• Journal of the Korean Institute of Intelligent Systems
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• v.22 no.6
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• pp.694-699
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• 2012

In this paper, semiconductor package inspection results using white light interferometer with large F.O.V., in order to apply semiconductor product inspection process, are shown. Experimental 3D data repeatability test results for the same special bumps of each substrate are shown. Experimental 3D data repeatability test results for all the bumps in each substrate are also shown. Semiconductor package inspection using white light interferometer with large F.O.V. is very important for the fast 3D data inspection in semiconductor product inspection process. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.05a
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• pp.157-158
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• 2019

Reinforcing bars are an important material for tensile strength of structures. For this reason, the inspection of the reinforcing bars confirming the layout and omission is very important for the safety of the structures. However, the current method of inspecting of the reinforcing bars through photographs of specific areas is difficult to identify condition all reinforcing bars. And It is also difficult to confirm after completion of a building. Therefore, reinforcing bar inspection using 3D scanner is required for automation of rebar inspection and database construction. For this purpose, this study test application of automated inspection method for rebar inspection using 3D scanner and discuss the effect of this method.

• Journal of the Korea Institute of Building Construction
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• v.20 no.2
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• pp.191-198
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• 2020

The several smart construction technologies are being introduced to the construction industry, and among these technologies, a few companies are attempting quality control using 3D scanning and BIM. Therefore, in this study, 3D scanning and BIM were applied to cases of on-site quality inspection to confirm the applicability and utility. As a result, it was confirmed that the quality inspection using 3D scanning and BIM was shorter in time than the previously performed quality inspection and can be realized with less manpower. Therefore, it is considered that 3D scanning and BIM-enabled technologies can be applied to various items of quality inspection.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.952-956
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• 1995

It is known that the 3D Solid CAD system can provide various information which is useful for implementing CAPP and CAE. However the commercial 3D CAD systems available today do not support the handling of non-geometric information such as geometry tolerance and surface finish. It is impossible to input the non-geometric information during designof parts while CAPP needs the information for selecting machine tools. fiztures, inspection method, etc. In this paper the need of research on handling tolerance information In 3D CAD systems is considered. The development of inspection planning support system is also explained with an example. The development of inspection planning support systm receives the design geometry information from the 3D CAD system in the form of 2D draft and generates the inspection data base and the inspection sheet through the user interaction.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.173-176
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• 2002

In this paper, we present the combined 2-D and 3-D algorithms for automatic solder paste inspection. For automatic inspection, optical system for the combined inspection and driving unit is made. One-pass run length algorithm that has fast and efficient memory space is applied to the input image fur extracting solder paste patterns. The path of probe movement is then calculated for an automatic inspection. For a fast 3-D inspection, the phase shift algorithm based on Moire interferometry is also used. In addition, algorithms used in this paper are coded by $MMX^{TM}$. A probe system is manufactured to simultaneously inspect 2-D and 3-D for 10mm$\times$10mm field of view, with resolutions of 10 $\mu\textrm{m}$for both x, y axis and 17 $\mu\textrm{m}$for z axis, and then, experiments on several PCBs are conducted. The processing times of 2-D and 3-D, excluding an image capturing, is 0.039 sec and 0.047 sec, respectively. The credible result with $\pm$ 1$\mu\textrm{m}$uncertainty can be also achieved.

• Journal of KIBIM
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• v.3 no.3
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• pp.1-8
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• 2013

In general, a two-dimensional platform were used to manage the structural inspection information. But we performed a study on utilizing 3D model to input and display the information of structure inspection. Coarse and Fine model of structure were used to input the information. 3D model combined with database built from record plan and field inspections data and rating will provide more intuitive and effective environment for inspectors in bridge maintenance.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.06a
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• pp.214-215
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• 2020

The 3D scanning technology is being introduced for quality inspection of building construction. Therefore, this study tried to confirm whether it is possible to check the quality of rebar by using 3D scanning. After rebar placed on the formwork slab was scanned with a 3D scanner, the rebar spacing was confirmed by overlapping with the CAD drawing. As a result, the 3D scanner was able to check the quality of rebar work on one floor at a time. Therefore, 3D scanning could be used for quality inspection of rebar works such as columns, beam and girders, walls, and slabs in the future.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.17-22
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• 2011

LEDs(Light Emitting Diodes) are becoming widely used and increasingly in demand. Quality inspection of the LEDs has become more important. Two-dimensional inspection systems are limited in inspection capability, so threedimensional(3-D) inspection systems are needed. In this paper, a cost-effective and simple 3-D measurement system of LED packages using phase measuring profilometry(PMP) is proposed. The proposed system uses a pico projector to project sinusoidal fringe patterns and to shift phases instead of piezocrystal. It was evaluated using extremely accurate gauge blocks, yielding excellent repeatability of about 12 um(3-sigma). 3-D measurements of various LED packages were performed to demonstrate the applicability and efficiency of the proposed system.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.13 no.1
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• pp.55-62
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• 2013

Automatic inspection system is required for increment of copper plate production and demand expansion. Thus 3D surface form and defect detection of copper plate calls for 3D image and GUI analysis. Limitation of 2D analysis, such as error occurrence and decision difficulty makes eye inspection automatic. Automatic inspection is able to raise accurate inspection rate and productivity efficiency elevation. In this paper defect classification is defined and inspection system is implemented. Defect analysis algorithms and GUI for 3D image analysis is developed and tested.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.41 no.1
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• pp.19-26
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• 2004

In this paper, we suggest a 3D vision inspection method which use only one camera. If we have the database of pattern and can recognize the object, and also estimate the rotated shape of the parts, we can inspect the parts using only one image. We used the 3D database and the 2D geometrical pattern matching, and the rotation transition theory about the algorithm. As the results, we could have the capability of the recognition and inspection of the rotated object through the estimation of rotation an81e. We applied our suggested algorithm to the inspection of typical IC and capacitor, and compared our suggested algorithm with the conventional 2D inspection method and the feature space trajectory method.