• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2013년 춘계학술대회
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• pp.163-172
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• 2013

In this Paper, We study on establish for unit of measure. Quality means abstract for customer needs. we surveyed unit of measurement of quality feature of Juran, Taguchi, 6 sigma method. We suggest unit of measurement of quality feature. Each enterprise can use defining own unit of measurement of quality feature. Effect is expected in enterprise that these proposals do quality control. There is meaning in direction that measuring mean of quality feature that propose in this treatise understands actuality to be deeply and reconcile exact point of theory.

• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2011년도 추계학술대회
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• pp.157-165
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• 2011

In this Paper, We study on establish for unit of measure. Quality means abstract for customer needs. we surveyed unit of measurement of quality feature of Juran, Taguchi, 6 sigma method. We suggest unit of measurement of quality feature. Each enterprise can use defining own unit of measurement of quality feature. Effect is expected in enterprise that these proposals do quality control. There is meaning in direction that measuring mean of quality feature that propose in this treatise understands actuality to be deeply and reconcile exact point of theory.

• 한국재료학회지
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• 제4권6호
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• pp.704-709
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• 1994

Crystal Structure and Magnetic Properties of $(LaS)_xCrS_2(x \approx 1.20$)가 1273K에서 $La_S_3$ , Cr, S의 혼합물의 반응으로부터 합성되었다. $(LaS)_xCrS_2( x\approx 1.20$)의 XRD회절 pattern은 monoclinic의 LaS-부격자, triclinic의 $CrS_{2}$-부격자와 그들의 초격자로서 해석되었다. 부격자의 온도의존성을 저온에서 X-선 회절분석으로 조사하였다. 77K~실온의 온도역에서 $(LaS)_xCrS_2(x \approx 1.20$)의 자기자화율을 Faraday balance법으로 측정하였다. $(LaS)_xCrS_2(x \approx 1.20$)은 실온 $\sigma$ -H plot에서 paramagnetic한 거동을 나타내었다. 관측된 유효자기 moment($\mu_{eff}$)는 $Cr^{3+}$을 spin-only에 의한 것과 $La^{3+}$을 spin-only와 orbital에 의한 것으로 계산할 경우 잘 일치되었다.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 한국주조공학회지
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• 제26권2호
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• pp.77-84
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• 2006

The effect of alloy composition on the glass forming ability (GFA) of the Ca-rich Ca-Mg-Zn alloys has been investigated in $Ca_{65}Mg_{5+x}Zn_{30-x}$ and $Ca_{55+x}Mg_{15}Zn_{30-x}$ (x=0, 5, 10, 15, 20) alloys. In a wide composition range of 15-25% Zn and 10-20% Mg bulk metallic glass (BMG) samples with the diameter larger than 6 mm are fabricated by conventional copper mold casting method in air atmosphere. Among the alloys investigated, the $Ca_{65}Mg_{15}Zn_{20}$ alloy exhibits the highest GFA enabling to form BMG sample with the diameter of at least 15 mm. The crystalline phase formed during solidification of $Ca_{65}Mg_{15}Zn_{20}$ ($D_{max}=15\;mm$) could be identified as a mixture of $Ca_3Zn$ and $CaMg_2$ cause by the redistribution of the constituent elements on long-range scale. The compressive fracture strength and fracture elongation of the $Ca_{65}Mg_{15}Zn_{20}$ BMG are 602 MPa and 2.08% respectively. The ${\sigma}$ parameter which has been recently proposed for evaluating GFA exhibits better correlation with GFA of Ca-Mg-Zn alloys than other parameters suggested so far such as ${\Delta}T_x$, $T_{rg}$, K, ${\gamma}$, and ${\Delta}T^*$ parameters.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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• pp.23-23
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• 2009

It has been challenging to increase the thermoelectric figure of merit ($ZT=S^2{\sigma}T/\kappa$) of materials, which determine the efficiency of thermoelectric devices, because the three parameters Seebeck coefficient (S), electrical conductivity ($\sigma$), and thermal conductivity ($\kappa$) of bulk materials are inter-dependent. With the development of nanotechnology, ZT values of nanostructured materials are predicted to be enhanced by classical size effects and quantum confinement effects. In particular, Bi nanowires were suggested as one of ideal thermoelectric materials due to the expected quantum confinement effects for the simultaneous increase in Sand. In this work, we have investigated the thermal conductivity of individual single crystalline Bi nanowires with d = 98 nm and d = 327 nm in the temperature range 40 - 300 K using MEMS devices. The for the Bi nanowire with d = 98 nm was observed to be ~ 1.6 W/m-K at 300 K, which is much lower than that of Bi bulk (8 W/m-K at 300 K). This indicates that the thermal conductivity of the Bi suppressed due to enhanced surface boundary scattering in one-dimensional structures. Our results suggest that Bi nanowires grown by stress-induced method can be used for high-efficiency thermoelectric devices.

• 대한기계학회논문집A
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• 제36권2호
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• pp.231-236
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• 2012

본 논문에서는 홀 효과(Hall effect) 기반 회전형 위치 센서의 출력 전압에 대한 선형성 및 민감도를 최적화하기 위해 DFSS(Design for Six Sigma) 방법을 적용하였다. 이를 위해 영구 자석의 치수 및 홀센서에 대한 상대 위치 등을 설계 인자로 하여 완전 요인 배치법을 사용하였다. 설계 인자의 수준별 센서 출력 전압값은 자속 밀도에 대한 Biot-Savart 해석해 및 홀 센서 고유의 자속 밀도-출력 전압에 대한 관계식을 이용하여 구하였다. 최적화된 설계 인자들을 반영하여 제작된 회전형 위치 센서의 개선된 출력 전압 측정 결과를 통해 제안된 방법은 간편하면서 실용적으로도 매우 유용한 방법임을 확인하였다.

• 한국세라믹학회지
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• 제32권11호
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• pp.1292-1300
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• 1995

The ionic conductivity of NASICON solid electrolytes was simulated by using Monte Carlo Method (MCM). There were included two conduction paths: (1) Na1-Na2 and (2) Na1-Na2 including Na2-Na2. We assumed that mid-Na ions provde an additional driving force for Na mobile ions due to the interionic repulsion between Na1 and Na2 ions. The inflection point of vacancy availability factor, V has been shown at nearby x=2, the maximum mid-Na ions. The inflection point of vacancy availability factor, V has been shown at nearby x=2, the maximum mid-Na sites are occupied. The effective jump frequency factor, V has been shown at nearby x=2, the maximum mid-Na sites are occupied. The effective jump frequency factor, W increased rapidly with the composition at low temperature, but decreased at high temperature region. On Na1-Na2 conduction path, the minimum of charge correlation factor, fc and the maximum of $\sigma$T were appeared at x=2.0. this indicated that mid-Na ions affect on the high ionic conductivity behavior. At the whole range of NASICON composition, 1n $\sigma$T vs. 1/T* plots have been shown Arrhenius behavior but 1n (VWFc) vs. 1/T* have been shown the Arrhenius type tendency at x=2, which mid-Na is being the maximum. The results of MCM agreed with the experimental one when the chosen saddle point value was 6$\varepsilon$ : 3$\varepsilon$. Here the calculated characteristic parameter of materials, K and the phase transition temperature were -4.001$\times$103 and 178$^{\circ}C$ (1/T*=1.92, 1000/T=2.22), respectively.

• Macromolecular Research
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• 제12권4호
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• pp.422-426
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• 2004

Solid polymer electrolytes based on poly(ethylene glycol)-polyurethane (PEG-PU) complexed with LiClO$_4$ salt have been prepared by the solvent casting method. A PEG-PU material (PEG:4,4'-diphenylmethane diisocyanate: l,4-butanediol = 1:2:1) was synthesized through a typical two-step condensation reaction. We investigated the effects of the salt concentration on the ionic conductivity ($\sigma$) and the glass transition temperature (T$_{g}$ ) of the complex electrolytes by using alternating current impedance spectroscopy, differential scanning calorimetry, and dynamic mechanical thermal analysis. The measured values of both $\sigma$ and T$_{g}$ exhibited similar tendencies in that they had maxima within the range studied, probably because of two opposite effects, i.e., the increased number of carrier ions and the decreased chain mobility (or increased T$_{g}$ ) caused by the increase in the salt concentration. The highest conductivity, on the order of 2.43 ${\times}$ 10$^{6}$ S$cm^{-1}$ /, was obtained at an [O]/[Li$^{+}$] ratio of ca. 16 (0.92 ㏖ salt per kg of matrix polymer).

• 한국재료학회지
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• 제8권6호
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• pp.526-531
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• 1998

HVPE(hydride vapor phase epitaxy)법으로 (111) $MgAl_2O_4$기판 위에 $10~240\mu{m}$두께의 GaN를 성장하고, GaN의 두께에 따 광학적 성질을 조사하였다. $MgAl_2O_4$기판 위에 성장된 GaN의 PL 특성은 결정성장온도에서 기판으로부터 Mg이 out-diffusion하여 auto-doping 됨으로써 불순물이 첨가된 GaN의 PL 특성을 나타내었다. 10K의 온도데서 측정된 PL 스펙트럼은 자유여기자와 속박여기자의 재결합천이에 의한 피크들과 불순물과 관련된 도너-억셉터 쌍 사이의 재결합 및 이의 포논 복제에 의한 발광으로 구성되었으며, 깊은 준위로부터의 발광은 나타나지 않았다. 중성 도너에 속박된 여기자 발광 에너지와 라만 $E_2$모드 주파수는 GaN의 두께가 증가함에 따라 지수 함수적으로 감소하였으며, GaN 내의 잔류 응력에 대하여 라만 E2 모드 주파수는$\Delta$$\omega$=3.93$\sigma$($cm^{-1}$/GPa)의 관계로 변화하였다.