• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.1
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• pp.8-12
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• 2000

The properties variation by deterioration of the 600V grade heat-resistant polyvinyl chloride insulated wire(HIV) was analyzed. The weight variation of the thermal deteriorated HIV was about 42% at 80$0^{\circ}C$ and over. From the analysis result of the metallurgical microscope photographs it shows that the sorface of normal wire showed the elongated structures. However the elongated structures did not appear at $900^{\circ} and over and we could observe that particles were grown. The grown oxidized substances in the thermally deteriorated electric wire were observed by SEM. The CuL, CuK, $CuK_b$, OK and CIK spectra of the thermally deteriorated HIV at $300^{\circ}C$ were uniform regardless of the scanning length, but the spectra of CIK could not found at above $700^{\circ}. At the DTA analysis, the endothermic reactions were occurred around $3006{\circ}C\; and\; 400^{\circ}C$ and the exothermic reactions were occurred around $470^{\circ}, respectively.

• Fire Science and Engineering
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• v.15 no.1
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• pp.108-115
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• 2001

In this paper, we analyzed the properties change of electric wire when the thermal stress was applied to 600V grade polyvinyl chloride insulated wire (IV). In the structure analysis, normal wire has the properties of direction on the surface, but in case of deteriorated wire at above $400^{\circ}c$, it formed the carbide, the crack and the crystal. The surface composition rate of normal wire was Cu : 100%, but the section composition of the deteriorated wire at $800^{\circ}c$ showed Cu : 78.89%, O : 21.11%. In result of analyzing the differential scanning calory of copper wire, the new reaction peak was observed on the deteriorated wire at above $700^{\circ}c$. In case of the deteriorated wire as $150^{\circ}c$ at the differential thermal analysis, an endothermic reaction appeared at $264^{\circ}c$ lower than the reactive point of normal wire. The occupation rate of oxygen according to the deterioration of copper wire is about 20% at $500^{\circ}c$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.53-56
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• 1999

The weight decreases of the thermal deteriorated IV were rapidly increased at 80$0^{\circ}C$ and over. At the results of the analysis of the metallurgical microscope photographs. the surface of the thermal deteriorated IV at 30$0^{\circ}C$ was mixed with the elongated and original structures of Cu. But the elongated structures could not detected at 90$0^{\circ}C$ and over. The surface structures of SEM were detected a lot of small rounded particles between crystallizations. The EDX spectra of the thermal deteriorated IV at 3$0^{\circ}C$ were uniformly detected CuL, CuK, OK, and CIK, regardless of the scanning length, but the spectra of CIK could not found at 90$0^{\circ}C$. At the DTA curves, the endothermic reactions were occurred at about 25$0^{\circ}C$ to 30$0^{\circ}C$ and 43$0^{\circ}C$, and the exothermic reactions were occurred at about 48$0^{\circ}C$ respectively.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1416-1418
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• 2002

In order to examine the thermal properties of the wire materials, we analyzed the shrinkage, the expansion and the form transformation, the surface structure according to the thermal deterioration temperature through the testing method for a heating shrinkage of Korean Industrial Standard(KS C 3004). For IV(600V grade polyvinyl chloride insulated wires), we measured the shrinkage and the expansion rate, analyzed the surface structure using SEM(Scanning Electron Microscope). In the result of this experiment, the shrinkage rate of IV 2.0mm covering was high in comparison with other wires. As the deterioration temperature rises gradually, the covering is molten and harden.