• International Journal of Concrete Structures and Materials
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• 제2권1호
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• pp.3-8
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• 2008

Polymer-cement composites are known repair materials. The aim of this work is to investigate the influence of various amount of dispersion of carboxylated styrene-butadience copolymer on the selected mechanical properties of polymer-cement concrete (PCC) and on its adhesion to ordinary concrete. The compressive, flexural and tensile strengths as well as frost resistance and fracture resistance of the composites are tested. Adhesion strength of PCC to ordinary concrete, as one of most important performance of good repair material is evaluated and analyzed using three test methods. The results obtained in standard pull-off test are compared with the two other tests. The first one, which is an adaptation of WST (wedge splitting test) characterizes crack propagation in the plane of bond created during repair. In the second test the resistance to shear is a measure of adhesion strength.

• 한국표면공학회지
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• 제45권1호
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• pp.8-14
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• 2012

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

• 한국표면공학회지
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• 제32권6호
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• Elastomers and Composites
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• 제34권3호
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• pp.253-261
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• 1999

조성이 다른 접착제를 포함한 고무혼합물의 가교특성은 접착제 조성에서 탄닌이 많이 포함될수록 스코치 시간은 증가하였으며 경화속도는 다소 감소하는 것으로 보아 탄닌 분자의 크기와 형태 때문에 초기 가교반응을 지연시킴과 동시에 경화속도 역시 다소 지연됨을 알 수 있었다. 이들 고무혼합물의 인장물성 역시 탄닌이 많이 함유된 접착제를 고무에 혼합할수록 고무혼합물의 인장강도는 다소 감소하였다. 이는 탄닌이 많이 함유될수록 가교반응을 지연시켜 전체 고무혼합물의 가교도가 감소하기 때문일 것으로 사료되었다. 또한 접착제의 조성이 고무-섬유 접착에 미치는 영향을 보강코드로서 나일론 610 모노필라멘트를 사용하여 TCAT(Tire Cord Adhesion Test) 방법으로 조사하였다. 레소시놀-탄닌-포름알데히드-라텍스(RTFL) 접착제 조성에서 레소시놀 1 mole당 포름알데히드의 mole 비가 증가할수록 접착력은 증가하였고 대략 포름알데히드 5mole 이상에서 최적의 접착력을 나타냈다. 보강코드상의 접착제 수확량(DPU) 역시 최종 접착력에 영향을 미치지만, 나일론 610 모노필라멘트의 경우는 접착제 조성에 따른 DPU가 거의 일정하여 접착력의 차이는 접착제의 조성 중 탄닌의 거동 때문으로 해석될 수 있었다.

• Corrosion Science and Technology
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• 제4권6호
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• pp.222-225
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• 2005

The adhesion strength of metal plating on PC was studied. In this study, surface was treated by chemical agents or DBD(dielectric barrier discharge) plasma to imporve the adhesion. The surface roughness, contact angle, gloss of plating and adhesive strength were measured. Adhesion strengths of Ni plating on prepared PC by NaOH and KOH solution were $12.3kgf/cm^2$ and $7.5kgf/cm^2$, respectively. The highest adhesion strength was obtained in the plasma treated one, $27.8kgf/cm^2$.

• The Korean Journal of Ceramics
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• 제3권2호
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• pp.105-109
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• 1997

The effects of surface conditions of the C-2 cemented carbide substrate on the adhesion of diamond film were investigated. The substrates were pretreated for different times with Murakami's reagent and then the acid solution of an H2SO4-H2O2. The adhesion strength was estimated by a peeling area around the Rockwell-A indentation. The cutting performance of the diamond-coated tools was evaluated by measuring flank wears in dry turning of Al-17% Si alloy. The morphology of deposited diamond crystallites was dominated by (111) and (220) surfaces with a cubooctahedral shape. The diamond film quality was hardly affected by the surface conditions of the substrate. The variation of tool life with longer substrate etching times resulted from a compromies between the increase of film adhesion at the interface and the decrease of toughness at the substrate surface. The coated tools were mainly deteriorated by chipping and flaking of the diamond film form a lock of adhesion strength, differently from the wear phenomena of PCD tools.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2017년도 추계 학술논문 발표대회
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• pp.165-166
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• 2017

The purpose of this study is to investigate the effect of tile adhesion failure due to weak adhesion with concrete admixture (FA, SP) on walls. The test specimens were divided into four types : (1) OPC 100% (2) OPC 80%+FA 20% (3) OPC 80%+SP 20% (4) OPC 60%+SP 40%, each adhered on a 650 × 650mm wall with 200mm thickness capable of attaching two insulation tiles (300 × 600mm). The tests were carried out on the four types of walls by mortar bedding application method, and after 4 weeks of curing period, adhesion strength test was carried out. The adhesion strength difference was investigated between the concrete wall with added admixture (FA, SP) and general concrete wall.

• 한국표면공학회지
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• 제29권3호
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• pp.157-162
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• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• 접착 및 계면
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• 제7권3호
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• pp.26-33
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• 2006

나일론 직물들이 전류세기 5, 10, 15, 20 A, 공급속도 5, 10, 15 m/min로 코로나 처리되었다. 나일론 직물의 표면변화를 X-ray 회절장치, 주사전자현미경(SEM)과 X-ray 광전자분석기(ESCALAB)로 확인하였다. 또한 물리적 성질의 변화를 인장 인열강도, 접착 및 습윤강도를 통하여 측정하였다. 접착에 사용된 접착제는 열경화성 반응형 폴리우레탄 핫 멜트 접착제이다. 대기압에서 코로나 방전처리에 의해 나일론 직물에 관능기들이 도입되어졌고, 그 결과 접착력은 향상되었다. 코로나 처리된 나일론 직물의 접착강도는 전류 세기가 증가할수록, 공급속도가 감소할수록 증가하였다.

• 한국재료학회지
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• 제19권3호
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.