• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집A
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• pp.299-303
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• 2001

Adherend-adhesive interface failure will occur on a macroscale when surface preparation or material quality are poor. It is well known that the stress singularity occurs at the edges of interface between the adhernds and the adhesive, and that crack will initiate from these positions. Also if bubbles are created and remained in the adhesive layer during the bonding process, the stress concentrates around these hole defects. In this paper, the effects of the hole defects on the SIF of interface crack were examined. From results, SIF increased with the hole defects near the interface crack and increased with an decreae in the upper adherend thickness, an increase in the center adhesive thickness.

• 한국생산제조학회지
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• 제21권3호
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• pp.439-445
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• 2012

The stress singularity for the excess adhesive on interface of adhesively bonded joint was investigated by using the 2-dimensional elastic boundary element method (BEM). To establish a reasonable strength evaluation method and a fracture criterion for the excess adhesive of interface in adhesively bonded joint, it is necessary to evaluate fracture parameters with various bonding conditions. Under the variations of adhesively bonded thickness (h) and diameter (d) for the excess adhesive, a stress analysis was performed, and from the results, the stress singularity index (${\lambda}$) and the stress singularity factor (${\Gamma}$) were calculated. The variations have a great influences on the stress singularity for the excess adhesive of interface in adhesively bonded joint, and the ${\Gamma}$ is reduced as the "h" and "d" increase.

• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• 접착 및 계면
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• 제4권2호
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• pp.21-29
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• 2003

Hot AC anodising has been evaluated us pre-treatment for aluminium prior to structural adhesive bonding. Phosphoric and sulphuric acid hot AC anodising showed very promising adhesion promoter capabilities with durability comparable with the best standard DC anodising procedures. AC anodising does not required etching prior to anodising and offers u pre-treatment time down to 20 seconds. The interface/interphase between the aluminium substrate and the adhesive was investigated in order to get a better understanding of the involved adhesion mechanisms and to explain the long-tenn properties. The alkaline medium formed at the oxide layer/adhesive interface has been shown to induce a partial dissolution of the oxide layer leading to the formation of metallic ions which diffuse in the adhesive (EPMA measurements). The effect of diffusion of the Al ions on adhesion and joint durability is still uncertain but studies showed that pre-bond moisture affected the joints durability and to some extent the diffusion length. specially for DC anodised samples. So far no direct correlation could be established between the diffusion length d and the joints durability but new trials with better control over the elapsed time between bonding and adhesive curing are expected to help getting a better understanding of the involved mechanisms.

• Restorative Dentistry and Endodontics
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• 제46권2호
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• pp.30.1-30.13
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• 2021

Objectives: This study was conducted to compare the microleakage and characteristics of the resin-tooth tissue interface between self-etch and etch-and-rinse adhesive systems after 48 hours and 3 months. Materials and Methods: 40 extracted premolar teeth were randomly divided into 2 groups: 1-step self-etch adhesive system - Optibond^TM All-In-One, and 2-step etch-and-rinse adhesive system - Adper^TM Single Bond 2. Both groups were subjected to 500 thermocycles (5℃-55℃) before scanning electron microscope (SEM) analysis or microleakage trial at 48-hour and 3-month time periods. Results: SEM images showed the hybrid layer thickness, diameter, and length of resin tags of the self-etch adhesive (0.42 ± 0.14 ㎛; 1.49 ± 0.45 ㎛; 16.35 ± 14.26 ㎛) were smaller than those of the etch-and-rinse adhesive (4.39 ± 1.52 ㎛; 3.49 ± 1 ㎛; 52.81 ± 35.81 ㎛). In dentin, the microleakage scores of the 2 adhesives were not different in both time periods (48 hours/3 months). However, the microleakage score of etch-and-rinse adhesive increased significantly after 3 months (0.8 ± 0.63 and 1.9 ± 0.88, p < 0.05). Conclusions: The self-etch adhesive exhibited better long-term sealing ability in dentin when compared to that of the etch-and-rinse adhesive. The greater hybrid layer thickness and dimensions of resin tags did not guarantee reliable, long-lasting sealing in the bonding area.

• Restorative Dentistry and Endodontics
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• 제46권1호
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• pp.3.1-3.14
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• 2021

Objectives: This study aimed to evaluate the interface between a calcium silicate cement (CSC), Biodentine and dental adhesives in terms of sealing ability. Materials and Methods: Microleakage test: 160 standardized class II cavities were prepared on 80 extracted human molars. The cavities were filled with Biodentine and then divided into 2 experimental groups according to the time of restoration: composite resin obturation 15 minutes after Biodentine handling (D0); restoration after 7 days (D7). Each group was then divided into 8 subgroups (n = 5) according to the adhesive system used: etch-and-rinse adhesive (Prime & Bond); self-etch adhesive 2 steps (Optibond XTR and Clearfil SE Bond); self-etch adhesive 1 step (Xeno III, G-aenial Bond, and Clearfil Tri-S Bond); and universal used as etch-and-rinse or self-etch (ScotchBond Universal ER or SE). After thermocycling, the teeth were immersed in a silver nitrate solution, stained, longitudinally sectioned, and the Biodentine/adhesive percolation was quantified. Scanning electron microscopic observations: Biodentine/adhesive interfaces were observed. Results: A tendency towards less microleakage was observed when Biodentine was etched (2.47%) and when restorations were done without delay (D0: 4.31%, D7: 6.78%), but this was not significant. The adhesives containing 10-methacryloyloxydecyl dihydrogen phosphate monomer showed the most stable results at both times studied. All Biodentine/adhesive interfaces were homogeneous and regular. Conclusions: The good sealing of the CSC/adhesive interface is not a function of the system adhesive family used or the cement maturation before restoration. Biodentine can be used as a dentine substitute.

• 접착 및 계면
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• 제3권1호
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• pp.43-51
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• 2002

Advanced adhesive technologies and demanding applications of adhesive joints can no longer be developed successfully by the traditional "trial and error" approach. Appropriate technical solutions require reference to a reliable basis of well-established scientific knowledge about the elementary mechanisms of adhesion (i.e. the 'fundamental adhesion') as they are responsible for the capability of the compound w transmit mechanical force between the adhesive and the substrate surface (i.e. the 'practical adhesion'). Adhesion mechanisms also influence the formation of polymer structure in the adhesive and the resulting macromolecular dynamics in the interphase that is formed in the adhesive near to the substrate. These manifold molecular factors rule the macroscopic behaviour of an adhesive bond line in terms of mechanical and other physical properties as well as in terms of durability. This paper reviews the level of refinement that understanding of fundamental adhesion has achieved up to now.

• Structural Engineering and Mechanics
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• 제18권3호
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• pp.315-330
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• 2004

A four-point bending RC beam strengthened with FRP plate is investigated based on the theory of elasticity. Taking the adhesive layer into account but ignoring some secondary parameters, the analytical solutions of the normal stress and shear stress on concrete-adhesive interface are obtained and discussed. Besides, the pure bending region of the beam is analyzed and the ultimate load of the beam is predicted. The results obtained in the present paper agree very well with both the results of FEM and the experimental findings.

• 접착 및 계면
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• 제5권2호
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• 접착 및 계면
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• 제3권2호
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• pp.40-44
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• 2002

본 실험에서는 고무-황동 도금 스틸 코드 복합체의 접착성에 미치는 미가류 복합체의 방치 기간과 가류 복합체의 열노화의 영향을 검토하였다. 또한 이런 방치 조건에 따른 접착력 변화가 타이어 내구력에 어떤 영향을 미치는지를 평가하였다. PAD 접착 시편을 사용하여 박리 접착 강도를 측정하였다. 미가류 복합체의 방치 기간은 공장 조건에서 최대 35일이고 가류 복합체의 열노화는 $85^{\circ}C$ 항온조에서 5, 10일간 실시하였다. 박리 접착 강도는 방치일수가 길수록 하락하는 경향을 보였다. 또한 열노화 기간이 길수록 그 값은 낮았다. 박리 접착 강도가 낮을수록 타이어 내구력도 낮았고, 그 주된 원인이 수분과 열에 의한 노화가 고무와 스틸 코드의 접착력을 하락시켜 코드와 고무의 계면에서 파괴가 일어났기 때문이라는 것을 SEM관찰과 내구력 평가로 확인할 수 있었다. 즉, 스틸 코드 표면의 부식이나 접착증의 노화가 접착강도 하락에 크게 영향을 미치고 그 결과 타이어의 내구력 하락에도 직접적인 영향을 미친다는 것을 알 수 있었다.