• 한국세라믹학회지
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• 제42권6호
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• pp.377-383
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• 2005

Generally, the strength achieved of glass-ceramics is higher as is the fracture toughness, as compared with the original glass. This improvement is due to the microstructure consisting of very small crystals. In this study, Ag-doped $45SiO_2-24CaO-24Na_2O-4P_2O_5$ glasses were irradiated to strengthen by the crystallization using Femto second laser Pulses. Through the UV/VIS spectroscope, XRD, Nano-indenter and SEM etc., heat-treated and irradiation of laser pulses without heat-treated samples were analyzed. Two kinds of samples, heat-treated and laser irradiated without heat-treated samples, showed the peaks in the same wavelength near 360 nm. Especially, samples irradiated by 140 mW laser with XYZ stage having at the rate of 100$\~$l000 $\mu$m/s had the largest absorption peak among them, and heat-treated samples was shown lower absorption range than over 90 mW laser irradiated samples. Moreover, samples irradiated by laser had higher values ($4.4\~4.56{\times}10^{-3}(Pa)$) of elastic modulus which related with strength of glass than values of heat-treated samples and these are 1.2$\~$1 .5 times higher values than them of mother glass.

• Current Photovoltaic Research
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• 제2권4호
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• pp.173-176
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• 2014

We have investigated the seed layer formation of front side contact using the inkjet printing process. Conductive silver ink was printed on textured Si wafers with 80 nm thick $SiN_x$ anti reflection coating (ARC) layers and thickened by light induced plating (LIP). The inkjet printable sliver inks were specifically formulated for inkjet printing on these substrates. Also, a novel method to prepare nano-sized glass frits by the sol-gel process with particle sizes around 5 nm is presented. Furthermore, dispersion stability of the formulated ink was measured using a Turbiscan. By implementing these glass frits, it was found that a continuous and uniform seed layer with a line width of $40{\mu}m$ could be formed by a inkjet printing process. We also investigated the contact resistance between the front contact and emitter using the transfer length model (TLM). On an emitter with the sheet resistance of $60{\Omega}/sq$, a specific contact resistance (${\rho}_c$) below $10m{\Omega}{\cdot}cm^2$ could be achieved at a peak firing temperature around $700^{\circ}C$. In addition, the correlation between the contact resistance and interface microstructures were studied using scanning electron microscopy (SEM). We found that the added glass particles act as a very effective fire through agent, and Ag crystallites are formed along the interface glass layer.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.53-53
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• 2011

As the dimension of Cu interconnects has continued to reduce, its resistivity is expected to increase at the nanoscale due to increased surface and grain boundary scattering of electrons. To suppress increase of the resistivity in nanoscale interconnects, alloying Cu with other metal elements such as Al, Mn, and Ag is being considered to increase the mean free path of the drifting electrons. The formation of Al alloy with a slight amount of Cu broadly studied in the past. The study of Cu alloy including a very small Al fraction, by contrast, recently began. The formation of Cu-Al alloy is limited in wet chemical bath and was mainly conducted for fundamental studies by sputtering or evaporation system. However, these deposition methods have a limitation in production environment due to poor step coverage in nanoscale Cu metallization. In this work, gap-filling of Cu-Al alloy was conducted by cyclic MOCVD (metal organic chemical vapor deposition), followed by thermal annealing for alloying, which prevented an unwanted chemical reaction between Cu and Al precursors. To achieve filling the Cu-Al alloy into sub-100nm trench without overhang and void formation, furthermore, hydrogen plasma pretreatment of the trench pattern with Ru barrier layer was conducted in order to suppress of Cu nucleation and growth near the entrance area of the nano-scale trench by minimizing adsorption of metal precursors. As a result, superconformal gap-fill of Cu-Al alloy could be achieved successfully in the high aspect ration nanoscale trenches. Examined morphology, microstructure, chemical composition, and electrical properties of superfilled Cu-Al alloy will be discussed in detail.

• Advances in nano research
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• 제15권4호
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• pp.355-366
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• 2023

Biological corrosion, a crucial aspect of metal degradation, has received limited attention despite its significance. It involves the deterioration of metals due to corrosion processes influenced by living organisms, including bacteria. Soil represents a substantial threat to pipeline corrosion as it contains chemical and microbial factors that cause severe damage to water, oil, and gas transmission projects. To combat fouling and corrosion, corrosion inhibitors are commonly used; however, their production often involves expensive and hazardous chemicals. Consequently, researchers are exploring natural and eco-friendly alternatives, specifically nano-sized products, as potent corrosion inhibitors. This study aims to environmentally synthesize silver nanoparticles using an extract from Lagoecia cuminoides L and evaluate their effectiveness in preventing biological corrosion of buried pipes in soil. The optimal experimental conditions were determined as follows: a volume of 4 ml for the extract, a volume of 4 ml for silver nitrate (AgNO3), pH 9, a duration of 60 minutes, and a temperature of 60 degrees Celsius. Analysis using transmission electron microscopy confirmed the formation of nanoparticles with an average size of approximately 28 nm, while X-ray diffraction patterns exhibited suitable peak intensities. By employing the Scherer equation, the average particle size was estimated to be around 30 nm. Furthermore, antibacterial studies revealed the potent antibacterial activity of the synthesized silver nanoparticles against both aerobic and anaerobic bacteria. This property effectively mitigates the biological corrosion caused by bacteria in steel pipes buried in soil.

• 마이크로전자및패키징학회지
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• 제15권4호
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• pp.77-86
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• 2008

본 연구에서는 유연솔더인 63Sn37Pb와 무연 솔더인 95.5Sn4.0Ag0.5Cu와 97Sn2.5Ag0.5Cu BGA(Ball Grid Array) 패키지를 인쇄회로기판(Printed Circuit Board, PCB)에 위치에 따라 장착하고 보드레벨의 낙하시험(Board Level Drop Test)을 실시하여 충격에 대한 유 무연 솔더의 특성을 분석하였고 4점굽힘시험(board Level 4-point Bending Test)을 실시하여 굽힘에 대한 솔더볼의 기계적 저항특성을 분석하였다. 또한 유한요소법(Finite Element Modeling, FEM)을 이용해 낙하시험과 4점굽힘시험에서 솔더 조인트에 미치는 응력과 변형률을 해석하였으며, 시험 설계 시에 솔더 조인트의 응력변화에 영향을 미칠 수 있는 변수를 고려하여 해석하고 결과를 비교 분석하였다. 낙하시험과 4점굽힘시험에서 모두 무연솔더는 유연솔더보다 2배 이상 높은 신뢰성을 보였으며, PCB의 중앙에 위치한 패키지는 외각에 위치한 패키지 보다 매우 낮은 신뢰성을 보였다. 유한요소법을 통해 해석한 결과 최외각 솔더에서 가장 큰 응력이 발생하였고, 솔더의 조성과, 시험설계변수에 의해 응력의 발생 정도가 다름을 나타내었다.

• 한국전기전자재료학회논문지
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• 제36권5호
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• pp.454-462
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• 2023

금속 나노 입자의 플래시 램프 어닐링 공정은 빠른 가공 속도(밀리초 단위), 저온 공정, 롤투롤 공정과의 호환성 등 이유로 유연한 기판 위에 고성능 전극을 제조하기 위한 강력한 솔루션으로 제공되어 왔다. 그러나 금속 나노 입자[예를 들면, 금(Au), 은(Ag), 구리(Cu) 등]는 저온 공정을 위한 미세 금속 나노 입자(직경 10 nm 미만)의 제조가 어렵고, 고가이며, 잉크보관 및 플래시 램프 어닐링 과정에서 산화가 발생하는 등의 한계가 존재했다. 이러한 이유로 유기금속화합물 잉크는 금속 나노 입자를 대체할 수 있는 재료로서 저렴한 가격(기존 금속 나노 잉크 대비 1/100의 가격)과 저온 공정성, 높은 재료 안정성으로 인해 제안되었다. 하지만 이러한 장점에도 불구하고, 유기금속화합물의 플래시 램프 어닐링 처리를 통한 유연한 전극의 제조는 광범위하게 연구되지 않고 있다. 본 논문에서는 사전 경험 없이 은 유기금속화합물을 플래시 램프 어닐링하는 과정에서 발생할 수 있는 어려움을 최소화하기 위해 재료 매개변수와 플래시광 처리 매개변수(에너지 밀도, 펄스 지속시간 등)를 고려하여 유연 기판에 전극을 제조하기 위한 최적의 조건을 결정하는 방법을 실험적으로 가이드하고자 한다.

• 한국정밀공학회지
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• 제31권11호
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• pp.975-979
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• 2014

Transparent conductive films (TCF) with excellent electrical properties and high mechanical flexibility have been widely studied because of their potential for application in optoelectronic devices such as light-emitting diodes, paper displays and organic solar cells. In this paper, we report on low-resistance and high-transparent TCF for flexible device applications. To fabricate a high-resolution roll imprinted TCF, the following steps were performed: the design and manufacture of an electroforming stamp mold, the fabrication of high-resolution roll imprinted on flexible film, the manufacture of Ag-nano paste which was filled into patterned film using a doctor blade process. Also, we was demonstrated with the successful application(ITO free organic photovoltaic) of the developed flexible TCF.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.396-396
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• 2012

$TiO_2$ anatase nanotube arrays (NTAs) were grown by electrochemical anodization and followed annealing of Ti foil. Ethylene glycol/$NH_4F$-based organic electrolyte was used for electrolyte solution and using second anodization process to obtain free-standing NTAs. After obtaining NTAs, ITO film was deposited by sputtering process on bottom of NTAs. UV-curable NOA was used for attach free-standing NTAs on flexible plastic substrate (PEN). Solid state electrolyte (spiro-OMeTAD) was coated via spin-coating method on top of attached NTAs. Ag was deposited as a counter electrode. Under AM 1.5 simulated sunlight, optical characteristics of devices were investigated. In order to use flexible polymer substrate, processes have to be conducted at low temperature. In case of $TiO_2$ nano particles (NPs), however, crystallization of NPs at high temperature above $450^{\circ}C$ is required. Because NTAs were conducted high temperature annealing process before NTAs transfer to PEN, it is favorable for using PEN as flexible substrate. Fabricated flexible solid-state DSSCs make possible the preventing of liquid electrolyte corrosion and leakage, various application.

• 한국재료학회지
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• 제19권9호
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• pp.468-472
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• 2009

The silver nanofluids were synthesized by the pulsed wire evaporation (PWE) method in a liquid-gas mixture. The size and microstructure of nanoparticles in the deionized water were investigated by a particle size analyzer (PSA), transmission electron microscope (TEM), and scanning electron microscope (SEM). Also, the synthesized nanofluids were investigated in order to assess the stability of dispersion of nanofluid by the zetapotential analyzer and dispersion stability analyzer. The results showed that the spherical silver nanoparticle formed in the deionized water and mean particle size was about 50 nm. Also, when explosion times were in the range of 20$\sim$200 times, the absolute value of zeta potential was less than -27 mV and the dispersion stability characteristic of low concentration silver nanofluid was better than the high concentration silver nanofluid by turbiscan.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.148-148
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• 2016

디스플레이 시장이 rigid에서 flexible로 변화하기 시작하면서 유연 투명전극 소재에 대한 수요가 증가하고 있다. 투명전극으로 대표되는 Indium Tin Oxide(ITO)는 고투과 저저항의 장점을 가지지만 유연성이 떨어져 이를 대체 할 투명전극 소재로 Metal mesh, Ag nano-wire, CNT, Graphene, Conductive polymer 등에 대한 응용 연구가 활발히 진행되고 있다. 본 연구에서는 Metal mesh 용 Cu thin film 형성을 위해 플라즈마 표면처리 기술로 플라스틱 기판과 Cu 박막 사이의 밀착력을 향상시키고자 공정 연구를 수행하였다. 고품질의 Cu thin film 제작을 위해 양산용 roll to roll 장비를 이용하였고, 선형이온소스를 적용하여 플라즈마 표면처리를 수행하였다. 이후 마그네트론 스퍼터링을 통해 Ni buffer layer 및 Cu 박막 증착 공정을 in-situ로 진행하였다. 이러한 공정을 통해 제작한 Cu thin film의 밀착력을 평가하기 위해 cross cut test(ASTM D3359)를 수행하였다. 그 결과 플라스틱 기판과 Cu 금속 박막 사이의 밀착력이 0B에서 5B까지 향상된 것을 확인하였고, 플라즈마 표면처리 공정을 통해서 저항 또한 감소되는 결과를 얻을 수 있었다. 본 연구를 통해 polyethylene terephthalate(PET)뿐만 아니라 polyimide(PI) 기판 상에서도 플라즈마 표면처리를 통해 금속 박막의 밀착력이 향상되는 결과를 확인하였으며, flexible copper clad laminate (FCCL) 같은 유연 정보 소자 분야에 응용 가능할 것으로 기대된다.