• International Journal of Concrete Structures and Materials
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• v.2 no.1
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• pp.3-8
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• 2008

Polymer-cement composites are known repair materials. The aim of this work is to investigate the influence of various amount of dispersion of carboxylated styrene-butadience copolymer on the selected mechanical properties of polymer-cement concrete (PCC) and on its adhesion to ordinary concrete. The compressive, flexural and tensile strengths as well as frost resistance and fracture resistance of the composites are tested. Adhesion strength of PCC to ordinary concrete, as one of most important performance of good repair material is evaluated and analyzed using three test methods. The results obtained in standard pull-off test are compared with the two other tests. The first one, which is an adaptation of WST (wedge splitting test) characterizes crack propagation in the plane of bond created during repair. In the second test the resistance to shear is a measure of adhesion strength.

• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.8-14
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• 2012

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• Elastomers and Composites
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• v.34 no.3
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• pp.253-261
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• 1999

The cure properties of rubber compounds containing different adhesive compositions were examined. As the amounts of tannin were increased in the adhesive composition, the scorch time was increased and cure rate was decreased due to the size and shape of tannin molecules. Also, the effect of adhesive composition on the adhesion between rubber and fiber was examined by TCAT(Tire Cord Adhesion Test), The reinforcing cords used in this study were mon ofilaments of nylon 610 and nylon 66. According to the results, the optimum adhesion strength between rubber and fiber could be obtained with adhesives whose molar ratios of formaldehyde/resorcinol were above 5/1 in the recipes. Although the level of dip pick-up(DPU) on the reinforcing cord affects the adhesion strength, the DPU of nylon 610 monofilament did not affect the adhesion strength because the level of DPU was constant regardless of the adhesive compositions. In this case, the adhesion strength with the adhesive composition could be explained with the behavior of tannin in the adhesive.

• Corrosion Science and Technology
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• v.4 no.6
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• pp.222-225
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• 2005

The adhesion strength of metal plating on PC was studied. In this study, surface was treated by chemical agents or DBD(dielectric barrier discharge) plasma to imporve the adhesion. The surface roughness, contact angle, gloss of plating and adhesive strength were measured. Adhesion strengths of Ni plating on prepared PC by NaOH and KOH solution were $12.3kgf/cm^2$ and $7.5kgf/cm^2$, respectively. The highest adhesion strength was obtained in the plasma treated one, $27.8kgf/cm^2$.

• The Korean Journal of Ceramics
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• v.3 no.2
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• pp.105-109
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• 1997

The effects of surface conditions of the C-2 cemented carbide substrate on the adhesion of diamond film were investigated. The substrates were pretreated for different times with Murakami's reagent and then the acid solution of an H2SO4-H2O2. The adhesion strength was estimated by a peeling area around the Rockwell-A indentation. The cutting performance of the diamond-coated tools was evaluated by measuring flank wears in dry turning of Al-17% Si alloy. The morphology of deposited diamond crystallites was dominated by (111) and (220) surfaces with a cubooctahedral shape. The diamond film quality was hardly affected by the surface conditions of the substrate. The variation of tool life with longer substrate etching times resulted from a compromies between the increase of film adhesion at the interface and the decrease of toughness at the substrate surface. The coated tools were mainly deteriorated by chipping and flaking of the diamond film form a lock of adhesion strength, differently from the wear phenomena of PCD tools.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2017.11a
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• pp.165-166
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• 2017

The purpose of this study is to investigate the effect of tile adhesion failure due to weak adhesion with concrete admixture (FA, SP) on walls. The test specimens were divided into four types : (1) OPC 100% (2) OPC 80%+FA 20% (3) OPC 80%+SP 20% (4) OPC 60%+SP 40%, each adhered on a 650 × 650mm wall with 200mm thickness capable of attaching two insulation tiles (300 × 600mm). The tests were carried out on the four types of walls by mortar bedding application method, and after 4 weeks of curing period, adhesion strength test was carried out. The adhesion strength difference was investigated between the concrete wall with added admixture (FA, SP) and general concrete wall.

• Journal of the Korean institute of surface engineering
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• v.29 no.3
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• pp.157-162
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• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• Journal of Adhesion and Interface
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• v.7 no.3
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• pp.26-33
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• 2006

Nylon fabrics were corona treated with different current intensity (5, 10, 15, 20 A) and feeding speed (5, 10, 15 m/min). We confirmed the change of nylon fabrics surface using X-ray diffraction apparatus, scanning electron microscopy (SEM) and X-ray photoelectron spectrometer (ESCALAB). And the change of physical properties through measuring the tensile strength, tear strength, bonding and wet bonding strength. Thermosetting reactive polyurethane hot melt adhesive was used in the adhesion of nylon fabrics. Functional groups were introduced on nylon fabric surface by treating the fabrics in air atmosphere with corona discharge, and the result adhesion was improved. Bonding strength of the nylon fabric treated with corona was increased with increasing current intensity and decreasing feeding speed.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.