• Journal of the Korean Ceramic Society
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• v.41 no.1
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• pp.1-8
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• 2004

The microstructural features and mechanical behavior of directionally solidified $(Y_2O_3)ZrO_2/Al_2O_3$ eutectic fibers after extended beat treatment in oxidizing environment were investigated. The fiber was grown continuously by an Edge-defined Film-fed Growth (EFG) technique. The microstructure was characterized using X-Ray Diffraction (XRD) and Scanning Electron Microscopy(SEM). The microstructure of the fiber in the as-fabricated state consists of highly oriented colonv and fine lamellar microstructure along the fiber axis. Tensile strength of the $(Y_2O_3)ZrO_2/Al_2O_3$ eutectic fiber remained unchanged with heat treatment at temperatures between $1200^{\circ}C$ and $1500^{\circ}C$ up to 300h. The weibulls modulus remained fairly constant after extended thermal exposure. The fracture toughness and crack propagation behavior were investigated. The fracture toughness ($K_{1C}$) of the $(Y_2O_3)ZrO_2/Al_2O_3$ eutectic fiber in the as-fabricated state were measured to be 3.6 ${\pm}$ 0.5 MPa${\cdot}m^{1/2}$ by an indentation technique and 2.2 ${\pm}$ 0.2 MPa${\cdot}m^{1/2}$ by assuming elliptical flaw of a semi-infinite solid, respectively. The $(Y_2O_3)ZrO_2/Al_2O_3$ eutectic fiber showed a radial (Palmqvist) crack type and exhibited an orthotropic crack growth behavior under 100 g load.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.882-892
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• 2011

The influence of rhenium (Re) and ruthenium (Ru) addition on the solidification and solute redistribution behaviors in advanced experimental Ni-base superalloys has been investigated. A series of model alloys with different levels of Re and Ru were designed based on the composition of Ni-6Al-8Ta and were prepared by vacuum arc melting of pure metallic elements. In order to identify the influence of Re and Ru addition on the thermo-physical properties, differential scanning calorimetry analyses were carried out. The results showed that Re addition marginally increases the liquidus temperature of the alloy. However, the ${\gamma}^{\prime}$ solvus was significantly increased at a rate of $8.2^{\circ}C/wt.%$ by the addition of Re. Ru addition, on the other hand, displayed a much weaker effect on the thermo-physical properties or even no effect at all. The microsegregation behavior of solute elements was also quantitatively estimated by an electron probe microanalysis on a sample quenched during directional solidification of primary ${\gamma}$ with the planar solid/liquid interface. It was found that increasing the Re content gradually increases the microsegregation tendency of Re into the dendritic core and ${\gamma}^{\prime}$ forming elements, such as Al and Ta, into the interdendritic area. The strongest effect of Ru addition was found to be Re segregation. Increasing the Ru content up to 6 wt.% significantly alleviated the microsegregation of Re, which resulted in a decrease of Re accumulation in the dendritic core. The influence of Ru on the microstructural stability toward the topologically close-packed phase formation was discussed based on Scheil type calculations with experimentally determined microsegregation results.