• Journal of the Korean Society for Precision Engineering
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• v.15 no.6
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• pp.48-57
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• 1998

Abrasive waterjet(AWJ)은 가공시 열에 의한 가공경화가 없기 때문에 유리, 세라믹, 타이타늄및 금속복합재료와 같은 난삭재의 가공기술로 사용이 증가되었다. Acoustic emission(AE)신호에 의한 AWJ 세라믹 drilling가공시 On-Line Monitoring의 가능성이 고찰되었다. 기계 적인 물성이 서로 상이한 3종류의 세라믹이 본 연구에서 사용되었으며, AE신호는 AWJ drilling의 깊이를 monitoring하는데 유용함을 알 수 있었고 또한 세라믹의 material removal mechanisms을 규명하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.23-26
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• 2002

In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of diluted slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.606-607
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• 2006

A porous material with a surface layer was fabricated using glass abrasive sludge and expanding agents. The glass abrasive sludges were mixed with expanding agents and compacted into pellets. These pellets were sintered in the range of $700-900^{\circ}C$ for 20min. The sintered porous materials had a surface layer with smaller pores and inner parts with larger pores. The surface layer and pores controlled the absorption ratio and physical properties.

• Journal of the Korean Society of Safety
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• v.17 no.3
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• pp.30-35
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• 2002

The magnetic abrasive polishing is the useful method to finish using magnetic power of a magnet. It's not a long time this method was introduced to korea as one of precision finishing techniques. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. The are rarely researcher in this field because of no-effectiveness of magnetic abrasive. The mechanism of this R&D is dealing with the dynamic state of magnet-abusive. This paper deals with mediocritizing magnetic polishing device into regular lathe and this experiment was conducted in order to get the best surface roughness at low cost. We need to continue the research on it. This paper contains the result of experiment to acquire the best surface roughness, not using the high-cost polishing material in processing. The average diameters of magnetic abrasive are the particles of 150$\mu\textrm{m}$, 250$\mu\textrm{m}$.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.22-29
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• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2004.11a
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• pp.330-330
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• 2004

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.4
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• pp.321-326
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• 2005

Chemical mechanical polishing(CMP) process is essential technology to be applied to manufacturing the dielectric layer and metal line in semiconductor devices. It has been known that overpolishing in CMP depends on pattern selectivity as a function of density and pitch, and use of fixed abrasive pad(FAP) is one method which can improve the pattern selectivity. Thus, dishing & erosion defects can be reduced. This paper introduces the manufacturing technique of FAP using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. When applied to tungsten blanket wafers, the FAP resulted in appropriate performance in point of uniformity, material selectivity and roughness. Especially, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with the proposed FAP.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.3-8
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• 1996

To enhance the cutting performance of the tool, single or multilayer coating is applied on the substrate of the tool. Coating material reduces cutting force and heat generation in tool-chip contact zone and enhances resistance against abrasive wear. This paper presents that the effect of different coatings on abrasive wear resistance varies with work material and the flank wear rate is different with depth of cut. Crater wear rate is also found to decrease with higher thermal diffusivity of coating material. It is verified that the estimated thermal diffusivity of multilayer coating has consistent effect on the crater wear.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.3
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• pp.313-320
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• 2010

The magnetic abrasive polishing (MAP) process is used to achieve the nano-meter grade polishing results on flat or complicated surface. In previous study, polishing the stainless steel plate which is a non-magneto-material was tried. To polish non-magneto-materials using the MAP process was very difficult because the process was fundamentally possible by the help of a magnetic force. Therefore, it had lower efficiency than magneto-materials such as SM45C. In this study, optimization for tool geometry of the MAP was performed to improve the magnetic force between tool and workpiece. Moreover, a permanent magnet was installed below the non-magneto-material to improve the magnetic force. And then the design of experiments was carried out to evaluate the effect of the MAP parameters on the polishing results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.109-112
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• 2003

Recently, CMP (Chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. Also, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.