• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1132-1133
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• 2006

Metal-bonded diamond impregnated tools are being increasingly used in the processing of stone and ceramics, road repair, petroleum exploration, etc. Although the main tool wear mechanisms have been identified, the scientific background is inadequate and fundamental research has to be carried out to better understand the tool field behaviour. This work addresses the complex issues of modelling abrasive wear of the metallic matrix under laboratory conditions. The generated data indicates that the matrix wear resistance can be assessed in a simple manner; whereas tests carried out on diamond impregnated specimens may aid prediction of the tool life in abrasive applications.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.12
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• pp.1253-1258
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• 2013

Ceramic particles as polishing abrasives are often used in a magnetic abrasive polishing process because they have strong wear resistance. Non-ferromagnetic ceramic abrasives should be mixed with ferromagnetic iron particles for controlling the mixture within a magnetic brush during the polishing process. This study describes the application of the ceramic particles for the magnetic abrasive polishing. The distribution of the magnetic abrasives attached on a tool varies with magnetic flux density and tool rotational speed. From the correlation between abrasive adhesion ratio in the tool and surface roughness produced on a workpiece, practical polishing conditions can be determined. A step-over for polishing a large sized workpiece is able to be selected by a S curve, and an ultrasonic vibration assisted MAP produces a better surface roughness and increases a polishing efficiency.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• Journal of Welding and Joining
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• v.16 no.1
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• pp.114-124
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• 1998

The effect of matrix phase (austenite, pearlite, martensite) on the low stress abrasion resistance in the chromium-carbide-type high Cr white iorn hardfacing weld deposites has been investigated. In order to examine matrix phase, a series of alloys with different matrix phase by changing the ratio of Cr/C system by heat treatment were employed. The alloys were deposited twice on a mild steel plate using self-shielding flux cored arc welding process. The low stress abrasion resistance of the alloys against sands was measured by the Dry Sand/Rubber Wheel Abrasion Test(RWAT). Even though formation of pearlite phase in the matrix showed higher hardness than that of austenite, there was no observable difference in wear resistance between the pearlite and austenite phase for the same amount of chromium-carbide in the matrix. On the other hand, the formation of martensitic phase,, from heat treated austenitic alloys (high content of Cr), enhanced wear resistance due to its fine secondary precipitates.

• Journal of Korea Foundry Society
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• v.19 no.1
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• pp.33-37
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• 1999

White cast iron of 3%C-10%Cr-5%Mo-5%W was casted, and then heat treated with three different methods such as homogenizing, austenitizing and tempering to observe its effects on the microstructure, hardness and abrasive wear resistance. In uni-directional soldification, bamboo tree-like $M_7C_3$ carbide grew along with the heat flow direction, and fishbone-like $M_6C$ carbide was dispersed randomly among $M_7C_3$ carbides. While almost pearlitic structures were observed in the as-cast specimen, those of the heat treated specimens consisted of secondary carbide, retained austenite and tempered martensite. In austenitized specimen, the amounts of retained austenite were 60.88% due to the higher cooling rate encountered in forced air cooling. On the other hand, the amounts of retained austenite were reduced from 60.88% to 23.85% in tempered specimen due to the transformation of austenite into tempered martensite. The hardness of tempered specimen showed the highest value, and then decreased in the order of austenitized, as-cast and homogenized specimens. But, the abrasive wear resistance of austenitized specimen was the highest, and then decreased in the order of tempered, as-cast and homogenized specimens.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.6
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• pp.1533-1541
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• 1990

Cubic boron nitride (CBN) is known the second hardest material followed diamond and was provided industry as an abrasive grain in the late 1960's. Since the introduction of CBN, a large amount of research has been carried out to determine the best application condition for grinding operation. Despite the advantages in its characteristics, CBN has not yet gained full acceptance as more excellent abrasive grain than traditional one. The reason for this state is that the surface roughness ground by CBN is worse than by traditional one and dressing and truing is very difficult. This led user's resistance to the use of CBN as an abrasive grain. Present study is to investigate the cause of lower surface roughness ground by CBN single crystal abrasive grain comparing with traditional one.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.12
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• pp.192-199
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• 2001

Chemical mechanical planarization (CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There hale been serious problems in CMP in terms of repeatability and deflects in patterned wafers. Especial1y, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasives and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using CeO$_2$is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method fur developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.148-153
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• 2007

The effect of silicon carbide (SiC) and graphite fillers incorporation on the abrasive wear behaviour of glass-vinyl ester (G-V) composites have been investigated. The three-body abrasive wear behaviour was assessed by rubber wheel abrasion tests (RWAT). The worn surfaces were examined using scanning electron microscopy (SEM). The addition of SiC and graphite fillers in G-V composite improves the abrasion resistance under different loads/abrading distances. The SEM studies indicate the reasons for failure of composites and influencing parameters.

• Journal of Korea Foundry Society
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• v.14 no.5
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• pp.447-454
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• 1994

Wear resistance and wear mechanism of hypereutectic Al-($15{\sim}40$)wt%Si alloys were investigated. Primary Si particles under $20{\mu}m$ size were formed in hypereutectic Al-Si alloy powders due to rapid solidification. But the Si particles of extruded bars were finely distributed in smaller size than that of atomized powders. The wear mechanism of hypereutectic Al-Si alloys was divided into three types of wear phenomena, which were abrasive wear, delamination wear and severe adhesive wear according to sliding speed and load. At low sliding speed and load, wear mechanism was abrasive wear, so Al-15wt%Si alloy showed the best wear resistance. At high sliding speed and load, wear mechanism was adhesive wear, and Al-40wt%Si alloy showed the best wear resistance.

• Journal of Welding and Joining
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• v.16 no.1
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• pp.125-133
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• 1998

The effect of volume fraction of Cr carbide phase (Cr CVF) on the low stress abrasion resistance in the chromium-carbide-type high Cr white iron hardfacing weld deposits has been investigated. In order to examine Cr CVF, a series of alloys with varying Cr CVF by changing chromium and carbon contents and the ratio of Cr/C were employed. The alloys were deposited once or twice on a mild steel plate using the self-shielding flux cored arc welding process. The low stress abrasion resistance of the alloys against sands was measured by the Dry Sand/Rubber Wheel Abrasion Test (RWAT). It was shown that hardness and abrasion resistance increased with increasing Cr CVF within the whole test range (Cr CVF : 0.23-0.64). Both primary Cr carbide and eutectic Cr carbide were particularly effective in resisting wear due to their high hardness.