• 보존과학회지
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• 제27권1호
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• pp.41-47
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• 2011

은 소지 위에 금을 도금한 은제금도금유물을 대상으로 성분분석을 위해 X선 형광 분석기를 이용하여 비파괴분석을 실시하면 소지금속인 Ag에서 전자궤도에 따라 무게백분율(wt.%)의 값이 큰 차이가 나타나는 특이점을 확인할 수 있다. 이러한 특이점을 이용하여 육안으로는 파악하기 쉽지 않은 유물에서도 은제금도금기법이 사용되었는지를 판단할 수 있는 근거를 제시하고자 재현시료를 제작하여 비교분석을 실시하였다. 그 결과 수은아말감도금법과 전기도금법으로 제작된 시료에서는 실제 유물들의 분석결과와 같은 결과를 볼 수 있었다. 하지만 금은합금시료의 경우 도금시료와는 달리 주성분들의 전자궤도에 따른 차이가 미미한 것을 확인할 수 있었다. 도금시료에서 나타나는 이러한 원인으로는 단일재료가 아닌 도금으로 인한 이중구조에 의해 도금층에서 XRF 빔을 흡수하면서 발생하는 것으로 보인다. 따라서 비파괴분석에서 나타나는 이러한 결과를 이용한다면 단면을 관찰하지 않아도 은제금도금 기법의 사용 여부를 판단할 수 있을 것으로 확인하였다.

• Restorative Dentistry and Endodontics
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• 제12권1호
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• pp.39-49
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• 1986

The purpose of this study was to observe characteristic properties through the polarization curves and SEM images from 4 different types of amalgam obtained by using the potentiostats (Princeton EG & G) & SEM (Jeol/35), and to investigate the degree of corrosion on the oxidation peak of the each phase of amalgam. After each amalgam alloy and Hg was triturated as the direction of the manufacturer by means of the mechanical amalgamator (Shofu Co.), the triturated mass was inserted into the cylindrical metal mold which was 12mm in diameter and 10.0mm in height and was condensed by using routine manner. The specimen was removed from the mold and stored at room temperature for about 24 hours. The standard surface preparation was routinely carried out. Anodic polarization measurement was employed to confirm the corrosion behaviour of the amalgams in a 0.9% saline solution (P.H: 6.8-7.0) at $37^{\circ}C$. The initial rest potential (corrosion potential) was determined after 30 minutes of immersion of specimen in electrolyte, and the potential scan was begun at the point of 100mV cathodic from the corrosion potential. The scan rate was 0.17mV/sec. in the study to observe the degree of corrosion of each phase. SEI and EPMA images on the determined oxidation peaks of each amalgam were observed. The results were as follows: 1. In the four anodic polarization curves, low copper amalgams have three oxidation peaks and high copper amalgams have two oxidation peaks, -270mV, +26mV and +179mV(SEC) in the low copper lathe cut, and -300mV, +39mV and +163mV(SEC) in the low copper spherical. -4mV and +154mV(SEC) in the Dispersalloy, and +17mV and +180mV(SEC) in the Tytin as high copper amalgams. 2. ${\gamma}_2$ phase in the low copper amalgam and ${\eta}$ phase in the high copper amalgam were the most corrodible phases and Ag-Cu eutectic in high copper amalgam was the most slowly corroded phase. 3. Low copper amalgam was more susceptible in corrosion than high copper amalgam.