• Title/Summary/Keyword: 300mm FAB 공정

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Direct Carrier System Based 300mm FAB Line Simulation (Direct 반송방식에 기반을 둔 300mm FAB Line 시뮬레이션)

  • Lee, Hong-Soon;Han, Young-Shin;Lee, Chil-Gee
    • Journal of the Korea Society for Simulation
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    • v.15 no.2
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    • pp.51-57
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    • 2006
  • Production environment of semiconductor industry is shifting from 200mm wafer process to 300mm wafer process. In the new era of semiconductor industry, FAB (fabrication) Line Automation is a key issue that semiconductor industry is facing in shifting from 200mm wafer fabrication to 300mm wafer fabrication. In addition, since the semiconductor manufacturing technologies are being widely spread and market competitions are being stiffened, cost-down techniques became basis of growth. Most companies are trying to reduce average cycle time to increase productivity and delivery time. In this paper, we simulated 300mm wafer fabrication semiconductor manufacturing process by laying great emphasis on reduce average cycle time.

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Real-Time Scheduling System Re-Construction for Automated Manufacturing in a Korean 300mm Wafer Fab (반도체 자동화 생산을 위한 실시간 일정계획 시스템 재 구축에 관한 연구 : 300mm 반도체 제조라인 적용 사례)

  • Choi, Seong-Woo;Lee, Jung-Seung
    • Journal of Intelligence and Information Systems
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    • v.15 no.4
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    • pp.213-224
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    • 2009
  • This paper describes a real-time scheduling system re-construction project for automated manufacturing at a 300mm wafer fab of Korean semiconductor manufacturing company. During executing this project, for each main operation such as clean, diffusion, deposition, photolithography, and metallization, each adopted scheduling algorithm was developed, and then those were implemented in a real-time scheduling system. In this paper, we focus on the scheduling algorithms and real-time scheduling system for clean and diffusion operations, that is, a serial-process block with the constraint of limited queue time and batch processors. After this project was completed, the automated manufacturing utilizations of clean and diffusion operations became around 91% and 83% respectively, which were about 50% and 10% at the beginning of this project. The automated manufacturing system reduces direct operating costs, increased throughput on the equipments, and suggests continuous and uninterrupted processings.

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Clean Room Structure, Air Conditioning and Contamination Control Systems in the Semiconductor Fabrication Process (반도체 웨이퍼 제조공정 클린룸 구조, 공기조화 및 오염제어시스템)

  • Choi, Kwang-Min;Lee, Ji-Eun;Cho, Kwi-Young;Kim, Kwan-Sick;Cho, Soo-Hun
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.25 no.2
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    • pp.202-210
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    • 2015
  • Objectives: The purpose of this study was to examine clean room(C/R) structure, air conditioning and contamination control systems and to provide basic information for identifying a correlation between the semiconductor work environment and workers' disease. Methods: This study was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. The C/R structure and air conditioning method were investigated using basic engineering data from documentation for C/R construction. Furthermore, contamination parameters such as airborne particles, temperature, humidity, acids, ammonia, organic compounds, and vibration in the C/R were based on the International Technology Roadmap for Semiconductors(ITRS). The properties of contamination control systems and the current status of monitoring of various contaminants in the C/R were investigated. Results: 200 mm and 300 mm wafer fabrication facilities were divided into fab(C/R) and sub fab(Plenum), and fab, clean sub fab and facility sub fab, respectively. Fresh air(FA) is supplied in the plenum or clean sub fab by the outdoor air handling unit system which purifies outdoor air. FA supply or contaminated indoor air ventilation rates in the 200 mm and 300 mm wafer fabrication facilities are approximately 10-25%. Furthermore, semiconductor clean rooms strictly controlled airborne particles(${\leq}1,000{\sharp}/ft^3$), temperature($23{\pm}0.5^{\circ}C$), humidity($45{\pm}5%$), air velocity(0.4 m/s), air change(60-80 cycles/hr), vibration(${\leq}1cm/s^2$), and differential pressure(atmospheric pressure$+1.0-2.5mmH_2O$) through air handling and contamination control systems. In addition, acids, alkali and ozone are managed at less than internal criteria by chemical filters. Conclusions: Semiconductor clean rooms can be a pleasant environment for workers as well as semiconductor devices. However, based on the precautionary principle, it may be necessary to continuously improve semiconductor processes and the work environment.