• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.197-206
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• 2000

The deposition characteristics of MOCVD Cu using the (hfac)Cu(1,1-COD)(1,1,1,5,5,5-hexafluoro-2,4-pentadionato Cu(I) 1,5-cyclooctadine) have been investigated in terms of the effects of carrier gas such as hydrogen and argon as well as the effects of H(hfac) ligand addition. MOCVD Cu using a hydrogen carrier gas led to a higher deposition rate and lower resistivity than an argon carrier gas system. The improvement in the surface roughness of the MOCVD Cu films and the (111) preferred orientation texture was obtained by using a hydrogen carrier gas. However, the adhesion characteristics of the films showed relatively weaker compared to the Ar carrier gas system, probably due to the larger amount of F content in the films, which was confirmed by the AES analyses. When an additional H(hfac) ligand was added, the deposition rate was significantly enhanced in the case of an argon + H(hfac) carrier gas system while significant change in the deposition rate of MOCVD Cu was not observed in the case of the hydrogen carrier gas system. However, the addition of H(hfac) in both carrier gases led to lowering the resistivity of the MOCVD Cu films. In conclusion, this paper suggests the deposition mechanism of MOCVD Cu and is expected to contribute to the enhancement of smooth Cu films with a low resistivity by manipulating the deposition conditions such as the carrier gas and addition of H(hfac) ligand.

• Journal of the Korean Recycled Construction Resources Institute
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• v.9 no.3
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• pp.330-337
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• 2021

3D printing is not only at the fundamental study and small-scale level, but has recently been producing buildings that can be inhabited by people. Buildings require a lot of cost and labor to work on the form work, but if 3D printing is applied to the building, the construction industry is received attention from technologies using 3D printing as it can reduce the construction period and cost. 3D printing technology for buildings can be divided into structural and non-structural materials, of which 3D printing is applied to non-structural materials. Because 3D printing needs to be additive manufacturing, control such as curing speed and workability is needed. Since cement mortar has a large shrinkage due to evaporation of water, cement polymer dispersion is used to improve the hardening speed, workability, and adhesion strength. The addition of polymer dispersion to cement mortar improves the tensile strength and brittleness between the cement hydrate and the polymer film. Cement mortar using polymer materials can be additive manufacturing but it has limited height that can be additive manufacturing due to its high density. When light-weight materials are mixed with polymer cement mortar, the density of polymer cement mortar is lowered and the height of additive manufacturing, so it is essential to use light-weight materials. However, the use of EVA redispersible polymer powder and light-weight materials, additional damage such as cracks in cement mortar can occur at high temperatures such as fires. This study produced a test specimen incorporating light-weight materials and EVA redispersible polymer powder to produce exterior building materials using 3D printing, and examined flame resistance performance through water absorption rate, length change rate, and cone calorimeter test and non-flammable test. From the test result, the test specimen using silica sand and light-weight aggregate showed good flame resistance performance, and if the EVA redispersible polymer powder is applied below 5%, it shows good flame resistance performance.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of the korean academy of Pediatric Dentistry
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• v.49 no.2
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• pp.140-148
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• 2022

This study aimed to evaluate the effect of silver diamine fluoride (SDF) and potassium iodide (KI) on the formation of cariogenic biofilm and surface roughness in vitro. A total of 48 bovine dentin specimens with artificially induced caries were prepared and divided into 3 groups of 16: untreated control, SDF-treated, and SDF-treated followed by KI (SDFKI). Ten specimens from each group were used to observe microbial adhesion. Multispecies cariogenic biofilms including Streptococcus mutans, Lactobacillus casei, and Candida albicans were cultured on the specimens. Microbes were cultured for 24 hours, and the colony-forming unit was calculated. The remaining specimens were observed by atomic force microscope and scanning electron microscope (SEM). The number of bacteria was significantly lower in the SDF and SDFKI groups. KI did not inhibit the antibacterial activity of SDF significantly. SEM images showed particles generated after SDF and SDFKI application were deposited on the dentin, but there was no significant difference in surface roughness between the 3 groups. This study confirmed that SDF and SDFKI application did not have a significant effect on the surface roughness of dentin, but effectively inhibited the formation of the early cariogenic bacterial film after 24 hours compared to the control.

• Journal of Life Science
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• v.34 no.8
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• pp.540-547
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• 2024

The continuous use of polymer materials has exacerbated waste and environmental challenges, spurring a growing interest in eco-friendly polymers, especially biodegradable polymers. These polymers are gaining attention for their potential as antimicrobial agents, particularly in fields like food packaging a need further underscored by the recent COVID-19 pandemic. This study focuses on the development of an antibacterial polymer by combining poly-butylene adipate terephthalate (PBAT) with zinc pyrithione (ZnPt). The antibacterial properties were assessed through turbidity analysis, the shaking flask method, and the film adhesion method. The antibacterial activities of the composites with varying ZnPt% (w/w) contents (0, 0.1, 0.3, and 0.5) were evaluated against Escherichia coli (E. coli) and Staphylococcus aureus (S. aureus). Results revealed that even at a low concentration of 0.1% (w/w), the composites demonstrated significant antibacterial activity against both Gram-positive bacteria (S. aureus) and Gram-negative bacteria (E. coli). Composites with ZnPt concentrations of 0.3% (w/w) or higher achieved over 99.999% antibacterial efficacy. Field emission scanning electron microscopy (FE-SEM) analysis of the fracture surfaces of the composites confirmed the uniform distribution of ZnPt particles, ranging from 1-4 ㎛. Further FE-SEM analysis of bacterial suspensions exposed to the composite surfaces showed clear evidence of cell wall destruction in both E. coli and S. aureus. As an antimicrobial biodegradable polymer, PBAT-ZnPt composites show great promise for applications in various sectors, including food packaging.