• Journal of Mechanical Science and Technology
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• v.16 no.9
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• pp.1078-1083
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• 2002

Ceramics are significantly used in many industrial applications due to their excellent mechanical and thermal properties such as high temperature strength, low density, high hardness, low thermal expansion, and good corrosion resistive properties, while their disadvantages are brittleness, poor formability and high manufacturing cost. To combine advantages of ceramics with those of metals, they are often used together as one composite component, which necessiates reliable joining methods between metal and ceramic. Direct brazing using an active filler metal has been found to be a reliable and simple technique, producing strong and reliable joints. In this study, the fracture characteristics of Si$_3$N$_4$ ceramic joined to ANSI 304L stainless steel with a Ti-Ag-Cu filler and a Cu (0.25-0.3 mm) interlayer are investigated as a function of strain rate and temperature. In order to evaluate a local strain a couple of strain gages are pasted at the ceramic and metal sides near joint interface. As a result the 4-point bending strength and the deflection of interlayer increased at room temperature with increasing strain rate. However bending strength decreased with temperature while deflection of interlayer was almost same. The fracture shapes were classified into three groups ; cracks grow into the metal-brazing filler line, the ceramic-brazing filler line or the ceramic inside.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.4
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• pp.327-332
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• 2019

Recently, inverter control systems have attracted immense attention to increase the energy efficiency. However, such systems use repeated on/off high currents for linear operation control, instead of the prevalent step variable current control method. Hence, there arise concerns of personal and property damage, especially due to the durability, explosive characteristics, and operating speed of the fuse, which is responsible for safety and is one of the internal components using current control. Therefore, in this paper, we propose an IEC60127-4 SMD sub-miniature fuse, consisting of Ag-Cu alloys and ceramic powder for arc soothing. The IEC60127-4 SMD sub-miniature fuse has high durability and cut-off capacity, and operates safely in dangerous circumstances caused by the inverter control system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Progress in Superconductivity
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• v.3 no.1
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• pp.130-133
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• 2001

A multifilamentary Bi-2223 HTS tape for superconducting power applications was studied through the fabrication of 250-meter long tapes by the PIT(powder in tube) process. To fabricate continuous long wire, a drawing machine, a two-drum bull block and a rolled tape winding machine were developed. Especially, 250-meter long tapes were heat treated in the shape of pancake coil to reduce the heat affect zone and to achieve the high critical current. Engineering critical current density was improved through both the enhancements of critical current density by control of thermal process and the increase of filling factor by using thin Ag alloy sheath tubes less than 1.5 mm in thickness. We have made successfully 250-meter long 37 filamentary tapes with high filling factor up to 31 % employing the modified drawing and rolling technique. The critical current of 250-meter long tapes with pancake coil type was measured by transport method at self-field up to 250 gauss of center field. The measured values, based on the transport critical current at self-field, $I_{c}$ -B characteristics and magnetic field analysis, are 34 A of I$_{c}$ and 4.0 $kA/\textrm{cm}^2$ of $J_{e}$ at 250 m, 77 K, and 0 T. We also have achieved the 56 A of I$_{c}$ and 7.0 $0 kA/\textrm{cm}^2$ of$ J_{e}$ in short tapes at 77K, self-field, and 1$mutextrm{V}$/cm.

• Conservation Science in Museum
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• v.16
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• pp.4-13
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• 2015

In most gold objects crafted using the granulation technique that have been thus far discovered in the Korean Peninsula, granules were joined using a soldering alloy of gold and silver. However, it was recently revealed through SEM-EDS analysis performed on the ornamented dagger sheath from Gyerim-ro Tomb No.14 in Gyeongju that the gold granules were joined to the surface of this sheath using an entirely different technique. The gold granules on the Gyerim-ro dagger sheath are evenly sized and shaped, the surface has a dendritic texture. Dendritic textures are a characteristic feature of metal alloys, not observed in pure metals. As a matter of fact, the gold granules were made of a ternary alloy of 77wt% Au, 18wt% Ag and 4wt% Cu. Due to this component, the alloy has a melting point below 1000℃ (approximately 980℃), which is significantly lower than 1064℃, the melting temperature of pure gold. This makes it possible to join the gold granules directly to the surface of the sheath by briefly heating them to high temperature, without the use of soldering or any other media. When examined through SEM image, the surface of the sheath showed no traces of soldering, it suggests that the granules were joined through unaided fusion.

• Economic and Environmental Geology
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• v.24 no.2
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• pp.151-165
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• 1991

The Au-Ag deposits of the Euiseong area occurred in quartz veins which filled fissures in Cretaceous sedimentary and volcanic rocks. These ore veins can be classified in two types of deposits based on metallic mineral assemblages as follow: a pyrite type gold-silver deposit (Hoedong mine), characterized by Cu sulfides with Au-Ag alloy, and a Sb-rich silver deposit (Keumdongdo mine), characterized by base metal with Ag-bearing sulfosalts. Mineralogic and fluid inclusion evidences suggest that the ore minerals of these deposits was deposited from initial high temperatures (near $350^{\circ}C$) to later lower temperatures ($200^{\circ}C$) with moderate salinity fluids ranging from 5.8 to 3.8 eq. wt. % NaCl. The gold-silver mineralization of the Hoedong mine occurred at temperatures between 300 and $200^{\circ}C$ from fluids with log $f_{s_2}$ of -10 ~ -16 atm. The antimony - silver mineralization of the Keumdongdo mine were deposited at the higher temperatures (350 to $250^{\circ}C$) and $f_{S_2}$ (-10 ~ -13 atm) than gold mineralization of the Hoedong mine. The calculated log f02 of fluids at $250^{\circ}C$ in two deposits are -32 to -34 atm and -36.5 to -38.5 atm, respectively. Boiling evidences indicate that the ore mineralization of the Hoedong mine occurred at more shallow depth (0.5km) than that (1km) of the Keumdongdo mine. The above differences of depositional environments between two deposits caused the compositional changes of ore minerals such as electrum and sphalerite.

• Korean Journal of Materials Research
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• v.33 no.5
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• pp.214-221
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• 2023

As a filler metal for lowering the melting point of Ag, many alloy metal candidates have emerged, such as cadmium, with zinc, manganese, nickel, and titanium as active metals. However, since cadmium is known to be harmful to the human body, Cd-free filler metals are now mainly used. Still, no study has been conducted comparing the characteristics of joints prepared with and without cadmium. In addition, studies have yet to be conducted comparing the typical characteristics of brazing filler metals with special structures, and the joint characteristics of brazing filler metals with available frames. In this study, the characteristics of junctions of silver-based intercalation metals were compared based on the type of filler metal additives, using a special structure, a filler metal sandwich structure, to protect the internal base metal. The general filler metal was compared using the structure, and the thickness of the filler metal according to the thickness was reached. A comparison of the characteristics of the junction was conducted to identify the characteristics of an intersection of silver-based brazing filler metal and the effect on joint strength. Each filler metal's collective tensile strength was measured, and the relationship between joint characteristics and tensile joint strength was explored. The junction was estimated through micro strength measurement, contact angle measurement with the base metal when the filler metal was melted, XRD image observation, composition analysis for each phase through SEM-EDS, and microstructure phase acquisition.

• Restorative Dentistry and Endodontics
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• v.14 no.1
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• pp.199-204
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• 1989

The purpose of this study was to observe the anodic polarization curve from 4 kinds of low copper amalgam (Fine cut alloy, Spheralloy, Aristalloy and Amalcap) and 4 kinds of high copper amalgam (Dispersalloy, Sybraloy Orosphere and Tytin) obtained by using the potentiostat. The specimen made as the direction of manufacturer was stored at room temperature for about 7 days. The standard surface preparation was routinely carried out. The 0.9% saline solution was used as electrolyte in pH 6.8-7.0 at $37^{\circ}C$. The open circuit potential was determined after 30 minutes' immersion of specimen. The scan rate was 1mV/sec and the surface area of amalgam exposed to the solution was 0.785$cm^2$ for each specimen. All potentials reported are with respect to Ag/AgCl eelctrode. The following results were obtained. 1. The corrosion potential of high copper amalgams was higher than one of low copper amalgams, and the current density of high copper amalgam was lower than one of low copper amalgams. 2. The low copper amalgams had the similar pattern of polarization curve, but the high copper amalgams had the different pattern one another. 3. The polarization curve of Orosphere amalgam which is the admixed type was similar to one of low copper amalgam.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.196-196
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• 2016

치과나 기공소로부터 높은 원가로 인한 재료선택에 어려움을 겪고 있어 귀금속 금합금의 물성을 가질 수 있도록 하면서 가격급등으로 인한 문제 해결하기 위한 비귀금속 합금으로 대체가 필요하기에 이에 따른 연구가 이루어져 국산 제품의 상품화를 위해 파라듐을 이용하여 적합한 새로운 합금을 개발하는 것이 필요하다. 치과용 골드합금은 미국치과의사 협회의 구정에 의하면 1형부터 4형까지 분류하고 있으며 3형에 해당하는 강도와 기계적인 특성을 갖도록 파라듐으로 대체하는 연구가 진행중이거나 시판되고 있다. 따라서 본 연구에서는 2형, 3형 및 4형을 대체가능하도록 팔라듐을 기반으로 한 새로운 합금을 설계하고 합금의 성분원 소인 Au(1~5), Pd(20~25), Ag(70~75), In(1.5) 및 Zn(2)등으로 조성을 변화시켜 측량 후 합금을 제조하기 위하여 아르곤 분위기하의 진공아크용해로를 이용하여 용해하였다. 정량된 금속을 진공아크 용해로에 장입하고 용해는 균질한 합금이 되도록 최소한 6회 이상 용융을 실시하며 합금성분의 손실이 발행하지 않도록 보정을 하였다. 합금의 미세조직 관찰을 위하여 샘플을 고속 다이아몬드 정밀 절단기(Acculom-5, STRUERS, Denmark)를 이용하여 절단한 후 2000 grit의 Sic 연마지에서 단계적으로 $0.3{\mu}m$ 알루미나 분말까지 연마한 후 초음파 세척을 하였다. 준비한 시편은 KCN과 $(NH_4)_2S_2O_8$을 1:1로 혼합한 부식액으로 에칭한 후 OM과 SEM을 이용하여 조직을 관찰하였으며 각 샘플의 성분변화는 EDS 분석을 통해 확인하고 결정구조는 XRD를 사용하여 분석하였다. 경도시험은 비커스경도시험기를 이용하여 5kg의 하중을 30초간 작동시켜 압흔을 연결된 micron으로 평균값을 측정하였다. 각 시편의 부식거동은 POTENTIOSTAT(Model PARSTAT 2273, EG&G, USA)을 이용하여 구강 내환경화 유사한 $36.5{\pm}1^{\circ}C$의 0.9% NaCl에서 실시하였다. 인가전위는 -1500mV에서 1000mV까지 1.67 mV/min의 주사속도로 인가하여 시험을 수행하였으며 분극곡선으로부터 부식전위와 부식전류밀도 및 부동태영역의 전류밀도로 금속의 용출거동을 조사하였으며 부식이 끝난 시편은 FE-SEM과 EDS를 사용하여 조사하였다. 기계적인 특성은 Pd-Ag에 3wt%의 Au를 첨가한 합금이 Pd-Ag에 1.5wt%합금을 첨가한 경우에 비하여 기계적인 특성이 증가하고 내식성이 크게 증가하였다. 이들 합금에 Cu를 11wt%를 첨가한 경우는 비커스경도가 200이상으로 높게 나타났지만 내식성이 크게 감소하였다.

• 보존과학연구
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• s.27
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• pp.129-143
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• 2006

This report is on a scientific investigation of 3 pairs of 금제태환이식 which were excavated from 황남대총 납분. 태환 is a main part of 태환이식 and it could be classified with 4 types in how to produce, especially how many the golden petal was used. In this investigation, they,3 pairs of 금제태환이식 from 황남대총 남분, were in 3 of 4 types and also I could find that this result was not on the technical progress but on the ingredient of metal. Also, In the result of ingredient assay, I could find that although they were in one pair of 태환 one piece was made in gold and silver alloy and the other piece was made in 99.5 percent of pure Ag with gold amalgam plating. And the another pair was getting red from others because of making in 33percent of Ag and 77 percent of gold, high Ag content. And All pairs of 태환 have a small quantity of Copper. As above, although they are one pair they have the difference of how to produce and the difference of volume and ingredient content, it means that these pairs of 태환 from 황남대총 남분 were made in pressure of time. From now on, if we investigate the ingredient and how to produce of 태환이식 in the local comparative analysis, namely natural science method, we can find out the metal art technique and the social aspect of the ancient times as not analogical inference but scientific basis.