• 제목/요약/키워드: Adhesive Joints

검색결과 207건 처리시간 0.026초

비틀림 접착 조인트의 피로 수명에 대한 표면 조도와 접착 두께의 영향 (The Effects of Surface Roughness and Bond Thickness on the Fatigue Life of Adhesively Bonded Tubular Single Lap Joints)

  • 권재욱;이대길
    • 대한기계학회논문집A
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    • 제24권8호
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    • pp.2022-2031
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    • 2000
  • Since the surface roughness of adherends affects much the strength of adhesivelybonded joints, the effect of surface roughness on the fatigue life of adhesively bonded tubular single lap joints was investigated analytically and experimentally by fatigue torsion test. The stiffness of the interfacial layer between adherends and adhesive was modeled as a normal statistical distribution function of surface roughness of adherends. From the investigation, it was found that the optimum surface roughness of adherends for the fatigue strength of tubular single lap joints was dependent on bondthickness and applied load.

접착이음의 계면균열에 대한 파괴인성 및 평가방법 (Mehods of Fracture Toughness and Evaluation for Interface Crack in Adhesively Bonded Joints)

  • 정남용
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1998년도 춘계학술대회 논문집
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    • pp.220-226
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    • 1998
  • In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.

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페놀 수지를 이용한 NBR/냉연강판 접착계에 미치는 NBR 조성의 효과 (Effect of NBR Component on Adhesion Behaviors between NBR and Metal Joints Using Phenol Adhesive)

  • 이동원;박해윤;유영재;강동국;서관호
    • 폴리머
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    • 제32권1호
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    • pp.1-6
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    • 2008
  • Acrylonitrile butadiene rubber(NBR)의 접착력 및 가공성을 향상시키기 위한 연구를 하였다. 최상의 조건을 선별하기 위해서 NBR의 acrylonitrile(ACN) 함량에 따른 접착물성 및 가공성을 관찰하였다. 무늬 점도, 충전제, 가소제 및 가교제가 접착력에 미치는 영향도 조사하였다. NBR의 ACN 함량은 NBR sealing에서 접착거동 및 가공성에 큰 영향을 미침을 알 수가 있었다. 최상의 혼합 조건을 알기 위해서 분산도를 조사하였다. 분산도는 혼합순서, 시간 및 온도 등의 많은 인자들에 의해 영향을 받는 것이 확인되었다. 가교시스템은 황 가교시스템, 과산화물 가교시스템, 가교밀도 및 구조 등의 관찰로 연구하였다. 접착제의 변화는 건조 상태와 hexamine 함량 등과 같은 것으로부터 NBR과 접착제 사이의 관계를 연구하였다. 이 결과 접착 물성과 가공성은 ACN 함량 및 가교시스템에 따라 차이를 보였다.

NCA 물성에 따른 극미세 피치 COG (Chip on Glass) In, Sn 접합부의 신뢰성 특성평가 (Improvement of Reliability of COG Bonding Using In, Sn Bumps and NCA)

  • 정승민;김영호
    • 마이크로전자및패키징학회지
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    • 제13권2호
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    • pp.21-26
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    • 2006
  • NCA의 물성이 미세피치 Chip on glass (COG) 접합부의 신뢰성에 미치는 영향을 연구하였다. Si 위에 Sn을, 유리기판 위에 In을 열증발 방법으로 증착하고 lift-off 방법을 이용하여 $30{\mu}m$ 피치를 가지는 솔더범프를 형성하였으며 열압착 방법으로 $120^{\circ}C$에서 In 범프와 Sn 범프를 접합하였다. 접합할 때 세 종류의 Non conductive adhesive (NCA)를 적용하였다. 신뢰성은 $0^{\circ}C$$100^{\circ}C$ 사이로 열충격시험을 2000회까지 실시하여 평가하였다. 4단자 저항측정법을 이용하여 접합부의 저항을 측정하였다. 필러의 양이 증가할수록 열충격시험 후 접합부의 저항이 가장 적게 증가하여 신뢰성이 우수하였다. 필러의 양이 증가할수록 NCA의 열팽창이 작아지기 때문이다.

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Micro Bonding Using Hot Melt Adhesives

  • Bohm, Stefan;Hemken, Gregor;Stammen, Elisabeth;Dilger, Klaus
    • 접착 및 계면
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    • 제7권4호
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    • pp.28-31
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    • 2006
  • Due to the miniaturization of MEMS and microelectronics the joining techniques also have to be adjusted. The dosing technology with viscous adhesives does not permit reproducible adhesive volumes, which are clearly under a nano-liter. A nano-liter means however a diameter of bonding area within the range of several 100 micrometers. Additional, viscous adhesives need a certain time, until they are cross linked or cured. The problem especially in the MEMS is the initial strength, since it gives the time, which is needed for joining an individual adhesive joint. The time up to the initial strength is with viscous, also with fast curing systems, within the range of seconds until minutes. Until the reach of the initial strength, the micro part must be fixed/held. Without sufficient adjustment/clamping it can come to a shift of the micro parts. Also existing micro adhesive bonding processes are not batch able, i.e. the individual adhesive joints of a micro system must be processed successively. In the context of the WCARP III 2006 now an innovative method is to be presented, how it is possible to solve the existing problems with micro bonding. i.e. a method is presented, which is batch able, possess a minimum joining geometry with some micrometers and is so fast that no problems with the initial strength arise. It is a method, which could revolutionize the sticking technology in the micro system engineering.

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열응력이 발생하는 접착이음부에서의 초음파 신호처리기법을 이용한 강도평가 (Strength evaluation of adhesive joint with thermal stress using ultrasonic signal processing method)

  • 오승규;황영택;장철섭;오선세;이원
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.534-540
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    • 2001
  • One approach to testing the suitability of an adhesive joint for a particular application is to build and test to destruct ion a representative sample of the joint. The nondestructive test will not measure strength directly but will measure a parameter which can be correlated to strength. It is therefore, essential that a suitable nondestructive test is chosen and that its results are correctly interpreted. In this paper, typical defects found in adhesive joints are described together with their significance. The limits and likely success of current physical nondestructive tests are described, and future trends outlined.

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전도성 접착제를 이용한 패키징 기술 (Recent Advances in Conductive Adhesives for Electronic Packaging Technology)

  • 김종웅;이영철;노보인;윤정원;정승부
    • 마이크로전자및패키징학회지
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    • 제16권2호
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    • pp.1-9
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    • 2009
  • Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.

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Ag-Ti계 합금을 사용한 SiC/SiC 및 SiC/연강 브레이징에 대한 연구 (A Study on SiC/SiC and SiC/Mild steel brazing by the Ag-Ti based alloys)

  • 이형근;이재영
    • Journal of Welding and Joining
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    • 제14권4호
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    • pp.99-108
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    • 1996
  • The microstructure and bond strength are examined on the SiC/SiC and SiC/mild steel joints brazed by the Ag-Ti based alloys with different Ti contents. In the SiC/SiC brazed joints, the thickness of the reaction layers at the bond interface and the Ti particles in the brazing alloy matrices increase with Ti contents. When Ti is added up to 9 at% in the brazing alloy. $Ti_3SiC_2$ phase in addition to TiC and $Ti_5Si_3$ phase is newly created at the bond interface and TiAg phase is produced from peritectic reaction in the brazing alloy matrix. In the SiC/mild steel joints brazed with different Ti contents, the microstructure at the bond interface and in the brazing alloy matrix near SiC varies similarly to the case of SiC/SiC brazed joints. But, in the brazing alloy matrix near the mild steel, Fe-Ti intermetallic compounds are produced and increased with Ti contents. The bond strengths of the SiC/SiC and SiC/mild steel brazed joints are independent on Ti contents in the brazing alloy. There are no large differences of the bond strength between SiC/SiC and SiC/mild steel brazed joints. In the SiC/mild steel brazed joints, Fe dissolved from the mild steel does not affect on the bond strength of the joints. Thermal contraction of the mild steel has nearly no effects on the bond strength due to the wide brazing gap of specimens used in the four-point bend test. The brazed joints has the average bond strength of about 200 MPa independently on Ti contents, Fe dissolution and joint type. Fracture in four-point bend test initiates at the interface between SiC and TiC reaction layer and propagates through SiC bulk. The adhesive strength between SiC and TiC reaction layer seems to mainly control the bond strength of the brazed joints.

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Fatigue Resistance Improvement of Welded Joints by Bristle Roll-Brush Grinding

  • Kim, In-Tae;Kim, Ho-Seob;Dao, Duy Kien;Ahn, Jin-Hee;Jeong, Young-Soo
    • 국제강구조저널
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    • 제18권5호
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    • pp.1631-1638
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    • 2018
  • In the periodic repainting of steel bridges, often the steel surface has to be prepared by using power tools to remove surface contaminants, such as deteriorated paint film and rust, and to increase the adhesive strengths of the paint films to be applied newly. Surface preparation by bristle roll-brush grinding, which is a type of power tool, may additionally introduce compressive residual stress and increase the fatigue resistance of welded joints owing to the impact of rotating bristle tips. In this study, fatigue tests were conducted for longitudinally out-of-plane gusset fillet welded joints and transversely butt-welded joints to evaluate the effect of bristle roll-brush grinding prior to repainting on the fatigue resistance of the welded joints. The test results showed that bristle roll-brush grinding introduced compressive residual stress and significantly increased fatigue limits by over 50%.