• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.81.2-81.2
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• 2012

To fabricate a metal mold for injection molding, hot-embossing and imprinting process, mechanical machining, electro discharge machining (EDM), electrochemical machining (ECM), laser process and wet etching ($FeCl_3$ process) have been widely used. However it is hard to get precise structure with these processes. Electrochemical etching has been also employed to fabricate a micro structure in metal mold. A through mask electrochemical micro machining (TMEMM) is one of the electrochemical etching processes which can obtain finely precise structure. In this process, many parameters such as current density, process time, temperature of electrolyte and distance between electrodes should be controlled. Therefore, it is difficult to predict the result because it has low reliability and reproducibility. To improve it, we investigated this process numerically and experimentally. To search the relation between processing parameters and the results, we used finite element simulation and the commercial finite element method (FEM) software ANSYS was used to analyze the electric field. In this study, it was supposed that the anodic dissolution process is predicted depending on the current density which is one of major parameters with finite element method. In experiment, we used stainless steel (SS304) substrate with various sized square and circular array patterns as an anode and copper (Cu) plate as a cathode. A mixture of $H_2SO_4$, $H_3PO_4$ and DIW was used as an electrolyte. After electrochemical etching process, we compared the results of experiment and simulation. As a result, we got the current distribution in the electrolyte and line profile of current density of the patterns from simulation. And etching profile and surface morphologies were characterized by 3D-profiler(${\mu}$-surf, Nanofocus, Germany) and FE-SEM(S-4800, Hitachi, Japan) measurement. From comparison of these data, it was confirmed that current distribution and line profile of the patterns from simulation are similar to surface morphology and etching profile of the sample from the process, respectively. Then we concluded that current density is more concentrated at the edge of pattern and the depth of etched area is proportional to current density.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.8 no.3
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• pp.181-188
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• 2010

Metal surface decontamination characteristics were investigated by using a laser ablation method. A second harmonic generation of a Q-switched Nd:YAG laser with a wave length of 532 nm, a pulse energy of 150 mJ and a pulse width of 5 ns was employed to assess the decontamination performance for metal surfaces contaminated with $CsNO_3$, $Co(NH_4)_2(SO_4)_2$, $Eu_2O_3$ and $CeO_2$. The ablation behavior was investigated for the decontamination variables such as a number of laser shots, laser fluence and an irradiation angle. Their optimum values were found to be 8, 13.3 J/$cm^2$ and $30^{\circ}$, respectively. The decontamination efficiency was different depending on the kinds of the contaminated ions, due to their different melting and boiling points and was in the order: $CsNO_3>Co(NH_4)_2(SO_4)_2>Eu_2O_3>CeO_2$. We also evaluated a correlation between the metal ablation thickness and the number of laser shots for the different laser fluences.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.127-133
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• 2020

It is important to measure the quantitative adhesive strength between an organic adhesive and a metal adherend. In measuring the adhesive strength between an organic adhesive and a metal adherend, the effect of the kind and thickness of the adherend on the adhesive strength was studied. Two kinds of metal adherends were selected, aluminum (Al1050) and stainless steel (STS304), and a dolly test and a lap shear test were used to measure the adhesive strength. When measuring the adhesive strength between the organic adhesive and the metal adherend by the tensile stress mode of dolly test, the change in the thickness of the metal adherend had little effect on the adhesive strength, however, the adhesive strength was different depending on the kind of the adherend. On the other hand, when measuring the adhesive strength between the organic adhesive and the metal adherend by the lap shear test, the change in the relative thickness of the metal adherend had an effect on the adhesive strength. The reason is that the bending phenomenon of the adherend occurring in the edge of bonding region during the lap shear test contributes to lowering the adhesive strength by generating additional tensile stress in the bonding region. From this work, it is concluded that the dolly test could be widely used when measuring the quantitative adhesive strength of organic adhesives and metal adherend because there is little change in adhesive strength even though the thickness of the adherend is changed.