• Transactions of Materials Processing
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• v.15 no.9 s.90
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• pp.673-678
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• 2006

Demands for micro parts have increased with recent advances in IT and machinery industries. However, the present technology loaves much to be desired to effectively produce parts with the volume of $1mm^{3}$ and less by mechanical method in large quantities. This paper provides a method for efficient quantity production of complete micro 3D structure using micro end-milling cutting process. The possibility has proven via manufacturing experiment of a multistage micro complex gear structure of $500{\mu}m$ in length, $500{\mu}m$ in maximum external diameter and a volume of $1mm^{3}$ and less.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.118-121
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• 2004

Manufacturing process for milli components has recently gained researcher's focus with the increasing tendency toward highly integrated and micro-scaled parts for electronic devices. The milli-components cannot be formed by the conventional manufacturing process since the parts require higher dimensional accuracy than the conventional ones. In order to enhance the forming accuracy and productivity, various forming procedures proposed and studied by many researchers. In this paper, forming analysis of milli-components has been studied with a new micro-former. In modeling of progressive dies, multi-stage forming sequence has been analyzed with finite element analysis by LS-DYNA3D. The analysis proposes the sequential die and part shapes with the corresponding punch force and dimensional accuracy. The analysis also considers the effect of elastic dies on the dimensional accuracy of the formed parts. The analysis result demonstrates that the elastic analysis in the milli-forming process is indispensable fur accurate forming analysis. The analysis procedure in the paper will provide good information in design of a new micro-former and milli-component.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.38-42
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• 2002

In the recent, electro-rheological fluid has been used for micro polishing of the 3-dimensional micro-aspherical lens and some sectional parts with defects on the wide flat wafer. The ER fluid has the properties that its viscosity has drastic changed under some electric fields. Therefore, ER fluid can be applicable to the micro polishing fur some parts using these properties. In this paper, the experimental device has been constructed using the precision milling machine in order to micro polishing far some sectional parts of a 4 inches wafer It is consisted of a small steel electrode, a wafer fixture, DC10mA and 5KV power supply unit, and a controller unit. Using the ER experimental device, possibility of amending for wide flat wafer and micro polishing of some micro part has been analyzed.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.12
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• pp.55-61
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• 1998

Recently, the needs of machining technologies of very small parts have been increasing with advent of micro-revolution. These technologies have mostly used the method applied to semi-conductor production process such as LIGA, etc. But they have serious difficulties to settle down in terms of workpiece materials, machining thickness, 3-dimensional structure. Therefore. mciro-machining technology using EDM(Electrical Discharge Machining) was proposed. It is very difficult to machine the micro-parts (microshaft, microhole) using conventional machining. Micro-machining using BDM can machine the micro-parts easily because it requires little machining force. This MEDM(Micro-EDM) need the capabilities to move a electrode and control a discharge energy precisely, and the gap control strategy to maintain the optimal discharge condition is necessary. Therefore, in this study, the new EDM machine with high precision motion stage and high-performance EDM device was developed. Using this MEDM machine, we have machined microshaft and microhole with various shapes and sizes.

• Transactions of Materials Processing
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• v.13 no.5
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• pp.429-434
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• 2004

Manufacturing process for milli components has recently gained researcher's focus with the increasing tendency toward highly integrated and micro-scaled parts for electronic devices. The milli-components need more precise manufacturing process than the conventional manufacturing process since the parts require higher dimensional accuracy than the conventional ones. In order to enhance the forming accuracy and productivity, various forming procedures proposed and studied by many researchers. In this paper, forming analysis of milli-components has been studied with a new micro-former. In modeling of progressive dies, multi-stage forming sequence has been analyzed with finite element analysis by LS-DYNA3D. The analysis proposes the sequential die and part shapes with the corresponding punch force and dimensional accuracy. The analysis also considers the effect of elastic dies on the dimensional accuracy of the formed parts. The analysis result demonstrates that the elastic analysis in the milli-forming process is indispensable for accurate forming analysis. The analysis procedure in the paper will provide good information in design of a new micro-former and milli-component

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.953-956
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• 1997

Micro drilling characteristics by EDM method was investigated. In detail, Micro tool electrode for EDM drilling was machined by use of WEDG method and micro hole was drilled using the machined tool electrode in SUS plate. The machining accuracy and time was compared in a different dielectric fluid. As a result, it was convinced that this method could be utilized as a fabrication technology of micro mold or micro 3 dimensional parts.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.284-287
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• 2002

During resin transfer molding(RTM) process, in case of thick parts, resin flow and void formation should be modeled three dimensionally even though for parts of small thickness, resin flow and void formation can be modeled two dimensionally. In this study, numerical simulations of three dimensional mold filling and void formation during RTM process.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.4
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• pp.3-10
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• 2008

Micro-electrical discharge machining (micro-EDM) is an effective method for machining all types of conductive materials regardless of hardness. Since micro-EDM is an electro-thermal process, the energy supplied by the pulse generator is an important factor in determining the effectiveness of the process. In this study, an investigation was conducted on the micro-EDM of tungsten carbide (WC) to compare the performance of transistor and resistance/capacitance (RC) pulse generators in obtaining the best quality micro-hole. The performance was measured by the machining time, material removal rate, relative tool wear ratio, surface quality, and dimensional accuracy. The RC generator was more suited for minimizing the pulse energy, which is a requirement for fabricating micro-parts. The smaller-sized debris formed by the low-discharge energy of RC micro-EDM could be easily flushed away from the machined zone, resulting in a surface free of burrs and resolidified molten metal. The RC generator also required much less time to obtain the same quality micro-hole in WC. Therefore, RC generators are better suited for fabricating micro-structures, producing good surface quality and better dimensional accuracy than the transistor generators, despite their higher relative tool wear ratio.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.3
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• pp.316-321
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• 2011

Recently, it has been studied machining of micro parts with increasing demands for ultra precision parts. However, many engineering problems have already begun in polishing of optical parts or lens. As a method to overcome such problems, a new technology for the polishing of the target surface is being studied by controlling abrasives using MR fluids which are sensitive to magnetic fields. Since the current MR polishing system uses a big electromagnet, and is difficult to polish micro parts or spherical lens. Therefore, in this study, a round endmill type MR polishing system was developed to polish a three-dimensional structure which has spherical or inclined plane. And then, series of experiments were performed to verify the polishing performance of the developed round endmill type MR polishing system.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.62-71
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• 1999

Integrating micro-machined sensors and actuators on the conventional devices with the copper power lines was incompatible to fabricate the mass produced micro electromechanical system (MEMS) devices. To achieve the compatibility of the wiring method between MEMS parts and devices, we developed the three-dimensional sputter-evaporation system that coats micropatterned thin copper films on the surface of the MEMS element. The system consists of a process chamber, two branch chambers, the substrate holder, and a linear-rotary motion feedthrough. Thin copper film was sputtered and evaporated on the biocompatible polymer, Pellethane$^{circed{R}}$ and silicone, catheter that is 2 mm in diameter and 700 mm in length. The metal film coating technique with three-dimensional thin film sputter-evaporation system was developed to apply the power and signal lines on the micro active endoscope. In this paper, we developed the three-dimensional metal film sputter-evaporation system operated on the low temperature for the biopolymeric substrates used in the medical MEMS devices.