• Title/Summary/Keyword: Abrasive Size

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The Effect of Abrasive particles on Brake Performance (자동차 제동특성에 미치는 연마제의 영향에 관한 연구)

  • Hong, Young-Suk;Jang, Ho
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2000.11a
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    • pp.332-340
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    • 2000
  • Friction properties of automotive brake pads containing different types of abrasivess were investigated. Five different abrasives, including o-quartz, magnesia, magnetite, alumina, zircon, were employed in this investigation and size effects of the abrasives on friction characteristics were also studied using 1, 50, 140$\mu\textrm{m}$ size zircon. Experimental results showed that the hardness and size of these abrasive particles were strongly related to friction behaviors and wear mechanisms. Harder and smaller abrasives showed higher friction coefficient and more wear. The surfaces of friction materials with different sizes of abrasives showed that two different modes of abrasion (two-body and three-body abrasion) appeared during sliding. Considering the above results, abrasive materials were thought to destroy transfer film and the extent of the destruction depends on the types and sizes of abrasive particles. A mechanism of the wear mode transition (two-body to three body abrasive motion) was suggested considering the binding energy and friction energy in terms of abrasive particle size.

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The effect of abrasive size and shape on W CMP (W CMP 공정에서 abrasive size 와 shape 영향성)

  • Park, Joon-Sang;Park, Jung-Hun;Lee, Jae-Dong;Hong, Chang-Ki;Cho, Han-Ku;Moon, Joo-Tae;Ryu, Byoung-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07a
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    • pp.243-246
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    • 2004
  • W CMP 공정에서 abrasive 의 size 및 shape 에 따른 CMP 거동에 대해 관찰하였으며, 주요 제거 막질인 W 막질과 stopping layer 로 사용되는 Oxide 막질에 대한 압력(P)과 상대 속도(V) 영향성을 관찰하였다. CMP 제거량이 입자의 size 변화에 의존한다는 기존의 이론과는 달리 응집도(aggregate ratio) 변화가 주요 변수임을 밝혀 내었다. 한편, 각 막질에 대한 P,V 영향성 평가를 통해, 변형된 Prestonian equation 이 abrasive size 및 shape 에 상관없이 W 막질의 제거 거동을 설명하는데 중요한 역할을 수행함을 보였다. 그렇지만, W CMP 공정에서 stopping layer 로 사용되는 oxide 막질의 거동을 설명하는 데에는 어려움이 있었으며, 특히 P,V 에 의한 비선형적 removal rate(RR) 거동발생으로 인해 기존의 이론치와는 많은 차이를 나타내었다. 또한, abrasive size 와 shape 에 따라서도 복잡한 거동을 나타낸다.

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Stick-slip in Chemical Mechanical Polishing Using Multi-Particle Simulation Models (다수의 연마입자를 고려한 CMP 공정의 Stick-Slip 고찰)

  • Jung, Soyoung;Sung, In-Ha
    • Tribology and Lubricants
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    • v.34 no.6
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    • pp.279-283
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    • 2018
  • In this study, we investigate the behavior of abrasive particles and change of the stick-slip pattern according to chemical mechanical polishing (CMP) process parameters when a large number of abrasive particles are fixed on a pad. The CMP process is simulated using the finite element method. In the simulation, the abrasive grains are composed of those used in the actual CMP process. Considering the cohesion of the abrasive grains with the start of the CMP process, abrasive particles with various sizes are fixed onto the pad at different intervals so that stick-slip could occur. In this analysis, we determine that when the abrasive particle size is relatively large, the stick-slip period does not change as the pressure increases while the moving speed is constant. However, if the size of the abrasive grains is relatively small, the amount of deformation of the grains increases due to the elasticity of the pad. Therefore, the stick-slip pattern may not be observed. As the number of abrasive particles increases, the stick-slip period and displacement decrease. This is consistent with the decrease in the von Mises yield stress value on the surface of the wafer as the number of abrasive grains increases. We determine that when the number of the abrasive grains increases, the polishing rate, and characteristics are improved, and scratches are reduced. Moreover, we establish that the period of stick-slip increases and the change of the stick-slip size was not large when the abrasive particle size was relatively small.

Effects of Abrasive Size and Impact Angle on the Contact Stress in Abrasive Machining Process (입자연마가공에서의 입자크기 및 충돌각의 영향에 대한 고찰)

  • Kwak, Haslomi;Kim, Wook-Bae;Sung, In-Ha
    • Tribology and Lubricants
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    • v.27 no.1
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    • pp.34-39
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    • 2011
  • In this study, finite element analysis of particle-surface collision using 2-dimensional elements was performed to observe the effects of abrasive size and impact angle. The result of the simulation on the change in abrasive size revealed that larger abrasive particle induced larger contact stress due to force transfer through slurry fluid as the particle moved and pushed the fluid. This observation brought an important finding that the slurry fluid could make the workpiece surface soften and then change the mechanical properties of the surface layer such as elastic modulus and yield strength. As for the impact angle, it was found that the contact stress increased with the angle of impact and jumped up at a specific angle. Such result would be attributed to the complex effects of the impact velocity and angle.

The Influence of Diamond Abrasive Size on the Life of Tungsten Carbide Wet Drawing Dies (다이아몬드 연마재 입도가 초경 습식신선 다이스 수명에 미치는 영향)

  • Lee, S.K.;Kim, M.A.;Ko, D.C.;Kim, B.M.
    • Transactions of Materials Processing
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    • v.15 no.7 s.88
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    • pp.518-523
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    • 2006
  • Wet wire drawing of brass coated steel wire, used for tire reinforcement, is realized with Tungsten Carbide(WC) dies sintered with a cobalt(Co) binder. Dies wear represents an important limitation to the production process and cost savings. Several parameters, such as Co content, WC grain size of tungsten carbide, sintering conditions, and so on, affect on the wear of the drawing die. In this study, the effect of the diamond abrasive particle size on the life of the WC centered dies of the wet wire drawing was investigated. Wet wire drawing experiments were carried out on a wet wire drawing machine. From the experiments, the dies life, dies fracture, wire surface roughness, and wire breaks were investigated. From the results, it was found that the wear of the WC dies increased with the increase in the diamond abrasive particle size.

Magnetic Abrasive Deburring Character Analysis According to the powders (Powder의 특성에 따른 Magnetic Abrasive Deburring 특성분석)

  • ;;Yuri M. Baron;Vladimir S. Polyshuk
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1877-1880
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    • 2003
  • We were interest in Deburring using MAF(magnetic abrasive finishing) method. So Magnetic inductor was designed and manufactured to generate proper magnetic induction fer deburring the burr formed in drilling SM45C. We experienced according to the Rotational speed, table feed rate, grain size of powder and working gap are changed to investigate the effect on deburring. At this time we experienced in abrasive effect mainly.

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A study on the friction force caused by abrasives in chemical mechanical polishing (CMP시 연마입자에 작용하는 마찰력에 관한 연구)

  • Kim, Goo-Youn;Kim, Hyoung-Jae;Park, Beom-Young;Jeong, Young-Suk;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07b
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    • pp.1312-1315
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    • 2004
  • Chemical Mechanical Polishing is referred to as a three body tribological system, because it includes two solids in relative motion and the slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason of not only the friction force but also material removal during polishing. The friction force generated by the abrasives was inspected with the change of abrasive size and concentration in this paper. The variation of coefficient of friction with abrasive concentration and size could result from the condition of contact and load balance between wafer and abrasives carried by pad asperity. The simulation was performed in this paper and compared with the result of experiment. The material removal rate also estimated with abrasive concentration and size increasement.

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Abrasive Water Jet Machining of Alumina Ceramics (어브레이시브 워터제트를 이용한 알루미나 세라믹스의 가공)

  • 최기상;최기흥;김정수
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.8
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    • pp.2073-2080
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    • 1994
  • In this paper, a model of material removal in abrasive water jet machining of brittle material is developed, and experimentally evaluated. Abrasive water jet machining proved to yield better material removal rate than other machining techniques for hard and brittle material (alumina ceramics). It was also found that large scale fracture may develop at the exit of the jet from the material. The fracture size was predicted as a function of water jet pressure and size of the hole. Finally, the feasibility of using acoustic emission signals for in-process monitoring of the abrasive water jet machining process is investigated.

Effect on the Deburring of Spring Collet Burr by Abrasive Flow System (입자유동시스템에 의한 스프링콜릿 버의 디버링 효과)

  • 김정두
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.10a
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    • pp.192-197
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    • 1998
  • Abrasive flow machining is useful to abrasive polish a internal or external surface of the free shape dimensional parts, which are used in many fields such as machine tool parts, semi-conductor, and medical component industries. The machining process is that two hydraulic cylinders, which are located surface to surface, are enforce media to the passage between workpiece and tooling part alternately, and then the abrasives included in the media pass the passage and polish the surface of workpiece. The media which is made of polymer and abrasive plays complex have workpiece by its viscoelastic characteristics. In this study, the media for AMF was made by mixing viscoelastic polymer with alumina and silicon carbide abrasive respectively. As a result, alumina include media is also the experiments of deburring the inside burr of in order to analyse the deburring machinability of abrasive flow machining according to various machining parameters which were media flow rate extrusion pressure, passage gap, media viscosity, abrasive content, and abrasive grain size.

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