 K. It is observed that the presence of alloying-elements such as Mg, Sb, and Au in Ag sheath results in decreased thermal conductivity at low temperature. Specifically, the thermal conductivity of AgMg, AgSb, and AgAu at 40 K were 411.4, 142.3, and 109.7 W/(m·K), respectively, which is about 2∼9 times lower than that of Ag (1004.6 W/(m·K)). In addition, the thermal conductivity of alloy-sheathed tape was significantly dependent on their values of constituent sheath materials.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.7
• /
• pp.627-633
• /
• 2003

The effects of alloying-element additions to Ag sheath on thermal conductivity and mechanical properties of Bi-2223 superconductor tapes have been evaluated. In order to evaluate the effects of sheath alloys and their configuration on the properties of tape, various combinations of Ag and Ag alloys were selected as the inner and outer sheath. Thermal conductivity of the tapes was evaluated by using thermal integral method at 10 ∼120 K. It was observed that the addition of Mg, Sb, and Au to Ag sheath significantly decreased the thermal conductivity at low temperature probably due to the alloying effect. Specifically, the thermal conductivity of AgMg, AgSb, and AgAu at 40 K were 411.4, 142.3, and 109.7 W/(m·K), respectly, which is about 2∼9 times lower than that of Ag (1004.6 W/(m·K)). In addition, the thermal conductivity of alloy-sheathed tape was significantly dependent on their thermal conductivities of constituent sheath materials. The mechanical properties of alloy-sheathed tapes were also evaluated. Yield strength and tensile strength were improved but workability decreased for alloy-sheathed tapes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.1
• /
• pp.86-91
• /
• 2007

Contact material is widely used as electrical parts. Ag-CdO has a good wear resistance and stable contact resistance. But the disadvantages of Ag-Cd alloy are coarse Cd oxides and harmful metal, Cd. Then Ag-Sn alloy that has stable and fine Sn oxide at high temperature has been developed. In order to investigate the effect of Te additional that affects the formation of the oxide layer on the surface and the formation of oxide in matrix Ag, we studied the microstructures and properties of Ag-Sn-In(-Te) material fabricated by rapid solidification process. The experimental procedure were melting using high frequency induction, melt spinning, and internal oxidation. Specimens were examined and analyzed by Transmission electron microscopy(TEM), energy dispersive X-ray spectroscopy(EDS) and Vickers hardness. As a result, internal oxidation was completed even at $600^{\circ}C$. Te forms coarse $In_{2}TeO_{6}$ phase and makes fine and well dispersed $SnO_{2}$ Phase. 0.3 wt% Te shows favorable properties.

• Journal of the Korean institute of surface engineering
• /
• v.54 no.2
• /
• pp.71-76
• /
• 2021

Ag925, silver with added copper, is popular alloy due to its low price. However, it has a difficult to use because of the low corrosion resistance. In various alloys, neodymium (Nd) works as an element to improve corrosion resistance by reacting with interstitial elements in the alloy. When 1.5 wt. % Neodymium was added to Ag925, the potential on the activated polarization in a potentiodynamic polarization test was increased from -0.15 V to -0.05 V. Ag925 with added neodymium showed the passivation after activation polarization. But When the potential increased around 50 mV, the current density is increased to 3 × 10-3. Ag925 with the 1.5 wt. % Nd had the low corrosion rate.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.63 no.8
• /
• pp.1070-1074
• /
• 2014

With the development of the electronics industry and widespread supply of many different electrical appliances, the factors of the electrical fires are also diversified. For this reason, the fuse, safety-critical component, needs accurate and stable operating characteristics for preventing various fire factor, and also needs various operating characteristics. Especially when the all electrical resistance are dropped by internal short of circuit, high current inrushes and makes the fire. In order to prevent this, very fast acting fuses should be applied. However, existing very fast acting characteristics fuse has less wire dimension of element Ag100% metal than that of fast acting fuse, and it is made of plating with low melting point metals, so it satisfy very fast acting but it can't satisfy durability and safety. For this reason, in this study, through the analyzing fusing characteristics of Ag-Cu alloy composition, the new alloy composition, which implement to very fast acting fuse without decrease of fuse elements dimension, is suggested. And this study classify the operating characteristics changes, a resistance change, and the rated current of the fuse in the overall composition change of Ag-Cu alloying. and it can be utilized for designing fuse.

• Journal of Biomedical Engineering Research
• /
• v.15 no.4
• /
• pp.389-394
• /
• 1994

The age-hardening behavior and the structural changes in a commercial dental Au-Ag-Cu-Pd alloy were investigated by means of hardness test, optical and scanning electron microscopic observation, energy dispersive spectroscopy and X-ray diffraction study. The drastic reduction in hardness by prolonged aging occurred after a rapid increase in hardness at the initial stage by the isothermal aging at $350^{\circ}C$. This softening was due to the broad precipitates formation of the lamellar structure which was composed of the f.c.t. AuCu I ordered f.c.t. phase containing Pd and the f.c.c. Ag-rich $\alpha$1 solid solution f.c.c.phase containing Au.

• Proceedings of the Korean Magnestics Society Conference
• /
• 1993.11a
• /
• pp.40-41
• /
• 1993

• Proceedings of the Korean Magnestics Society Conference
• /
• 1995.05a
• /
• pp.88-89
• /
• 1995

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.05b
• /
• pp.34-37
• /
• 2004

It is well known that Ag-CdO alloy for electrical contactor has been widely used in weak or middle electric current field. But it is necessary to decrease Cd contents without decrease of contactor property because Cd is harmful to human body. The present work has been carried out to investigate effects of Mm (misch metal) addition on the property of Ag-CdO alloy for electrical contactor. As the results of present works, hardness and strength was improved and arc resistance was improved, also, in spite of decrease Cd contents by the Mm addition. It was estimated that Ag-oxide particle was refined by Mm addition.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.05a
• /
• pp.183-188
• /
• 2002

With the contact pad consisted of $0.5{\mu}{\textrm}{m}$ $Au/5{\mu}{\textrm}{m}$ Ni/Cu layers on a conventional ball grid array(BGA) substrate, metallurgical reaction properties between the pad and In-15(wt.%)Pb-5Ag solder alloy were studied after reflow and solid aging. In as-reflow condition, thin AuIn$_2$or Ni$_{28}$In$_{72}$ intermetallic layer was formed at the solder/pad interface according to reflow time. Dissolution of the Au layer into the molten solder was remarkably limited in comparison with eutectic Sn-37Pb alloy. After solid aging of 300 hrs, thickness of In-Ni layer increased to about $2{\mu}{\textrm}{m}$ in the both as-reflow case. It was observed that In atoms diffuse through the AuIn$_2$phase to react with underlaying Ni layer. The metallurgical reaction properties between In-l5Pb-7Ag alloy and Au/Ni surface finish were analysed to result in suppression of Au-embrittlement in the solder joints.