• Title/Summary/Keyword: AA3003

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The Development of ITO Paste for VPT Phosphor Screen Manufacture (VPT 형광막 제조용 ITO Paste의 개발)

  • Lee, Mi-Young;Woo, Jin-Ho;Kim, Young-Bea;Nam, Su-Yong;Lee, Sang-Nam;Moon, Myung-Jun
    • Journal of the Korean Graphic Arts Communication Society
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    • v.22 no.2
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    • pp.73-82
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    • 2004
  • A thermal transfer method was developed novel method to form the phosphor screen for monochrom VPT. This method have advantages of simple process, clean environment, saving raw material and running-cost. But now applying phosphor screen for thermal transfer method has been formed three layers (phosphor layer, ITO layer and thermal adhesive layer) on the PET film as substrate. This is complex process, consumption of raw-material and require of high cost. Also ITO paste at present has been imported from Japan. To improve these problems, we have developed ITO paste as conductive paste by using ITO sol and binder resin (AA3003). Ito paste as developed in this study has both conductive and excellent thermal transfer abilities. Thus we could manufacture phosphor screen formed two layers (phosphor layer and ITO layer).

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A NOVEL APPROACH TO COMPACTLY BRAZE ALUMINUM ALLOYS

  • Qian, Yiyu;Dong, Zhangui;Liu, Jun
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.545-550
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    • 2002
  • In order to ensure the signal could be transported cocrrectly, the microwave devices made of Aluminmn alloys must be assembled and brazed flaw-freely. In this paper, a new approach of using contact reactive brazing (CRB) process to realize the compact brazing of Aluminum alloys was put forward. The reason for this is that CRB, which realizes bonding depending on the liquid alloy produced by metallurgy reaction between the materials to be joined, overcomes the limitation of traditional brazing that the macroscopically disorganized filling flow of liquid filler metal would result in defects in brazed seam. Joint ofLF21 (AA3003) with the compactness of over 95% was brazed by the method of CRB using Si powder as an interlayer. At last, the influence of the physical parameter related to the Si powder interlayer on the compactness of the joints was investigated in detail.

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