• Title/Summary/Keyword: AR process

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Simulation of large wind pressures by gusts on a bluff structure

  • Jeong, Seung-Hwan
    • Wind and Structures
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    • v.7 no.5
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    • pp.333-344
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    • 2004
  • This paper illustrates application of the proper orthogonal decomposition (POD) and the autoregressive (AR) model to simulate large wind pressures due to gusts on a low-rise building. In the POD analysis, the covariance of the ensemble of large wind pressures is employed to calculate the principal modes and coordinates. The POD principal coordinates are modeled using the AR process, and the fitted AR models are employed to generate the principal coordinates. The generated principal coordinates are then used to simulate large wind pressures. The results show that the structure characterizing large wind pressures is well represented by the dominant eigenmodes (up to the first fifteen eigenmodes). Also, wind pressures with large peak values are simulated very well using the dominant eigenmodes along with the principal coordinates generated by the AR models.

Monitoring of Tool Life through AR Model and Correlation Dimension Analysis (시계열 모델과 상관차원 해석을 통한 공구수명의 감시)

  • 김정석;이득우;강명창;최성필
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.11
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    • pp.189-198
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    • 1998
  • Recently, monitoring of tool life is a matter of common interesting because tool life affects precision, productivity and cost in machining process. Especially flank wear has a direct effect on cutting mechanism, so the various pattern of cutting force is obtained experimentally according to variation of wear condition. By investigating cutting force signal, AR(Autoregressive) modeling and correlation dimension analysis is conducted in turning operation. In this modeling and analysis, we extract features through 6th AR model, correlation integral and normalized correlation integral. After the back-propagation model of the neural network is utilized to monitor tool life according to flank wear. As a result. a very reliable classification of tool life was obtained.

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Characteristics of Two-Step Plasma-Assisted Boronizing Process in an Atmosphere of BCl3-H2-Ar (BCl3-H2-Ar 분위기를 이용한 2단계 플라즈마 보로나이징 특성)

  • Nam, Kee-Seok;Lee, Gu-Hyun;Shin, Pyung-Woo;Song, Yo-Seung;Kim, Bae-Yeon;Lee, Deuk-Yong
    • Journal of the Korean Ceramic Society
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    • v.43 no.6 s.289
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    • pp.358-361
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    • 2006
  • A two-step plasma-assisted boronizing process was carried out on the AISI 1045 steel substrate to reduce the pore density introduced by a conventional single plasma boronizing process. The specimens were plasma boronized for 1 h at $650^{\circ}C$ and subsequently far 7 h at $800^{\circ}C$ in an atmosphere of $BCl_3-H_2-Ar$. The boride layer thickness was parabolic in boronizing time, a high HV reading of 1540 was found up to the boride layer thickness of $25{\mu}m$. It was found that the morphology of the boride layer prepared by the two-step boronizing process was changed from a columnar to a tooth-like structure and the pores in the borided steel were eliminated completely in comparison to those synthesized by the conventional single boronizing process, implying that it is highly applicable for enhancing the dense and compact coating properties of the low-alloy steel.

Characteristics of single/poly crystalline silicon etching by$Ar^+$ ion laser for MEMS applications (MEMS 응용을 위한 $Ar^+$ 이온 레이저에 의한 단결정/다결정 실리콘 식각 특성)

  • Lee, Hyun-Ki;Han, Seung-Oh;Park, Jung-Ho;Lee, Cheon
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.5
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    • pp.396-401
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    • 1999
  • In this study, $Ar^+$ ion laser etching process of single/poly-crystalline Si with $CCl_2F_2$ gas is investigated for MEMS applications. In general, laser direct etching process is useful in microelectronic process, fabrication of micro sensors and actuators, rapid prototyping, and complementary processing because of the advantages of 3D micromachining, local etching/deposition process, and maskless process with high resolution. In this study, a pyrolytic method, in which $CCl_2F_2$ gasetches molten Si by the focused laser, was used. In order to analyze the temperature profile of Si by the focused laser, the 3D heat conduction equation was analytically solved. In order to investigate the process parameters dependence of etching characteristics, laser power, $CCl_2F_2$ gas pressure, and scanning speed were varied and the experimental results were observed by SEM. The aspect ratio was measured in multiple scanning and the simple 3D structure was fabricated. In addition, the etching characteristics of $6\mum$ thick poly-crystalline Si on the insulator was investigated to obtain flat bottom and vertical side wall for MEMS applications.

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Manipulation of Perpendicular Anisotropy in FePt Patterned Media for Ultra-high Density Magnetic Recording

  • Kim, Hyun-Su;Noh, Jin-Seo;Roh, Jong-Wook;Chun, Dong-Won;Kim, Sung-Man;Jung, Sang-Hyun;Kang, Ho-Kwan;Jeung, Won-Yong;Lee, Woo-Young
    • Proceedings of the Korean Magnestics Society Conference
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    • 2010.06a
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    • pp.70-71
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    • 2010
  • In this study, We fabricated FePt-based perpendicular patterned media using a selective combination of E-beam lithography and either Ar plasma etching (deposition-first process) or FePt lift-off (deposition-last process). We employed the deposition-last process to avoid chemical and structural disordering by impinging Ar ions (deposition-first process). For a patterned medium with 100 nm patterns made by this process, the out-of-plane coercivity was measured to be 5 fold larger than its in-plane value. The deposition-last process may be a promising way to achieve ultra-high density patterned media.

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Characteristics of Silicon Nitride Deposited Thin Films on IT Glass by RF Magnetron Sputtering Process (RF Magnetron Sputtering공정에 의해 IT유리에 적층시킨 Silicon Nitride 박막의 특성)

  • Son, Jeongil;Kim, Gwangsoo
    • Korean Journal of Materials Research
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    • v.30 no.4
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    • pp.169-175
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    • 2020
  • Silicon nitride thin films are deposited by RF (13.57 MHz) magnetron sputtering process using a Si (99.999 %) target and with different ratios of Ar/N2 sputtering gas mixture. Corning G type glass is used as substrate. The vacuum atmosphere, RF source power, deposit time and temperature of substrate of the sputtering process are maintained consistently at 2 ~ 3 × 10-3 torr, 30 sccm, 100 watt, 20 min. and room temperature, respectively. Cross sectional views and surface morphology of the deposited thin films are observed by field emission scanning electron microscope, atomic force microscope and X-ray photoelectron spectroscopy. The hardness values are determined by nano-indentation measurement. The thickness of the deposited films is approximately within the range of 88 nm ~ 200 nm. As the amount of N2 gas in the Ar:N2 gas mixture increases, the thickness of the films decreases. AFM observation reveals that film deposited at high Ar:N2 gas ratio and large amount of N2 gas has a very irregular surface morphology, even though it has a low RMS value. The hardness value of the deposited films made with ratio of Ar:N2=9:1 display the highest value. The XPS spectrum indicates that the deposited film is assigned to non-stoichiometric silicon nitride and the transmittance of the glass with deposited SiO2-SixNy thin film is satisfactory at 97 %.

Recovery of Etching Damage of the etched PZT Thin Films With $O_{2}$ Re-Annealing. ($O_{2}$ re-annealing에 의한 식각된 PZT 박막의 식각 damage 개선)

  • Kang, Myoung-Gu;Kim, Kyoung-Tae;Kim, Chang-Il;Chang, Eui-Goo;Lee, Byeong-Ki
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.05b
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    • pp.8-11
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    • 2001
  • In this study. the recovery of plasma induced damage in the etched PZT thin film with $O_2$ re-annealing have been investigated. The PZT thin films were etched as a function of $Cl_2/Ar$ and additive $CF_4$ into $Cl_{2}(80%)/Ar(20)%$. The etch rates of PZT thin films were $1600\dot{A}/min$ at $Cl_{2}(80%)/Ar(20)%$ gas mixing ratio and $1970\dot{A}/min$ at 30 % additive $CF_4$ into $Cl_{2}(80%)/Ar(20)%$. The etched profile of PZT films was obtained above 70 by SEM. In order to recovery properties of PZT thin films after etching, the etched PZT thin films were re-annealed at various temperatures in $O_2$ atmosphere. From the hysteresis curves, ferroelectrical properties are improved by $O_2$ re-annealing process. The improvement of ferroelectric behavior at annealed sample is consistent with the increase of the (100) and (200) PZT phase revealed by x-ray diffraction (XRD). From XPS analysis, intensity of Pb-O, Zr-O and Ti-O peak are increased and the chemical residue peak is reduced by $O_2$ re-annealing. The ferroelectric behavior consistent with the dielectric nature of TixOy is recovered by $O_2$ recombination during rapid thermal annealing process. From AFM images, it shows that the surface roughness of re-annealed sample after etching is improved.

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A Study on the Prediction of the Optimal Welding Condition for Automotive Steel Sheets in MAG Welding Process (자동차용 강판의 MAG 용접시 최적용접조건 선정에 관한 연구)

  • Bang, Han-Sur;Bang, Hee-Seon;Joo, Sung-Min;Ro, Chan-Seung;Sung, Bo-Ram;Suk, Han-Gil
    • Journal of Welding and Joining
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    • v.27 no.3
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    • pp.38-43
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    • 2009
  • The optimization of the welding parameters was studied to maximize the weldability and minimize the amount of spatter in the MAG welding of automotive steel sheets under different shielding gas composition ratio. JS-EFSC, JS-SPHC steel plates and Ar mixture gases were used as a substrate and shielding gas for welding respectively. The five welding parameters were selected through preliminary experiments and their effects on the weldability were analyzed. Experiments were performed using the Taguchi experimental method. As results, appropriate range for welding could be achieved. Amount of spatter in 80%Ar+20%$CO_2$ shielding gas was 20% of that of $CO_2$welding. Therefore, in terms of high productivity and welding cost, Ar mixture gas(80%Ar+20%$CO_2$) was recommended as a shielding gas for application of MAG process, indicating the low spatter and good weld quality.

Study on Damage Reduction of $(Ba_{0.6}Sr_{0.4})TiO_{3}$ Thin Films in $Ar/CF_{4}$ Plasma ($Ar/CF_{4}$ 유도결합 플라즈마에서 식각된 $(Ba_{0.6}Sr_{0.4})TiO_{3}$ 박막의 손상 감소)

  • Kang, Pil-Seung;Kim, Kyung-Tae;Kim, Dong-Pyo;Kim, Chang-Il;Hwang, Jin-Ho;Kim, Tae-Hyung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.171-174
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    • 2002
  • The barium strontium titannate (BST) thin films were etched in $CF_{4}/Ar$ inductively coupled plasma (ICP). The high etch rate obtained at a $CF_{4}(20%)/Ar(80%)$ and the etch rate in pure argon was twice higher than that in pure $CF_{4}$. This indicated that BST etching is sputter dominant process. It is impossible to avoid plasma-induced damages by the energetic particles in the plasma and the nonvolatile etch products. The plasma damages were evaluated in terms of leakage current density, residues on the etched sample, and the changes of roughness. After the BST thin films exposed in the plasma, the leakage current density and roughness increases. In addition, there are appeared a nonvolatile etch byproductsand from the result of X-ray photoelectron spectroscopy (XPS). After annealing at ${600^{\circ}C}$ for 10 min in $O_{2}$ ambient, the increased leakage current density, roughness and nonvolatile etch byproducts reduced. From the this results, the plasma induced damage recovered by annealing process owing to the relaxation of lattice mismatches by Ar ions and the desorption of metal fluorides in high temperature.

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Susceptibility of Stress Corrosion Crack Initiation of Type 304 SS in Simulated Primary Water Environment of PWR (원전 1차 계통수 모사환경에서 Type 304 스테인리스강의 응력부식균열개시 민감도)

  • Sung-Hwan Cho;Sung-Woo Kim;Jong-Yeon Lee
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.20 no.1
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    • pp.25-31
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    • 2024
  • The core shroud of rector vessel internals (RVI) of OPR1000 and ARP1400 is made of Type 304 stainless steel (SS) by bending and welding process that may induce high deformation and residual stress in manufacturing. This work aims to evaluate the susceptibility of stress corrosion crack (SCC) initiation of bent parts of RVI in high temperature primary water environment. For SCC initiation test, tensile specimens were fabricated from the 90 degree bent plate of Type 304 SS (DT specimen), that is an archived part of a Korean APR1400. After the SCC initiation test, the specimen surface was thoroughly examined by optical and scanning electron microscopy, and compared to the specimen fabricated from the as-received plate of Type 304 SS (AR specimen). The surface observation revealed that SCC initiated on the AR specimen surface in typical intergranular (IG) mode, while SCC on the DT specimen occurred in transgrannular mode as well as IG mode. It was also found that the size and number of SCC on the DT specimen were larger than that on the AR specimen. This was attributable to a strain-hardening during the bending process. To compare the susceptibility of SCC initiation, total crack density (TCD) was calculated from the total crack length divided by the measured area of AR and DT specimens. TCD of DT specimen was 4.6 times higher than AR specimen in average, indicating that higher possibility of degradation of bent parts of RVI for a long-term operation.