• 한국자동차공학회논문집
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• 제12권2호
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• pp.182-189
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• 2004

The application of adhesively bonded components is increasing in various industries such as automobile, aircraft, IC packages, and soldering techniques. In spite of such wide application in adhesively bonded components, nondestructive test techniques applying to adhesively bonded components have not been clearly established yet. In this paper, characteristics of ultrasonic test on interfaces of adhesively bonded components have been investigated by calculating transmission coefficient theoretically and experimentally. From the experimental results, the optimum conditions to establish frequencies for adhesively bonded homogeneous and dissimilar components are 4∼6 MHz and 2∼4 MHz, respectively.

• 대한기계학회논문집A
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• 제24권6호
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• pp.1547-1556
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• 2000

In this paper, an evaluation method of fracture toughness to apply interfacial fracture mechanics was investigated in adhesively bonded double-cantilever beam (DCB) joints. Four types of adhesively bonded DCB joints with an interface crack were prepared for analyses of the stress intensity factors using boundary element method(BEM) and the fracture toughness test. From the results of BEM analysis and fracture toughness experiments, it is found that the stress intensity factor, K1 is a parameter driving the fracture of adhesively bonded joints. Also, the evaluation method of fracture toughness by separated stress intensity factors of mixed mode cracks was proposed and the influences of mode components for its fracture toughness are investigated in adhesively bonded DCB joints.

• 접착 및 계면
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• 제7권4호
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• pp.10-12
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• 2006

The successful use of adhesively bonded parts depends on the defect-free bond of the components. Therefore it is necessary to detect relevant faults and defects in an early state of the production. A 100% test should be pursued, but especially at complicated structures the detection of defects is not easy. Possible testing methods, which show a high potential for the NDT of adhesively bonded parts, are thermography based NDT methods. At present mainly two different procedures of active thermography are being used: Pulse and Lock-In Thermography. With pulse thermography the examined material is warmed up with a short energy pulse (light, eddy current or ultrasonic pulse) and the heat response is recorded after a certain time. The result is an infrared image which indicates material defects in different depths. This paper presents a variety of images showing the capability of Lock-In Thermography to image subsurface defects. Several examples of adhesives joints qualify the ultrasonic Lock-In-Thermography for the in-process quality control for adhesive bonded components.

• 한국자동차공학회논문집
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• 제12권1호
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• pp.130-137
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• 2004

The ultrasonic attenuation coefficients were measured by interfacial crack length in the adhesive components of double-cantilever beam(DCB). The energy release rate, G, was obtained by the experimental measurement of compliance. The numerical analysis by the boundary element method(BEM) and Ripling's equation was investigated. The experimental results represent that the relation between interfacial crack length for the ultrasonic attenuation coefficient and energy release rate is increased proportionally. A measurement method of the interfacial crack length by the ultrasonic attenuation coefficient was proposed and discussed.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.796-801
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• 2007

The optical performance of the mirror for satellite camera is highly dependent on the adhesive properties between the mirror and its support. In order to design a mirror with high optical performance, the mechanical properties of adhesives should be well defined. In this research, the mechanical properties of three kinds of space adhesives are studied. In case of the materials which show nearly incompressible behavior such as space adhesives, it is important to measure shear modulus which governs deviatoric stress components. Shear moduli of the adhesives are determined by using single lap adhesively bonded joint. For the shear tests, several points have been selected from $-20^{\circ}C$ to $50^{\circ}C$ which is operating temperature range of the adhesive. The shear modulus of each adhesive is expressed as a function of temperature. Characteristics of the adhesives are discussed regarding their temperature sensitivity. The analysis results of RMS wavefront error w.r.t shear modulus are presented.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2001년도 춘계학술발표대회 논문집
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• pp.250-253
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• 2001

Recently, based on the smart structure concept, optical fiber sensors have been increasingly applied to monitor the various engineering and civil structural components. Repairs based on adhesively bonded fiber reinforce composite patches are more structurally efficient and much less damaging to the parent structure than standard repairs based on mechanically fastened metallic patches. As a result of the high reinforcing efficiency of bonded patches fatigue cracks can be successfully repaired. However, when such repairs are applied to primary structures, it is needed to demonstrate that its loss can be immediately detected. This approach is based on the "smart patch" concept in which the patch system monitors its own health. The objective of this study is to evaluate the potentiality of application of transmission-type extrinsic Fabry-Perot optical fiber sensor (TEFPI) to the monitoring of crack growth behavior of composite patch repaired structures. The sensing system of TEFPI and the data reduction principle for the detection of crack detection are presented. Finally, experimental results from the tests of center-cracked-tension aluminum specimens repaired with bonded composite patch is presented and discussed.

• 대한기계학회논문집A
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• 제31권7호
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• pp.808-815
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• 2007

The optical performance of the mirror fur satellite camera is highly dependent on the adhesive properties between the mirror and its support. Therefore, in order to design a mirror with high optical performance, the mechanical properties of adhesives should be well defined. In this research, the mechanical properties of three kinds of space adhesives are studied. In case of the materials which show nearly incompressible behavior such as space adhesives, it is important to measure shear modulus which governs deviatoric stress components. Also the experiment should be performed in circumstances similar to real manufacturing process of mirror, because extra factors such as size effects, the adhesion effects of primer and reactions between adhesive and primer affect the properties of adhesive regions. In this research shear moduli of the adhesives are determined by using a single lap adhesively bonded joint. For the shear tests, several temperatures have been selected from $-20^{\circ}C$ to $55^{\circ}C$ which is operating temperature range of the adhesive. In the case of linear behavior materials, shear moduli are calculated through a linear curve fitting. Shear stress-strain relation is obtained by using an exponential curve fitting for material which shows non-linear behavior. The shear modulus of each adhesive is expressed as a function of temperature. Characteristics and adaptability of the adhesives are discussed regarding their temperature sensitivity.

• 접착 및 계면
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• 제5권2호
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• pp.14-26
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• 2004

For reliable determination of mechanical characteristics of adhesively bonded joints used e.g. as input data for computer-aided design of complex components, the thick-adherend tensile-shear test according to ISO 11003-2 is the most important material testing method. Although the total displacement of the joint is measured across the polymer layer directly in the overlap zone in order to minimize the influence of the stepped adherends, the substrate deformation must be taken into account within the framework of the evaluation of the shear modulus and the maximum shear strain, at least when high-strength adhesives are applied. In the standard ISO 11003-2 version of 1993, it was prescribed to perform the substrate deformation correction by means of testing a one-piece reference specimen. The authors, however, pointed to the excessive demands on the measuring accuracy of the extensometers connected with this technique in industrial practice and alternatively proposed a numerical deformation analysis of a dummy specimen. This idea of a mathematical correction was included in the revised ISO 11003-2 version of 2001 but in the simplified form of an analytical method based on Hooke's law of elasticity for small strains. In the present work, it is shown that both calculation techniques yield considerably discordant results. As experimental assessment would require high-precision distance determination (e.g. laser extensometer), finite element analyses of the deformation behavior of the bonded joint are performed in order to estimate the accuracy of the obtained substrate deformation corrections. These simulations reveal that the numerical correction technique based on the finite element deformation modeling of the reference specimen leads to considerably more realistic results.