• Title/Summary/Keyword: Ag and Cu thin film

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Na확산과 Ga첨가에 따른 동시진공증발법으로 제조된 CIGS 박막과 CdS/CIGS 태양전지의 특성 (Effects of Sodium and Gallium on Characteristics of CIGS Thin Films and CdS/CIGS Solar Cells by Co-evaporation Method)

  • 권세한;이정철;강기환;김석기;윤경훈;송진수;이두열;안병태
    • 태양에너지
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    • 제20권2호
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    • pp.43-54
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    • 2000
  • 동시 진공증발법을 이용하여 coming glass, soda-lime glass, Mo가 증착된 soda-lime glass 위에 $Cu(In_{1-x}Ga_x)Se_2$ 박막을 증착하였다. Soda-lime glass 위에서 제조된 $Cu(In_{0.5}Ga_{0.5})Se_2$ 박막의 전기비저항값과 정공농도는Cu/(In+Ga)비에 큰 영향을 받지 않았다. Soda-lime glass위에서의 $Cu(In_{1-x}Ga_x)Se_2$ 박막내부와 표면에는 Na이 검출되었고, 표면의 Na는 산소와 결합하고 있었으며, Cu가 부족한 조성에서 이차상이 형성되었다. Ga/(In+Ga)비가 증가할수록 $Cu(In_{1-x}Ga_x)Se_2$ 박막은 회절 peak들의 큰 회절각으로 이동, 초격자 peak등의 분리, 결정립 크기의 감소가 관찰되었다. $Cu_{0.91}(In_{1-x}Ga_x)Se_2$ 박막은 Ga/(In+Ga)비에 무관하게 전기적으로 p-type을 나타내었다. Ag/n-ZnO /i-Zno/CdS/$Cu_{0.91}(In_{0.7}Ga_{0.3})Se_2$/Mo/glass구조의 태양전지를 제조하였으며, 태양전지변환효율(Eff.) = 14.48%, 단락전류밀도(Jsc) = $34.88mA/cm^2$, 개방전압(Voc) =581.5 mV, 충실도(F.F) = 0.714을 나타내었다.

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The Materials Science of Chalcopyrite Materials for Solar Cell Applications

  • Rockett, Angus
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.53-53
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    • 2011
  • This paper describes results for surface and bulk characterization of the most promising thin film solar cell material for high performance devices, (Ag,Cu) (In,Ga) Se2 (ACIGS). This material in particular exhibits a range of exotic behaviors. The surface and general materials science of the material also has direct implications for the operation of solar cells based upon it. Some of the techniques and results described will include scanning probe (AFM, STM, KPFM) measurements of epitaxial films of different surface orientations, photoelectron spectroscopy and inverse photoemission, Auger electron spectroscopy, and more. Bulk measurements are included as support for the surface measurements such as cathodoluminescence imaging around grain boundaries and showing surface recombination effects, and transmission electron microscopy to verify the surface growth behaviors to be equilibrium rather than kinetic phenomena. The results show that the polar close packed surface of CIGS is the lowest energy surface by far. This surface is expected to be reconstructed to eliminate the surface charge. However, the AgInSe2 compound has yielded excellent atomic-resolution images of the surface with no evidence of surface reconstruction. Similar imaging of CuInSe2 has proven more difficult and no atomic resolution images have been obtained, although current imaging tunneling spectroscopy images show electronic structure variations on the atomic scale. A discussion of the reasons why this may be the case is given. The surface composition and grain boundary compositions match the bulk chemistry exactly in as-grow films. However, the deposition of the heterojunction forming the device alters this chemistry, leading to a strongly n-type surface. This also directly explains unpinning of the Fermi level and the operation of the resulting devices when heterojunctions are formed with the CIGS. These results are linked to device performance through simulation of the characteristic operating behaviors of the cells using models developed in my laboratory.

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Inorganic Printable Materials for Printed Electronics: TFT and Photovoltaic Application

  • 정선호;이병석;이지윤;서영희;김예나;;이재수;조예진;최영민;류병환
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.1.1-1.1
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    • 2011
  • Printed electronics based on the direct writing of solution processable functional materials have been of paramount interest and importance. In this talk, the synthesis of printable inorganic functional materials (conductors and semiconductors) for thin-film transistors (TFTs) and photovoltaic devices, device fabrication based on a printing technique, and specific characteristics of devices are presented. For printable conductor materials, Ag ink is designed to achieve the long-term dispersion stability and good adhesion property on a glass substrate, and Cu ink is sophisticatedly formulated to endow the oxidation stability in air and even aqueous solvent system. The both inks were successfully printed onto either polymer or glass substrate, exhibiting the superior conductivity comparable to that of bulk one. In addition, the organic thin-film transistor based on the printed metal source/drain electrode exhibits the electrical performance comparable to that of a transistor based on a vacuum deposited Au electrode. For printable amorphous oxide semiconductors (AOSs), I introduce the noble ways to resolve the critical problems, a high processing temperature above $400^{\circ}C$ and low mobility of AOSs annealed at a low temperature below $400^{\circ}C$. The dependency of TFT performances on the chemical structure of AOSs is compared and contrasted to clarify which factor should be considered to realize the low temperature annealed, high performance AOSs. For photovoltaic application, CI(G)S nanoparticle ink for solution processable high performance solar cells is presented. By overcoming the critical drawbacks of conventional solution processed CI(G)S absorber layers, the device quality dense CI(G)S layer is obtained, affording 7.3% efficiency CI(G)S photovoltaic device.

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Metal-induced Crystallization of Amorphous Semiconductor on Glass Synthesized by Combination of PIII&D and HiPIMS Process

  • Jeon, Jun-Hong;Choi, Jin-Young;Park, Won-Woong;Moon, Sun-Woo;Lim, Sang-Ho;Han, Seung-Hee
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.286-286
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    • 2011
  • 최근 폴리머를 기판으로 하는 Flexible TFT (thin film transistor)나 3D-ULSI (three dimensional ultra large-scale integrated circuit)에서 높은 에너지 소비효율과, 빠른 반응 속도를 실현 시키기 위해 낮은 비저항(resistivity)을 가지며, 높은 홀 속도(carrier hall mobility)를 가지는 다결정 반도체 박막(poly-crystalline thin film)을 만들고자 하고 있다. 이를 실현 시키기 위해서는 높은 온도에서 장시간의 열처리가 필요하며, 이는 폴리머 기판의 문제점을 야기시킬 뿐 아니라 공정시간이 길다는 단점이 있었다. 이에 반도체 박막의 재결정화 온도를 낮춰주는 metal (Al, Ni, Co, Cu, Ag, Pd etc.,)을 이용하여 결정화 시키는 방법이 많이 연구 되어지고 있지만, 이 또한 재결정화가 이루어진 반도체 박막 안에 잔여 금속(residual metal)이 존재하게 되어 비저항을 높이고, 홀 속도를 감소시키는 단점이 있다. 이에 본 실험은 HiPIMS (High power impulse magnetron sputtering)와 PIII and D (plasma immersion ion implantation and deposition) 공정을 복합시킨 프로세스로 적은양의 금속이온주입을 통하여 재결정화 온도를 낮췄을 뿐 아니라, 잔여 하는 금속의 양도 매우 적은 다결정 반도체 박막을 만들 수 있었다. 분석 장비로는 박막의 결정화도를 측정하기 위해 GAXRD (glancing angle X-ray diffractometer)를 사용하였고, 잔여 하는 금속의 양과 화학적 결합 상태를 알아보기 위해 XPS를 통해 분석을 하였다. 마지막으로 홀 속도와 비저항을 측정하기 위해 Hall measurement와 Four-point prove를 사용하였다.

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