• Journal of Welding and Joining
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• 제13권3호
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• 한국세라믹학회지
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• 제56권4호
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• pp.394-398
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• 2019

In this paper, the joining characteristics of GDC-LSM ceramics with Crofer 22 APU metal alloys was investigated at different brazing temperatures and holding times by reactive air brazing. Brazing was performed using Ag-10 wt% CuO filler, at three different temperatures (1000, 1050, and 1100℃ for 30 minutes) as well as for three different holding times (10, 30, and 60 minutes at 1050℃). The interfacial microstructures were examined by scanning electron microscopy and the joining strengths were assessed by measuring shear strengths at room temperature. The results show that with increasing brazing temperature and holding time, joint microstructure changed obviously and shear strength was decreased. Shear strength varied from a maximum of 100±6 MPa to a minimum of 18±5 MPa, depending on the brazing conditions. These changes were attributed to an increase in the thickness of the oxide layer at the filler/metal alloy interface.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.251-253
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• 2007

현재 다이아몬드 공구에서 극세선에 브레이징 공정을 이용하여 다이아몬드를 접합하는 기술은 국내외 적으로 전무한 상태이다. 이 연구는 금속 와이어에 다이아몬드를 브레이징을 실시하여 최적의 와이어 브레이징 공정법을 개발 하는데 있다. 다이아몬드와 금속필러메탈 접합 계면에서의 금속성분과 탄화물의 거동을 분석하며, 브레이징에 따른 와이어의 물성 변화를 관찰하였다. 금속필러로는 Ag-Cu-5Ti(wt.%)을 사용하였으며, 와이어는 스테인리스를 이용하였다. 브레이징 공정은 진공 접합 장치를 이용하여 $800{\sim}1000^{\circ}C$에서 유지시간 $5{\sim}30$분로 실시하였다. 브레이징된 다이아몬드는 $900{\sim}950$도, 유지시간 10분 사이에서 각각 건전한 계면과 표면을 얻을 수 있었으며, 계면에서 Ti-rich상과 화합물이 확인되었다. 또한 열처리 따른 와이어의 최적의 건전한 상태를 고찰 하였다. 다이아몬드와 Ag계 브레이징 필러의 계면에서의 미세조직 및 화학반응의 메커니즘은 SEM, EPMA, XRD를 이용하여 분석하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.248-250
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• 2007

이 연구는 cBN과 활성 Ag계 금속필러메탈을 이용하여 접합계면에서의 금속성분과 화합물, 탄화물의 거동을 분석하는데 있다. 진공 브레이징은 $900{\sim}1000^{\circ}C$에서 $25^{\circ}C$ 간격으로, 유지 시간은 각각 5, 10, 15, 20분으로 실시하였다. Ag-Cu-Ti을 사용하여 브레이징된 cBN은 $950{\sim}1000$도, 유지시간 10분 사이에서 각각 건전한 계면과 표면을 얻을 수 있었으며, 계면에서 Ti-rich상과 화합물이 확인되었다. 이상의 결과로 부터 화합물의 생성과 건전한 접합공정은 브레이징 온도와 시간이 좌우하며, N과 B, Ti의 함유량이 cBN의 브레이징 접합 특성의 중요변수로 생각되어진다. cBN과 Ag계 브레이징 필러의 계면에서의 미세조직 및 화학반응의 메커니즘은 DTA, SEM, EPMA, XRD를 이용하여 분석하였다.

• 대한화학회지
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• 제20권4호
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• pp.280-289
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• 1976

$Ag_2Se$ 전극을 제조하고 은이온에 대한 지시전극으로서의 성질을 조사하였다. Epoxy 수지를 Ag_2Se 전극의 binder로서, Silver paste를 감응막과 은판의 접착제로서 사용하였다. 감응막은 10ton/$cm^2$로 가압성형 한다음 질소분위기에서 200${\sim}$$500^{\circ}C$로 sintering한 후 전극을 제조한 결과sintering 하지않은 전극보다 감응성이 우수하고 견고하였다. 또한 $Ag_2Se$전극보다 감응성이 우수하였다. 은이온농도의 변화에 따르는 감응도는 10-6M까지 직선관계를 유지하였다. 대부분의 중금속 이온은 방해하지 않으나 수은(II) 이온이 크게 방해를 하였으며 음이온인 halide, cyanide, thiocyanate 이온의 방해는 더욱 심하였다. 반면 이전극은 halide 이온 정량시 전위차적정법으로 사용할 수 있음을 알았다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.379.1-379.1
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• 2016

Recently, new types of wearable devices such as textile electronics are considered as the next generation wearable electronics. To realize the textile electronics, conductive fibers are required to supply the power and for signal processing. Conventionally, silver nanowires (Ag NWs) have been attracted as one of the conductive additives in the fibers, however, using the Ag NWs may lead to high production cost since it is a noble metal. Many researches have been done to replace the Ag NWs into a cheaper materials such as copper nanowires (Cu NWs). Here, we synthesized ultra-long Cu NWs for a conductive filler material in conductive fibers, taking advantages of their structural features. To investigate the effect of capping agents on the aspect ratio of the synthesized Cu NWs, we used various capping agents such as hexadecylamine, butylamine, ethylenedilamine and oleylamine in the Cu NW synthesis. In this research, the effects of capping agents on the structure and the synthesis of Cu NWs are presented.

• 대한금속재료학회지
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• 제48권12호
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• pp.1056-1063
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• 2010

We present a new joining method for Pd-Cu membrane foils used as permeation tubes to collect $CO_2$. Since foils have poor mechanical strength, joining should be done at low temperatures to reduce residual stresses and without joining pressure. This contradicts the well known conditions for good contact between base materials that determines joint qualities. We selected Sn-Ag-Cu alloys that are highly reactive with Pd and Cu as a filler metal. As the filler melts at joining temperatures as low as $220{\sim}280^{\circ}C$, Pd and Cu are dissolved into the melt and react with the filler elements, which raises the melting temperature of the filler based on eutectic structures among the elements. Then, isothermal solidification progresses for the rest of the joining time. Intermetallic compounds (IMC) in the joints, one of the main factors for brittle joints, are inevitably formed. However, by optimizing both joining time and temperature, we balanced the wettability with IMC. Sealing test results confirmed that the joints are mechanically reliable during operation.

• The Korean Journal of Ceramics
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• 제6권2호
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• pp.168-171
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• 2000

VO$_2$ceramics exhibiting a negative temperature coefficient (NTC) of resistivity have been widely used as temperature dependence resistors. The NTC effect similar to $VO_2$ceramics was observed when a low-thermal-expansion ceramic matrix was loaded near the percolation threshold with conductive metal particles. The resistivity in a composite made from silica glass and 20 vol% Ag filler suddenly decreased from $10^{-7}$ to $10^3\;\Omega$cm at about $300^{\circ}C$.

• International Journal of Korean Welding Society
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• 제4권1호
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• pp.46-52
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• 2004

To combine the mechanical advantages of ceramics with those of metals, one often uses both materials within one composite component. But, as known, they have different material properties and fracture behaviors. In this study, a four-point bending test is carried out on $Si_3N_4$ joined to ANSI 304L stainless steel with a Ti-Ag-Cu filler and a Cu interlayer at room temperature to evaluate their longitudinal strain behaviors. And, to detect localized strain, a couple of strain gages are pasted near the joint interfaces of the ceramic and metal sides. The normal strain rates are varied from $3.33{\times}10^5$ to $3.33{\times}10^{-1}s^{-1}$ Within this range, the experimental results showed that the four-point bending strength and the deflection of the interlayer increased with increasing the strain rate.

• Journal of Welding and Joining
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• 제12권4호
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• pp.110-116
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• 1994

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.