• Title/Summary/Keyword: AEC/APC

Search Result 1, Processing Time 0.015 seconds

Real-time In-situ Plasma Etch Process Monitoring for Sensor Based-Advanced Process Control

  • Ahn, Jong-Hwan;Gu, Ja-Myong;Han, Seung-Soo;Hong, Sang-Jeen
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.11 no.1
    • /
    • pp.1-5
    • /
    • 2011
  • To enter next process control, numerous approaches, including run-to-run (R2R) process control and fault detection and classification (FDC) have been suggested in semiconductor manufacturing industry as a facilitation of advanced process control. This paper introduces a novel type of optical plasma process monitoring system, called plasma eyes chromatic system (PECSTM) and presents its potential for the purpose of fault detection. Qualitatively comparison of optically acquired signal levels vs. process parameter modifications are successfully demonstrated, and we expect that PECSTM signal can be a useful indication of onset of process change in real-time for advanced process control (APC).