• Title/Summary/Keyword: A/D board

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Case study of the Place Name Legends of SEOUL and the Application Plan for the Contents (서울지역 지명전설의 사례와 콘텐츠 활용 방안)

  • Hong, Sung-Kyoo;Jung, Mee-Young
    • The Journal of the Korea Contents Association
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    • v.13 no.12
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    • pp.507-518
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    • 2013
  • Recently, research, development and interest in story-telling has been studied in the cultural industry across the board. In addition, the local legend, history, and the cultural heritage has been increasingly used for the marketing method. This research paper is to find the possibility from the legend, folk story and story-based contents of place names in Seoul. We'd like to find the legendary history and the type related to SEOUL, and to suggest the following application plan to maximize the potential of the contents ; Building a storybank, developing the contents-connected program, developing festivals using the legend and the folk story, developing the legend-connected product, and developing various cultural artistic contents with the place name legends.

Development and Utilization of Digital Telesounder System (디지털 원격 어군 정보 관측시스템의 개발과 이용)

  • 황두진;김동수;백광흠;노천희;정기철
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2000.10a
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    • pp.602-605
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    • 2000
  • This paper describes the development and utilization of digital telesounder system. The digital telesounder system consists of two parts. The one is sea station part, which consist of power, single board computer, A/D converter, and RF modem. The two is land station part, which consist of RF modem, color display, memory system and printer. We obtained good results at the two times of sea experiments. The digital telesounder system is sufficiently good and clear to color display the information of fish school in setnet.

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CRE ECPERIMENT OF KITSAT-1 (우리별 1호에서의 SPACE RADIATION 환경 조사)

  • 신영훈;민경욱;최영완;김성헌
    • Journal of Astronomy and Space Sciences
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    • v.11 no.1
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    • pp.131-145
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    • 1994
  • The Cosmic Ray Experiment (CRE) is one of the modules flown on board the KITSAT-1 satellite and consistes of two sub-systems: the Total Dose Experiment (TDE) and the Cosmic Particl Experiment(CPE). The purpose of CRE is to characterize the space radiation environment as encountered by an Earth-orbiting spacecraft. KITSAT-1 orbit is dominated by the inner Van Allen radiation belt. This region has a large population of high energy protons which contributes significantly to both long-term and transient radiation effects. The data shows that the inner Van Allen radiation belt is very stable and the solar activity influences the CPE, TDE data and SEU(Single Event Upset) rates. The result also shows that much larger high energy particle flux is recorded than the predictions of the CREME code.

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Evaluation of Salmonella cross contamination at retail chicken meat outlets in Kandy, Sri Lanka

  • Alwis, Upeksha S.;Mudannayake, Deshani C.;Jayasena, Dinesh D.;Ubeyarathna, Kamalika J.H.
    • Korean Journal of Agricultural Science
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    • v.41 no.1
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    • pp.35-40
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    • 2014
  • This study was carried out to evaluate the Salmonella cross contamination at retail chicken meat outlets in Kandy, Sri Lanka and to identify the risk factors for Salmonella contamination at retail chicken meat outlets. Fifteen retail chicken meat outlets in Kandy area were randomly selected. Pre-tested questionnaires were used to collect data for identifying risk factors of Salmonella cross contamination at retail outlets and swab samples from meat contact surfaces/utensils were obtained. Out of 57 swab samples collected from meat contact surfaces/utensils, the overall prevalence of Salmonella cross contamination was 21%. Weighing scale (33%), meat containing trays/buckets (27%) and cutting board (25%) showed the highest percentage of Salmonella prevalence whereas knife and showcase showed relatively low percentages, 14% and 9%, respectively. Retail chicken outlets with slaughtering facilities had a significantly higher prevalence of Salmonella cross contamination than those without slaughtering facilities. This higher rate of Salmonella cross contamination at retail chicken meat outlets could be attributed to lack of proper cold chains and minimal facilities, and poor level of hygiene in those outlets.

The Prediction of Nozzle Trajectory on Substrate for the Improvement of Panel-Scale Etching Uniformity (에칭공정에서의 Panel-Scale Etching Uniformity 향상을 위한 에칭노즐 궤적예측에 관한 연구)

  • Jeong, Gi-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.160-160
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    • 2008
  • In practical etching process, etch ant is sprayed on the metal-deposited panel through nozzles collectively connected to the manifold and that panel is usually composed of many PCB(printed circuit board)'s. The etching uniformity, the difference between individual PCB's on the same panel, has become one of most important features of etching process. In this paper, the prediction of nozzle trajectory has been performed by the combination of algebraic formula and numerical simulation. With the pre-determined geometrical factors of nozzle distribution, the trajectories of individual nozzles were predicted with the change of process operational factors such as panel speed, nozzle swing frequency and so on. As results, two dimensional distribution of impulsive force of etchant spray which could be considered as a key factor determining the etching performance have been successfully obtained. Though only qualitative prediction of etching uniformity have been predicted by the process developed in this study, the expansion to the quantitative prediction of etching uniformity is expected to be apparent by this study.

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Studies on Manufacture of Thin Composite Panel for Substitute Use of Plywood (II) - Development of Thin Composite by Composition Type Applied to Optimum Manufacturing Condition - (합판(合板) 대용(代用) 박판상(薄板狀) 복합재(複閤材) 제조(製造)에 관(關)한 연구(硏究) (II) -최상제조조건(最適製造條件)을 적용(適用)한 구성형태별(構成形態別) 박판상(薄板狀) 복합재(複閤材) 개발(開發)-)

  • Lee, Phil-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.23 no.4
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    • pp.74-84
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    • 1995
  • Eight types of thin composite panels were manufactured by press-lam and mat-forming process applied to optimum manufacturing condition, studied in former first research by author (1995). They were tested and compared with control boards on dimensional stability, internal bond strength, tensile strength, Screw withdrawal strength, and bending properties. These thin composite panels manufactured by mat-forming process were generally superior to those by press-lam in dimensional stability and mechanical properties. In the dimensional stability and mechanical properties of thin composite panels manufactured by mat-forming process, the thin composite panels (A and E type) composed of particle or sawdust core and veneer face with polyethylene film, were as good as those of common plywood (control board). Internal bond strength showed highest value in the thin composite panel(D type) which composed of particle core and polypropylene screen face with polyethylene film. The thin composite panels(G and H type) composed of sawdust or particle core and polypropylene screen face with polyethylene film by press-lam and mat-forming process, showed most highest value in dimensional stability and water absorption.

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WLP and New System Packaging Technologies

  • WAKABAYASHI Takeshi
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.53-58
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    • 2003
  • The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

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Design and Implementation for DC Motor controller Using Embedded Target (Embedded Target을 이용한 DC Motor제어가 설계 및 구현)

  • Shin, Wee-Jae
    • Journal of the Institute of Convergence Signal Processing
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    • v.13 no.1
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    • pp.56-62
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    • 2012
  • This paper presents design and implementation of the speed controller for DC motor system using Embeded Target for TI C2000 DSP library in Matlab/Simulink is introduced. Speed controller are easily design and implemented by using the Matlab/Simulink program. Feedback of motor speed is processed through eZdsp F2812 AID converter using encoder and pulse meter as speed sensor. Real-time program of controller is drawn using Simulink and converted program code for speed control of P control, PID control and parameter estimation base adaptive control is downloaded into the TI eZdsp 2812 board. Experiments were carried out to examine validity of speed response for implemented controllers. And even if controlled plant becomes alteration studied controller design and implementation easily method.

A Study on Management of Foreign Seamen on Board Coastal & Offshore Fishing Boats (연근해어선에 승무하는 외국인 어선원의 관리방안)

  • Cha, Cheol-Pyo;Park, Jong-Un
    • Journal of Fisheries and Marine Sciences Education
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    • v.23 no.3
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    • pp.515-525
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    • 2011
  • Due to changes in internal and external environment of coastal & offshore fishery such as decrease in coastal & offshore fishery resources, rising labor costs, rising gas prices, rising turnover rate of seamen, and intensified avoiding 4D types of business, the domestic seamen's avoidance of going to sea is being intensified. In order to solve the problems of domestic seamen shortage, coastal & offshore fishery businesses prefer to employ foreign seamen whose wages are relatively low, so employment of foreign seamen continues to increase. However, the foreign seamen system has the problems in selecting and managing seamen but these problems have been not adequately dealt with, so damages to fishery business continue to occur due to the seamen's deserting. The cases, in which foreigners who entered the country to take the sea in coastal & offshore fishing boats deserted their workplace, recorded 36.4% as of 2010. So in order to achieve the purpose of the foreign seamen system itself through rational management of foreign seamen, the exclusive organization to manage foreign seamen should be established and the system to rationally select foreign seamen who have experiences of fishery should be established. The utilization of foreign seamen during off season needs to be maximized by establishing the employment connection system for the management of foreign seamen and employment stabilization, and the exclusive organization for education of foreign seamen and the organization for nurturing domestic seamen need to be established and operated.

EMI Analysis on High Speed Digital Circuite (고속 디지털 회로 PCB 상의 EMI 해석)

  • Kim, Tae-Hong;Lee, Hyeon-Jin;Lim, Yeong-Seog
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.42 no.12
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    • pp.159-164
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    • 2005
  • Recently, it has demanded high-speed digital circuits as information increase. Therefore, electromagnetic characteristics of compact microwave circuit occurred importantly. And, the effect of the imperfect ground plane on the signal integrity and influence of coupling between two parallel lines for high-speed digital transmission line on the printed circuit board is investigated by FDTD simulations in 3-D electromagnetic analysis method. The results of FDTD simulation are compared with the ADS simulation in commercial software, analyzed lumped element of modeling and electromagnetic wave's radiation of slot as frequency. As a consequence, when the slot in the ground plane is under microstrip line, it has much effect on propagation of wave.