• 한국전기전자재료학회논문지
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• 제21권9호
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• pp.835-843
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• 2008

We have fabricated the source-drain electrodes for OTFTs by screen printing method and manufactured Ag pastes as conductive paste. To obtain excellent conductivity and screen-printability of Ag pastes, the dispersion characteristics of Ag pastes prepared from two types of acryl resins with different molecular structures and Ag powder treated with caprylic acid, triethanol amine and dodecane thiol as surfactant respectively were investigated. The Ag pastes containing Ag powder treated with dodecane thiol having thiol as anchor group or AA4123 with carboxyl group(COOH) of hydrophilic group as binder resin exhibited excellent dispersity. But, Ag pastes(CA-41, TA-41, DT-41) prepared from AA4123 fabricated the insulating layer since the strong interaction between surface of Ag powder and carboxyl group(COOH) of AA4123 interfered with the formation of conduction path among Ag powders. The viscosity behavior of Ag pastes exhibited shear-thinning flow in the high shear rate range and the pastes with bad dispersion characteristic demonstrated higher shear-thinning index than those with good dispersity due to the weak flocculated network structure. The output curve of OTFT device with a channel length of 107 ${\mu}m$ using screen-printed S-D electrodes from DT-30 showed good saturation behavior and no significant contact resistance. And this device exhibited a saturation mobility of $4.0{\times}10^{-3}$ $cm^2/Vs$, on/off current ratio of about $10^5$ and a threshold voltage of about 0.7 V.

• 한국재료학회지
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• 제8권12호
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• pp.1082-1089
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• 1998

$YBa_2$$Cu_3$$O_{7-y}$ (123) 초전도체에서 은 입자의 미세분산을 얻고자 말릭산을 사용한 발화합성과 고상반응법으로 123와 123-Ag 복합 초전도분말을 제조하였다. 발화합성분말을 원료로 사용할 시 마이크론 미만의 미세한 123 분말과 은 분말의 복합체를 얻을 수 있었다. 원료로 사용된 산화은($Ag_2O$) 분말은 발화합성과정 중금속 은으로 환원되었다. 원료분말에 첨가된 금속 은에 의한 반응 물질간의 확산 촉진으로 123상이 단시간내에 생성되었고 입자성장도 촉진되었다. 발화합성법으로 제조한 시편은 기계적 혼합공정으로 제조한 시편에 비해 은 입자들은 미세하게 분산시킬 수 있어서 초전도체의 임계전류밀도가 향상되었다.

• 한국재료학회지
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• 제7권2호
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• pp.140-144
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• 1997

은 튜브에 장입되기 전의 초기 분말의 입자 크기가 Ag/Bi-2223초전도 선재의 미세구조와 상전이, 임계 전류 밀도등에 미치는 영향에 대해 고찰하였다. 분말의 입자 크기는 하소 분말을 볼밀을 이용하여 0-48 시간 동안 분쇄하여 조절하였다. 열처리 후 최종 초전도 선재의 전기적 성질은 초기 분말의 입자 크기에 영향을 받는 것으로 나타났으며 분말의 분쇄에 의한 반응성의 증가에 의해 열처리시 2223 상으로의 상전이가 빠르게 일어났고 이차상의 크기와 분율이 감소된 미세구조를 얻을 수 있었다. 그러나 과다한 분쇄에 의한 반응성의 증가에 의해 열처리시 2223상으로의 상전이가 빠르게 일어났고 이차상의 크기와 분율이 감소된 미세구조를 얻을 수 있었다. 그러나 과다한 분쇄는 분말의 비정질화를 유발하여 2223 상으로의 전이를 방해함으로써 선재의 임계 전류 밀도를 감소시키는 결과를 나타내었다.

• 한국전기전자재료학회논문지
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• 제21권3호
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• pp.249-254
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• 2008

Ag doping effect on $Li[Ni_{0.2}Li_{0.2}Mn_{0.6}]O_2$ cathode material was studied. Specially, we focused on rate performance of Ag doped samples. The $Li[Ni_{0.2}Li_{0.2}Mn_{0.6}]O_2$ powder was prepared by simple combustion method and the Ag was doped using $AgNO_3$ during gelation process. Based on X-ray diffraction analysis, there was no structural change by Ag doping, but the 'metallic' form of Ag was included in the doped powder. Both bare and Ag 1 wt.% doped sample showed similar discharge capacity of 242 mAh/g at 0.2C rate. However, as the increase of charge-discharge rate to 3C, Ag 1 wt.% doped sample showed higher discharge capacity (172 mAh/g) and better cyclic performance than those of bare sample. The discharge capacity of Ag 5 wt.% doped sample was relatively low at all rate condition. However it displayed better rate performance than other samples.

• 공업화학
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• 제9권7호
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• pp.1011-1017
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• 1998

$YBa_2Cu_3O_{6+x}(Y123)-Ag$ 초전도 선재를 0/20 wt%의 은(Ag)을 첨가한 발화합성분말과 고상반응분말을 사용하여 플라스틱 압출법으로 제조하였다. 플라스틱 압출법은 분말제조, 플라스틱 paste 제조, 다이 압축, binder 소각 및 소결공정을 포함한다. 양질의 초전도체를 제조하려면 원료물질이 균질하고 미세한 분말이어야 한다. 0/20 wt%를 첨가한 $Y_2O_3-BaCO_3-CuO$ precursor 분말을 발화합성(PS)법과 고상반응(MM)법으로 제조하였다. 원료분말이 Y123 초전도상으로 전이되는 생성속도를 공기중에서 여러온도와 시간별로 반응시켜 알아보았다. 발화합성법으로 제조한 분말이 고상반응법으로 제조한 분말보다 Y123상으로 빠르게 전이되었다. 이것은 PS법으로 제조한 분말이 미세한 크기와 균질한 화학적 조성으로 인해 Y123상으로 빠른 전이를 한 것이기 때문이다. 플라스틱 압출법으로 제조한 Y123-Ag 초전도 선재의 임계전류밀도($J_c$)는 원료분말의 특징에 따라 $150{\sim}230A/cm^2$값을 나타내었다. 은을 20 wt.% 첨가한 발화합성분말로 제조한 선재의 $J_c$는 $230A/cm^2$이었다.

• 자원리싸이클링
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• 제14권6호
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• pp.21-27
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• 2005

국내 은 함유 폐자원의 고부가가치 제품화를 위한 연구의 일환으로써 sodium formaldehydesulfoxy와 ascorbic acid를 각각 환원제로 사용한 Ag 나노분발의 제조실험을 수행하였다. Ag수용액은 질산은을 소정 농도로 증류수에 용해시켜 사용하였으며, Ag미립자의 응집방지를 위한 분산제로는 Tamol NN8906, PVP, SDS 및 caprylic acid를 각각 사용하었다. 환원반응을 통하여 제조한 Ag 미립자는 입도분석기 및 TEM측정을 통하여 morphology와 평균입도를 측정하였다. sodium formaldehydesulfoxylate 에 의한 은의 환원을 위해서는 이론치의 1.4배를 첨가해 주어야 하는 것으로 나타났으며, ascorbic acid와는 달리 생성된 Ag 입자가 너무 크게 성장하는 문제점이 있었다. 분산제에 따른 Ag 입자의 특성을 살펴본 결과, Tamol 및 PVP를 사용한 경우에는 bimodal distribution을 보였으나, SDS 와 caprylic acid의 경우에는 수십 nm에서 $100{\mu}m$에 이르는 매우 broad한 입도분포를 보였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 춘계학술대회논문집
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• pp.311-314
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• 2003

Superconduction materials possess electrical/electronic and magnetic properties. Because superconduction materials is a ceramic powder, that can not be produced singlehandedly. So Ag sheathed Bi-2223 wire was produced by drawing process using powder-in-tube(PIT) method This superconductor has many difficulties to produce. The main difficulty is that the mechanical properties of the ceramic powder are very different from those of the Ag sheath. Actually, the fabrication of Ag sheathed Bi-2223 superconductor by PIT tends to lead to non-uniformity in the core thickness during drawing process. That is so called “Sausaging”. This study analyzed a sausaging using the finite-element method. Also, Effects of drawing process parameters on a sausaging has been carried out using finite element method. Finally, A way to prevent a sausaging has been discussed.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1243-1244
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• 2006

Five kinds of double stacked 385 (55 x7) filamentary Bi2212/Ag round wires and 55 filamentary tapes with different Ag ratios (silver area/superconductor area) have been fabricated via PIT method, and the effects of Ag ratio and processing factors on critical current density were studied. The effects of the maximum temperature and average filament diameter on critical current density were also studied. The wire of 0.74 mm diameter having Ag ratio 3.7 showed critical current density of $2,218\;A/mm^2$ at 4.2 K, 0 T.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1239-1240
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• 2006

Effects of $Ag_2O$ doping on the electromagnetic properties in the BiSrCaCuO superconductors. The electromagnetic properties of $Ag_2O$ doped and undoped BiSrCaCuO superconductor were evaluated to investigate the contribution of the pinning centers to the magnetic effect. It was confirmed experimentally that a large amount of magnetic flux was trapped in the $Ag_2O$ doped sample than that in the undoped one, indicating that the pinning centers of magnetic flux are related closely to the occurrence of the magnetic effect. It is considered that the area where normal conduction takes place increases by adding $Ag_2O$ and the magnetic flux penetrating through the sample increases. The results suggested that Ag acts to increase pinning centers of magnetic flux, contributing to the occurrence of the electromagnetic properties.

• 한국분말재료학회지
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• 제30권3호
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• pp.242-248
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• 2023

The Ag/WC electrical contacts were prepared via powder metallurgy using 60 wt% Ag, 40 wt% WC, and small amounts of Co₃O₄ with varying WC particle sizes. After the fabrication of the contact materials, microstructure observations confirmed that WC-1 had an average grain size (AGS) of 0.27 ㎛, and WC-2 had an AGS of 0.35 ㎛. The Ag matrix in WC-1 formed fine grains, whereas a significantly larger and continuous growth of the Ag matrix was observed in WC-2. This indicates the different flow behaviors of liquid Ag during the sintering process owing to the different WC sizes. The electrical conductivities of WC-1 and WC-2 were 47.8% and 60.4%, respectively, and had a significant influence on the Ag matrix. In particular, WC-2 exhibited extremely high electrical conductivity owing to its large and continuous Ag-grain matrix. The yield strengths of WC-1 and WC-2 after compression tests were 349.9 MPa and 280.7 MPa, respectively. The high yield strength of WC-1 can be attributed to the Hall-Petch effect, whereas the low yield strength of WC-2 can be explained by the high fraction of high-angle boundaries (HAB) between the WC grains. Furthermore, the relationships between the microstructure, electrical/mechanical properties, and deformation mechanisms were evaluated.