• Title/Summary/Keyword: 3D Inspection Equipment

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Flip Chip Bump 3D Inspection Equipment using White Light Interferometer with Large F.O.V. (대시야 백색광 간섭계를 이용한 Flip Chip Bump 3차원 검사 장치)

  • Koo, Young Mo;Lee, Kyu Ho
    • Journal of the Korean Institute of Intelligent Systems
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    • v.23 no.4
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    • pp.286-291
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    • 2013
  • In this paper, in-line type flip chip bump 3D inspection equipment, using white light interferometer with large F.O.V., which is aimed to be used in flip chip bump test process is developed. Results of flip chip bump height measurement in many substrates and repeatability test results for the bumps in fixed location of each substrate are shown. Test results from test bench and those from developed flip chip bump 3D inspection equipment are compared and as a result repeatability is improved by reducing the impact of system vibration. A valuation basis for the testing quality of flip chip bump 3D inspection equipment is proposed.

Development of 3D Inspection Equipment using White Light Interferometer with Large F.O.V. (대시야 백색광 간섭계를 이용한 3차원 검사 장치 개발)

  • Koo, Young Mo;Lee, Kyu Ho
    • Journal of the Korean Institute of Intelligent Systems
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    • v.22 no.6
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    • pp.694-699
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    • 2012
  • In this paper, semiconductor package inspection results using white light interferometer with large F.O.V., in order to apply semiconductor product inspection process, are shown. Experimental 3D data repeatability test results for the same special bumps of each substrate are shown. Experimental 3D data repeatability test results for all the bumps in each substrate are also shown. Semiconductor package inspection using white light interferometer with large F.O.V. is very important for the fast 3D data inspection in semiconductor product inspection process. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.

Structure and Fatigue Analyses of the Inspection Equipment Frame of a Semiconductor Test Handler Picker (반도체 테스트 핸들러 픽커 검사장비 프레임에 대한 구조 및 피로해석)

  • Kim, Young-Choon;Kim, Young-Jin;Kook, Jeong-Han;Cho, Jae-Ung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.10
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    • pp.5906-5911
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    • 2014
  • Currently, there are many processes of package assembly and inspections of real fields that examine whether a manufactured semiconductor can be operated regularly and can endure low humidity or high temperatures. As the inspection equipment of a semiconductor test handler picker has been used at the inspection process, these inspection equipment frames were modelled in 3D and these models were analyzed using 3 kinds of fatigue loadings. As the analysis result, maximum deformation occurred at the midparts of the frames at cases 1 and 2. Among the cases of nonuniform fatigue loads, the 'SAE bracket history' with the severest change in load became the most unstable but the 'Sample history' became the most stable. Fatigue analysis result can be used effectively with the design of an inspecting equipment frame of a semiconductor test handler picker to examine the prevention and durability against damage.

Development of Remote Visual Inspection Technology for Calandria & Internal of CANDU NPP (중수로 칼란드리아 내장품 원격 육안검사 기술 개발)

  • Lee, Sang-Hoon;Jin, Seuk-Hong;Moon, Gyoon-Young
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.6 no.1
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    • pp.72-77
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    • 2010
  • During the period of reinforcement work for the licensing renewal of CANDU NPP, the fuel channels, Calandria tubes and feeders of CANDU Reactor are replaced. The remote visual inspection of Calandria internal is also performed during the period of reinforcement work. This period is a unique opportunity to inspect the inside of the Calandria. The visual inspection for the Calandria vessel and its internals of Wolsong NPP Unit 1 was performed by Nuclear Engineering & Technology Institute(NETEC) of KHNP. To perform this inspection, NETEC developed equipment applied new technology such as the synchronization of 3D CAD, automatic alignment and control system. The inspection confirmed that the Calandria integrity of Wolsong NPP Unit 1 is perfect.

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A 3D BGA Inspection Algorithm with Subpixel Accuracy (부화소 정밀도를 가지는 3차원 BGA 검사 알고리즘)

  • 김정훈;박성한;심영석
    • Proceedings of the IEEK Conference
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    • 1999.11a
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    • pp.507-510
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    • 1999
  • Inspection of BGAs presents several challenges for modem measurement equipment. No only must these systems be fast and accurate, they must deal with the special challenges presented by very small shiny metal spheres. For accurate measurement, we propose an algorithm which fits for estimating the accurate ball height using 2-D curve-fitting algorithm. The real boundary between two adjacent pixels and the real ball diameter are measured with subpixel accuracy Experimental results show that the proposed method calculates the ball height and diameter with subpixel accuracy and is robust in local noise with low measurement error.

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Geometric and structural assessment and reverse engineering of a steel-framed building using 3D laser scanning

  • Arum Jang;Sanggi Jeong;Hunhee Cho;Donghwi Jung;Young K. Ju;Ji-sang Kim;Donghyuk Jung
    • Computers and Concrete
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    • v.33 no.5
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    • pp.595-603
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    • 2024
  • In the construction industry, there has been a surge in the implementation of high-tech equipment in recent years. Various technologies are being considered as potential solutions for future construction projects. Building information modeling (BIM), which utilizes advanced equipment, is a promising solution among these technologies. The need for safety inspection has also increased with the aging structures. Nevertheless, traditional safety inspection technology falls short of meeting this demand as it heavily relies on the subjective opinions of workers. This inadequacy highlights the need for advancements in existing maintenance technology. Research on building safety inspection using 3D laser scanners has notably increased. Laser scanners that use light detection and ranging (LiDAR) can quickly and accurately acquire producing information, which can be realized through reverse engineering by modeling point cloud data. This study introduces an innovative evaluation system for building safety using a 3D laser scanner. The system was used to assess the safety of an existing three-story building by implementing a reverse engineering technique. The 3D digital data are obtained from the scanner to detect defects and deflections in and outside the building and to create an as-built BIM. Subsequently, the as-built structural model of the building was generated using the reverse engineering approach and used for structural analysis. The acquired information, including deformations and dimensions, is compared with the expected values to evaluate the effectiveness of the proposed technique.

Development of a Vision System for the Complete Inspection of CO2 Welding Equipment of Automotive Body Parts (자동차 차체부품 CO2용접설비 전수검사용 비전시스템 개발)

  • Ju-Young Kim;Min-Kyu Kim
    • Journal of Sensor Science and Technology
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    • v.33 no.3
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    • pp.179-184
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    • 2024
  • In the car industry, welding is a fundamental linking technique used for joining components, such as steel, molds, and automobile parts. However, accurate inspection is required to test the reliability of the welding components. In this study, we investigate the detection of weld beads using 2D image processing in an automatic recognition system. The sample image is obtained using a 2D vision camera embedded in a lighting system, from where a portion of the bead is successfully extracted after image processing. In this process, the soot removal algorithm plays an important role in accurate weld bead detection, and adopts adaptive local gamma correction and gray color coordinates. Using this automatic recognition system, geometric parameters of the weld bead, such as its length, width, angle, and defect size can also be defined. Finally, on comparing the obtained data with the industrial standards, we can determine whether the weld bead is at an acceptable level or not.

Internal Defects Inspection of Die-cast Parts via the Comparison of X-ray CT Image and CAD Data (CAD 데이터 및 엑스레이 CT이미지 비교를 통한 다이캐스팅 부품의 내부 결함 검사방법)

  • Hong, Gyeong Taek;Shim, Jae Hong
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.1
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    • pp.27-34
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    • 2018
  • Industrially, die-casting products are formed through casting, and so the methods to inspect the defects inside them are very restrictive. External inspection methods including visual inspection, sampling judgment, etc. enables researchers to inspect possible external defects, but x-ray inspection equipment has been generally used to inspect internal ones. Recently, they have been also applying three-dimensional internal inspections using CT equipment. However, they have their own limitations in applying to the use of industrial inspection due to limited detection size and long calculation time. To overcome the above problems, this paper has suggested a method to inspect internal defects by comparing the CAD data of the product to be inspected with the 3D data of the CT image. In this paper, we proposed a method for fast and accurate inspection in three dimensions by applying x-ray inspection to find internal defects in industrial parts such as aluminum die casting products. To show the effectiveness of the proposed method, a series of experiments have been carried out.

A Design and Fabrication of Test Equipment for Airborne Tracking Radar Test (항공기용 추적레이더 시험을 위한 시험장비의 설계 및 제작)

  • Yoon, Seung-Gu;Park, Seung-wook;Kwon, Jun-Bum;Jung, Man-Seek
    • Journal of the Korea Institute of Military Science and Technology
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    • v.20 no.3
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    • pp.352-361
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    • 2017
  • This paper proposes a design and fabrication of the test equipment that is implemented as a part of the airborne tracking radar inspection under the environment of indoor simulation. This test equipment provides controlling the operation status of airborne tracking radar and replicating the velocity and range information of target by generating a variety of target signal. This is mainly composed of radar operation controller, target signal generator, horn antenna driving devices. Radar operation controller is able to perform the controlling of radar operation mode and monitoring in real time by serial communication. Target signal generator is generated doppler signal and range delayed signal using virtual target of RF-band. Horn antenna driving devices perform a role of target simulating exercise. In the end, the performance is demonstrated using experiment results of test equipment for airborne tracking radar.