• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.150.2-150.2
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• 2017

This research was conducted to investigate in detail the effect of $PO_4{^{3-}}$, $CO_3{^{2-}}$ and $F^-$ anions on the electrochemical properties of the thin air-formed oxide film-covered AZ31 Mg alloy. In this work, native air-formed oxide films on AZ31 Mg alloy samples were prepared by knife-abrading method and the changes in the electrochemical properties of the air-formed oxide film were investigated in electrolytes containing 0.01 M, 0.05 M and 0.1 M of $PO_4{^{3-}}$, $CO_3{^{2-}}$ and $F^-$ anions. It was observed that the trend of open circuit potential (OCP) transients changed only in the solution containing $PO_4{^{3-}}$ ions. The Nyquist plots obtained from electrochemical impedance spectroscopy (EIS) showed that the resistance of the new surface films formed in fluoride ion containing bath increased with the increase in concentration of fluoride ions but the resistance of surface films formed in carbonate ion containing bath decreased with the increase in concentration of carbonate ions. The potentiodynamic polarization curves illustrated that under anodic polarization, there was growth of porous passive layer only in fluoride ion containing solution while the surface layer formed in phosphate and carbonate ion containing solutions lost its passivity at high anodic potential of $2.5V_{Ag/AgCl}$.

• Journal of the Korean Magnetics Society
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• v.10 no.6
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• pp.280-294
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• 2000

[(300nm)Ta/(500nm)NdFeB/(300nm)Ta] thin films were deposited at 5 mTorr Ag gas pressure by RF-DC magnetron sputtering, and their magnetic properties were investigated. The [Ta/NdFeB/Ta] films deposited on heated Si substrates showed high perpendicular anisotropy and excellent hard magnetic properties. The films sputtered at tile substrate temperature of T$\sub$s/=650$^{\circ}C$ and 700$^{\circ}C$ showed (BH)$\sub$max/=20 MGOe and $\sub$i/H$\sub$c/= 18.9 kOe along the perpendicular direction to the film plane, respectively.

• Progress in Superconductivity and Cryogenics
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• v.14 no.1
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• pp.4-7
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• 2012

Coated conductors have been developed to increase piece length and critical current for electric power applications. Otherwise, Many efforts were carried out to reduce AC loss of coated conductor for AC applications. Twisting and cabling processes are effective to reduce AC loss but, these processes can not be applied for tape shaped coated conductor. It is inevitable to have thin rectangular shape because coated conductor is fabricated by thin film deposition process on metal substrate. In this study, round shape superconducting wire was first fabricated using coated conductors. First of all, Ag coated conductor was used. coated conductor was slitted to several wires with narrow width below 1mm. 12ea slitted wires were parallel stacked on top of another until making up the square cross-section. The bundle of coated conductors was heat treated to stick on each other by diffusion bonding and then copper plated to make round shape wire. Critical current of round wire was measured 185A at 77K, self field.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.193-193
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• 2012

In thin film silicon solar cells, p-i-n structure is adopted instead of p/n junction structure as in wafer-based Si solar cells. PECVD is the most widely used thin film deposition process for a-Si:H or ${\mu}c$-Si:H solar cells. Single-chamber PECVD system for a-Si:H solar cell manufacturing has the advantage of lower initial investment and maintenance cost for the equipment. However, in single-chamber PECVD system, doped and intrinsic layers are deposited in one plasma chamber, which inevitably impedes sharp dopant profiles at the interfaces due to the contamination from previous deposition process. The cross-contamination between layers is a serious drawback of single-chamber PECVD system. In this study, a new plasma process to solve the cross-contamination problem in a single-chamber PECVD system was suggested. In order to remove the deposited B inside of the plasma chamber during p-layer deposition, a high RF power was applied right after p-layer deposition with SiH4 gas off, which is then followed by i-layer, n-layer, and Ag top-electrode deposition without vacuum break. In addition to the p-i interface control, various interface control techniques such as FTO-glass pre-annealing in O2 environment to further reduce sheet resistance of FTO-glass, thin layer of TiO2 deposition to prevent H2 plasma reduction of FTO layer, and hydrogen plasma treatment prior to n-layer deposition, etc. were developed. The best initial solar cell efficiency using single-chamber PECVD system of 10.5% for test cell area of 0.2 $cm^2$ could be achieved by adopting various interface control methods.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.133.2-133.2
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• 2016

차세대 디스플레이로 유연하고 투명한 기능들이 요구되면서 Indium Tin Oxide(ITO)를 대체하기 위한 투명전극 개발 연구가 많이 수행되고 있다. ITO는 높은 투과도와 낮은 저항으로 현재 가장 많이 활용되고 있는 투명전극 소재이지만 유연성이 떨어져 유연 터치 패널 소재로 활용하기 어렵다. 이러한 문제 해결을 위해 ITO 대체 물질로 CNT, Graphene, Metal mesh, Ag nano wire, 전도성 고분자 등의 차세대 투명 전극 소재가 대두되고 있다. 본 연구에서는 메탈 메쉬 전극 소재로 사용하기 위해 Cu 박막 증착 시 플라즈마 표면처리를 통해 밀착력 및 저항을 개선하였다. Cu 금속 박막의 양산화를 위한 공정으로 자체 제작한 Linear Ion Source(LIS)가 부착된 roll to roll 시스템을 적용하여 플라즈마 전처리 공정 및 Ni buffer layer 도입 이후 Cu 박막을 형성하였다. 그 결과 PET 기판과 Cu 박막 사이의 밀착력을 0 degree에서 5 degree까지 향상시킬 수 있었고, 플라즈마 표면처리를 시행함으로써 저항 또한 감소되는 결과를 얻을 수 있었다. 본 연구를 통해서 폴리머 기판 소재에 in-situ로 표면처리 및 Cu 금속 박막을 증착함으로써 금속 박막의 밀착력 및 전기적 특성이 향상되는 공정 기술을 개발하였다.

• Journal of the Korean Institute of Telematics and Electronics
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• v.19 no.5
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• pp.5-11
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• 1982

The dielectric slab waveguide is fabricated on the slide glass or oxidized silicon wafer, by spin coating polyurethane, epoxy or photoresist, and the phenomenon of dielectric waveguiding is oboerved. Using the fact that the refractive index of K.P.R. is larger than that of polyurethane, thin film prism with two layered structure is fabricated, and the refraction of light is observed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.384-385
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• 2006

We studied about conductive pastes of the source-drain contacts for OTFTs(organic thin-film transistors) fabricated by direct printing(screen printing) method. We used Ag and conductive carbon black powder as the conductive fillers of pastes. The conductive pastes were manufactured by various dispersing agents and dispersing conditions and source-drain contacts with $100{\mu}m$ of channel length were fabricated. We could obtain the OTFTs which exhibited different field-effect behaviors over a range of source-dram and gate voltages depending on a kind of conductive fillers used conductive pastes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.155-158
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• 1998

MLS capacitor with lipid ultra thin films were deposited by Langmuir-Blodgett (LB) method on the sillicon wafer. The current versus voltage and capacitance versus voltage relationships are depend on the applied voltage, electrode area and electrode materials. LB films deposited were made of L-$\alpha$-DLPC, the 1 layer's thickness of 35$\AA$ was measured by ellipsometer. And MLS capacitor with different electrode materials, the work function of these materials was investigated to increase the leakage current. The result indicated the lower leakage current and very high saturation value of capacitance was reached within 700-800 pF when the two electrode was Ag. And $\varepsilon$$_1$, $\varepsilon$$_2$ versus photon energy showed good film formation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.41-44
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• 1998

Dual mode resonators were fabricated using high temperature superconductor. The deposited material was $Y_1Ba_2Cu_3O_{7-x}$(YBCO) on MgO(100) substrate using pulsed laser deposition. Dual mode resonators were patterned by standard photolithography process and wet etching. At the back-side of the substrate, the ground plane with the metal layer of Ti and Ag was fabricated. The transition temperatures of YBCO films were 85-88 K, and network analyzer was used for testing the performance of the resonators. The input/output feedline angles of each resonator were $60^{\circ}$and $100^{\circ}$. The resonant frequency of resonators was 10 GHz. In this paper, dual mode resonator was fabricated for the application of satellite communication.