• Korean Journal of Materials Research
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• v.20 no.11
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• pp.617-622
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• 2010

We have studied methods to save Si source during the fabrication process of crystalline Si solar cells. One way is to use a thin silicon wafer substrate. As the thickness of the wafers is reduced, mechanical fractures of the substrate increase with the mechanical handling of the thin wafers. It is expected that the mechanical fractures lead to a dropping of yield in the solar cell process. In this study, the mechanical properties of 220-micrometer-solar grade Cz p-type monocrystalline Si wafers were investigated by varying saw-damage etching conditions in order to improve the flexural strength of ultra-thin monocrystalline Si solar cells. Potassium hydroxide (KOH) solution and tetramethyl ammonium hydroxide (TMAH) solution were used as etching solutions. Etching processes were operated with a varying of the ratio of KOH and TMAH solutions in different temperature conditions. After saw-damage etching, wafers were cleaned with a modified RCA cleaning method for ten minutes. Each sample was divided into 42 pieces using an automatic dicing saw machine. The surface morphologies were investigated by scanning electron microscopy and 3D optical microscopy. The thickness distribution was measured by micrometer. The strength distribution was measured with a 4-point-bending tester. As a result, TMAH solution at $90^{\circ}C$ showed the best performance for flexural strength.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.35 no.2
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• pp.73-82
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• 2022

The study presents a three-dimensional approach to simulate the nonlinear behavior of a 72 m long Ultra High Performance Fiber Reinforced Concrete (UHPFRC) pre-stressed box girder for a pedestrian bridge in Busan, South Korea. The concrete damage plasticity (CDP) model is adopted to model the non-linear behavior of the UHPFRC material, in which the material properties are obtained from uniaxial compressive and tensile tests. The simulation model based on the proposed stress-strain curve is validated by the results of four-point bending model tests of a 50 m UHPFRC pre-stressed box girder. The results from the simulation models agree with the experimental observations and predict the flexural behavior of the 50 m UHPFRC pre-stressed box girder accurately. Afterward, the validated model is utilized to investigate the flexural behavior of the 72 m UHPFRC pre-stressed box girder. Here, the load-deflection curve, stress status of the girder at various load levels, and connection details is analyzed. The load-deflection curve is also compared with design load to demonstrate the great benefit of the slender UHPFRC box girder. The obtained results demonstrate the applicability of the nonlinear finite element method as an appropriate option to analyze the flexural behavior of pre-stressed long-span girders.

• The korean journal of orthodontics
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• v.36 no.2 s.115
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• pp.145-152
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• 2006

The purpose of this study was to evaluate electroless plating as a method of increasing the diameter of an orthodontic wire in comparison with eletroplating. After pretreatment plating of the 0.016 inch stainless steel orthodontic wire, electroless plating was performed at $90^{\circ}C$ until the diameter of the wire was increased to 0.018 inch. During the process of electroless plating, the diameter of the wire was measured every 5 minutes to examine the increasing ratio of the wire's diameter per time unit. And to examine the uniformity, the diameter at 3 points on the electroless-plated orthodontic wire was measured. An X-ray diffraction test for analyzing the nature of the plated metal and a 3-point bending test for analyzing the physical property were performed. The electroless-plated wire group showed a increased tendency for stiffness, yield strength, and ultimate strength than the electroplated wire group. And there was a statistically significant difference between the two groups for stiffness and ultimate strength. In the electroless-plated wire group, the increasing ratio of the diameter was $0.00461{\pm}0.00003mm/5min$ (0.00092 mm/min). In the electroplated wire group, it was $0.00821{\pm}0.00015mm/min$. The results of the uniformity test showed a tendency for uniformity in both the plating methods. The results of this study suggest that electroless plating of the wire is closer to the ready-made wire than electroplating wire in terms of the physical property. However, the length of plating time needs further consideration for the clinical application of electroless plating.