• Journal of Welding and Joining
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• v.24 no.4
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• pp.39-49
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• 2006

The austenite grain growth model in low alloyed steel HAZ without precipitates was proposed by analyzing isothermal grain growth behavior. Steels used in this study were designed to investigate the effect of alloying elements. Meanwhile, a systematic procedure was proposed to prevent inappropriate neglect of initial grain size (D0) and misreading both time exponent and activation energy for isothermal grain growth. It was found that the time exponent was almost constant, irrespectively of temperature and alloying elements, and activation energy increased with the addition of alloying elements. From quantification of the effect of alloying elements on the activation energy, an isothermal grain growth model was presented. Finally, combining with the additivity rule, the austenite grain size in the CGHAZ was predicted.

• Journal of the Korean Society for Heat Treatment
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• v.23 no.5
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• pp.239-244
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• 2010

Influence of Zr addition on grain stability at elevated temperatures has been investigated for extruded pure Mg and Mg-0.25%Zr alloy. The grain size of pure Mg increases rapidly with increasing annealing temperature when isochronally annealed for 60 min from 573 to 773 K, whereas the grains are stable up to 723 K for the Zr-containing alloy. The activation energies for grain growth ($E_g$) at this temperature range were determined as 75.3 and 105.9 kJ/mole for the pure Mg and Mg-0.25%Zr alloy, respectively. TEM observations on the annealed Mg-Zr samples revealed that higher thermal stability and higher activation energy for grain growth resulting from Zr addition in Mg may well be associated with the restriction of grain growth by nano-sized Zr particles distributed in the microstructure.

• Journal of the Korean Ceramic Society
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• v.35 no.4
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• pp.347-354
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• 1998

Densification and grain growth behaviors of ITO ceramics were investigated as a function of TiO2 ad-ditions. TiO2 addition led to inhibition of the grain growth and promotion of the densification of ITO ceram-ics. From the microstructure observation it was found that the crack-like voids which were formed in pure ITO specimens decreased with increase of TiO2 additon. The grain growth exponent(n) was measur-ed to be 4 for pure ITO 3 for TiO2-doped ITO specimens respectively. It was supposed that the grain boun-dary migration of pure ITO ceramics was controlled by the pores which were moved by surface diffusion. On the contrary the grain boundary migration of TiO2-doped ITO specimens was depressed by solute drag effect. The activation energies for grain growth were measured to be 1013 kJ/mol for pure ITO ceramics and 460kJ/mol for TiO2-doped ITO specimens respectively.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.2
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• pp.78-84
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• 2001

The binary forsterite($Mg_2SiO_4$)/spinel ($MgAl_2O_4$) system, a possible refractory for industrial applications, is investigated for their density and grain growth the same firing conditions as the each component material between $1400^{\circ}C$ and $1700^{\circ}C$ ($1650^{\circ}C$). The forsterite grain growth exponent is established to be equal to 5 for all compositions within this binary system. Generally; the spinel addition to forsterite inhibited the forsterite grain growth. The activation energies for the forsterite grain growth of the eight compositions(weight ratio of forsterite/spinel) within the binary system are determined to be: 952$\pm$79(95/5), 363$\pm$37(90/10), 219$\pm$21(80/20), 220$\pm$44(70/30), 112$\pm$16(50/50), 112$\pm$23(30/70), 198$\pm$26(10/90), and 121$\pm$12(5/95) KJ/mol. The more forsterite is contained within the binary system, the higher value the activation energy for forsterite grain growth. It is considered that the forsterite grain growth at the higher forsterite compositions are more inhibited by spinel than that of the lower forsterite compositions.

• Journal of the Korean Society for Heat Treatment
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• v.17 no.3
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• pp.139-145
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• 2004

Equal channel angular pressing (ECAP) technique had been adapted to the Mg alloy (AZ31) for achieving effective grain refinement through severe deformation. The average grain size of $2.5{\mu}m$ could be obtained after 4 passes. The stability of the ECAPed structure at elevated temperatures was examined by annealing the ECAPed materials over a wide range of temperature between 473 and 748 K. The average activation energy, Q, for static grain growth of 1, 2 and 3 passes was 33.7 kJ/mole (=0.25QL, activation for lattice diffusion). The abnormally low Q value in the lower temperature range may indicate that grain growth occurs in the unrecrystallized microstructure where non-equilibrium grain boundaries containing a large number of extrinsic dislocations exist. The yield stresses of the ECAPed alloys decreased whereas the elongations increased after the ECAP process. These results should be related to the modification of texture for easier slip on basal plane.

• Bulletin of the Korean Chemical Society
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• v.33 no.8
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• pp.2483-2488
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• 2012

The X-ray line broadening technique was used to calculate the grain size of MgO at 1023, 1123, 1223 K respectively either in $CO_2$ or during the thermal decomposition of magnesites in air as well as in vacuum. By referring to the conventional grain growth equation, $D^n=kt$, the activation energy and pre-exponential factor for the process in air are gained as 125.8 kJ/mol and $1.56{\times}10^8\;nm^4/s$, respectively. Ranman spectroscopy was employed to study the surface structure of MgO obtained during calcination of magnesite, by which the mechanism of grain growth was analyzed and discussed. It is suggested that a kind of highly reactive MgO is produced during the thermal decomposition of magnesites, which is exactly the reason why the activation energy of the grain growth during the thermal decomposition of magnesite is lower than that of bulk diffusion or surface diffusion.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.1
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• pp.43-49
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• 1999

In the paper, Significant sintering phenomena at refractory temperature ranges, from $1400^{\circ}C$ to $1700^{\circ}C$, of the pure spinel ($MgAl_{2}O_{4}$) and the experimental data from other researchers are analysed and compared in terms of density ($\rho$), grain growth exponent(n), and activation energy (Q). Similar to the density rewsults, the grain growth results above $1600^{\circ}C$ appear similar for the spinel, but for temperatures lower than about $1600^{\circ}C$ results are distinctly differently grouped. However, the grain growth exponents are different, six for the spinel (below $1600^{\circ}C$), and five at high temperatures(above $1600^{\circ}C$), with the activation energy of 474$\pm$38 kJ/mol below $1600^{\circ}C$, which is very close to the published values, 360~580 kJ/mol.

• Journal of the Korean Ceramic Society
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• v.19 no.2
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• pp.127-132
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• 1982

This experiment has been carried out for the purpose of investigating the effect of additives on densification and grain growth in magnesium oxide by a two-step process; hot pressing and heat treating. MgO powder has been obtained by calcining extra reagent grade MgCO3 at 90$0^{\circ}C$ for 30 minutes, and additives have been added to $MgCO_3$ in the form of soluble salts-Al$(NO_3)_3$$. $9H_2O$ and $Cr(NO_3)_3$.9H_2O$. The hot pressing has been carried out with changes of soaking time at 125$0^{\circ}C$ under the pressure of 250kg/$\textrm{cm}^2$, and the heat treating also at same temperature. The initial particle size of MgO measured by particle size analyzer was 0.86 microns. Densification rate obeyed the equation D=K lnt + C, and grain growth rate obeyed the equation G-G0=kt1/2. It was vaporization of some $Cr_2O_3$ and formation of solid solution that had an influence on desification of MgO containing $Cr_2O_3$. Activation energy for grain growth of pure MgO was 62.4 kcal/mole, therefore grain growth was supposed to be diffusioncontrolled process. But after heat treatmeat, excess additives were expected to slow down the grain growth by the formation of second phase or the solute atoms at grainboundary.

• Journal of the Korean Ceramic Society
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• v.30 no.5
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• pp.404-410
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• 1993

The characterization and sintering behavior of ZnO powders prepared by precipitation method were investigated. ZnO powders were synthesized using the aqueous solutions of ZnCl2 and NH4OH as a precipitation agent, which were crystallized in the shape of plate-like. The grain growth of ZnO(0.68${\mu}{\textrm}{m}$, 1.3${\mu}{\textrm}{m}$ and 3.4${\mu}{\textrm}{m}$) has been studied for temepratures from 100$0^{\circ}C$ to 130$0^{\circ}C$, and the rate of densification was inversely proportional to the ZnO particle size. Densification proceeded slowly by diffusion mechanisms above at 100$0^{\circ}C$. In this work, the grain growth kinetic exponent(n) was 3. The temperature dependence of ZnO grain growth was plotted, and the activation energy of grain growth was 75~85Kcal/mol.