• 제목/요약/키워드: 2-dimensional measurement

검색결과 923건 처리시간 0.023초

Precise Comparison of Two-dimensional Dopant Profiles Measured by Low-voltage Scanning Electron Microscopy and Electron Holography Techniques

  • Hyun, Moon-Seop;Yoo, Jung-Ho;Kwak, Noh-Yeal;Kim, Won;Rhee, Choong-Kyun;Yang, Jun-Mo
    • Applied Microscopy
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    • 제42권3호
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    • pp.158-163
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    • 2012
  • Detailed comparison of low-voltage scanning electron microscopy and electron holography techniques for two-dimensional (2D) dopant profiling was carried out with using the same multilayered p-n junction specimen. The dopant profiles obtained from two methods are in good agreement with each other. It demonstrates that reliability of dopant profile measurement can be increased through precise comparison of 2D profiles obtained from various microscopic techniques.

Comparative study of glenoid version and inclination using two-dimensional images from computed tomography and three-dimensional reconstructed bone models

  • Choi, Chang-Hyuk;Kim, Hee-Chan;Kang, Daewon;Kim, Jun-Young
    • Clinics in Shoulder and Elbow
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    • 제23권3호
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    • pp.119-124
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    • 2020
  • Background: This study was performed to compare glenoid version and inclination measured using two-dimensional (2D) images from computed tomography (CT) scans or three-dimensional (3D) reconstructed bone models. Methods: Thirty patients who had undergone conventional CT scans were included. Two orthopedic surgeons measured glenoid version and inclination three times on 2D images from CT scans (2D measurement), and two other orthopedic surgeons performed the same measurements using 3D reconstructed bone models (3D measurement). The 3D-reconstructed bone models were acquired and measured with Mimics and 3-Matics (Materialise). Results: Mean glenoid version and inclination in 2D measurements were -1.705° and 9.08°, respectively, while those in 3D measurements were 2.635° and 7.23°. The intra-observer reliability in 2D measurements was 0.605 and 0.698, respectively, while that in 3D measurements was 0.883 and 0.892. The inter-observer reliability in 2D measurements was 0.456 and 0.374, respectively, while that in 3D measurements was 0.853 and 0.845. Conclusions: The difference between 2D and 3D measurements is not due to differences in image data but to the use of different tools. However, more consistent results were obtained in 3D measurement. Therefore, 3D measurement can be a good alternative for measuring glenoid version and inclination.

이미지 프로세싱을 이용한 부유구조물의 2차원 위치 계측장치 개발 (Development of Two Dimensional Position Measuring Device for Floating Structure Using an Image Processing Method)

  • 지명석;김성근;김상봉
    • 한국해양공학회지
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    • 제8권2호
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    • pp.166-172
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    • 1994
  • This paper presents an image processing method for two dimensional position measurement of a floating structure. This method is based on image processing technique using concept of window and threshold processing to track the target object. The experimental results for position measurement of the target object in two dimensional water tank demonstrate the validity of this method.

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Discontinuous Surface Profile measurement using Wavelength Scanning Interferometer(WSI)

  • Kang, Chul-Goo;Cho, Hyoung-Suck;Lee, Jae-Yong;Hahn, Jae-Won
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2001년도 ICCAS
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    • pp.127.4-127
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    • 2001
  • Inspection and shape measurement of three-dimensional objects are widely needed in industries for quality monitoring and control. A number of visual or optical technologies have been successfully applied to measure three dimensional surfaces. Especially, the shape measurement using an interferometric principle becomes a successful methodology. However, those conventional interferometric methods to measure surface profile have an inherent shortcoming, namely 2∏ ambiguity problem. The problem inevitably happens when the object to be measured has discontinuous shape due to the repetition of interferometric signal with phase period of 2∏. Therefore, in this paper, we choose as a shape measuring method, ...

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PSD와 구면반사를 이용한 3자유도 미소 변위의 정밀측정 (Precision Displacement Measurement of Three-DOF Micro Motions Using Position Sensitive Detector and Spherical Reflector)

  • 이재욱;조남규
    • 한국정밀공학회지
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    • 제20권7호
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    • pp.99-104
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    • 2003
  • A precision displacement measurement system of 3-DOF micro motions is proposed in this paper. The measurement system is composed of two diode lasers, two quadratic PSDs, two beam splitters and a sphere whose surface is highly reflective. In this measurement system, the sphere reflector is mounted on the platform of positioning devices whose 3-DOF translational motions are to be measured, and the sensitive areas of two PSDs are oriented toward the center point of the sphere reflector. Each laser beam emitted from two diode laser sources is reflected at the surface of sphere and arrives at two PSDs. Each PSD serves as a 2-dimensional sensor, providing the information on the 3-dimensional position of the sphere. In this paper, we model the relationship between the outputs of two PSDs and 3-DOF translational motions of the sphere mounted on the object. Based on a deduced measurement model, we perform measurement simulation and evaluate the performance of the proposed measurement system: linearity, sensitivity, and measurement error. The simulation results show that the proposed measurement system can be valid means of precision displacement measurement of 3-dimensional micro motions.

Methods to Measure the Critical Dimension of the Bottoms of Through-Silicon Vias Using White-Light Scanning Interferometry

  • Hyun, Changhong;Kim, Seongryong;Pahk, Heuijae
    • Journal of the Optical Society of Korea
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    • 제18권5호
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    • pp.531-537
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    • 2014
  • Through-silicon vias (TSVs) are fine, deep holes fabricated for connecting vertically stacked wafers during three-dimensional packaging of semiconductors. Measurement of the TSV geometry is very important because TSVs that are not manufactured as designed can cause many problems, and measuring the critical dimension (CD) of TSVs becomes more and more important, along with depth measurement. Applying white-light scanning interferometry to TSV measurement, especially the bottom CD measurement, is difficult due to the attenuation of light around the edge of the bottom of the hole when using a low numerical aperture. In this paper we propose and demonstrate four bottom CD measurement methods for TSVs: the cross section method, profile analysis method, tomographic image analysis method, and the two-dimensional Gaussian fitting method. To verify and demonstrate these methods, a practical TSV sample with a high aspect ratio of 11.2 is prepared and tested. The results from the proposed measurement methods using white-light scanning interferometry are compared to results from scanning electron microscope (SEM) measurements. The accuracy is highest for the cross section method, with an error of 3.5%, while a relative repeatability of 3.2% is achieved by the two-dimensional Gaussian fitting method.

유방이 큰 여성을 위한 브래지어 패턴 설계 -3차원 유방 형상 자료를 중심으로- (Design of Brassiere Pattern for Big Size Breast Women -Based on 3D Breast Scanning Data-)

  • 한초희;이경화
    • 한국의류학회지
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    • 제43권2호
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    • pp.204-214
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    • 2019
  • A CAD program has recently been introduced that can be directly developed into a three-dimensional human body shape and made into a pattern. It is possible to fabricate a bra that reflects the volume and surface area of the breast; however, it still needs to be verified. This study investigates the average size and shape of 20 big-breasted women and designs a brassiere pattern for women with large breasts using a 3D Flattening function of OptiTex PDS v15.6. In addition, the study verifies the reliability of the proposed method compared to a conventional brassiere pattern. The study results are as follows. First, the three dimensional measurement values were smaller than the direct measurement dimensions when the three dimension measurement dimensions of the subjects were compared with the direct measurement dimensions, the replica measurement dimensions and the three dimensional measurement dimensions. Second, the 3D flattening pattern reflects the actual shape, length, and area of the actual breast when comparing a brassiere pattern using a 3D shape and pattern reflecting the direct measurement.

Stereoscopic micro-PTV기법의 개발 (Development of Stereoscopic Micro-PTV Method)

  • 유청환;김형범
    • 한국가시화정보학회:학술대회논문집
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    • 한국가시화정보학회 2007년도 추계학술대회
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    • pp.109-113
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    • 2007
  • Micro-PIV is a well-known method for measurement of two- dimensional, two-component velocity in the microfluidic devices. Lots of the micro fluidic devices generate three-dimensional flow and 3D measurement of velocity is helpful to understand the physics of micro flow phenomena. In this study, we developed new micro 3D measurement method by applying 2-frame PTV in stereoscopic micro system. In this study, we did the validation study of SMPTV by using the simulated flow model to verify the accuracy and the feasibility of measurement and compared with SMPIV method. The results showed that SMPTV provides better spatial resolution and measurement accuracy than SMPIV method.

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탄소재 성형품에 대한 정밀 치수 검사 시스템에 관한 연구 (A Study on the System of the Precision Dimensional Measurements for Molded Product Carbon Materials)

  • 김대년
    • 조명전기설비학회논문지
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    • 제30권2호
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    • pp.37-42
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    • 2016
  • This paper proposes a method to develop a high-precision dimension measurement system using a linear variable differential transformer sensor. The Dimension targets for measurement is carbon material vanes of key element in the rotating parts within vehicle circulating pump. Data acquisition system for dimension measurement is designed using the NI Compact RIO. And the program applying the dimension measurement algorithm is built using NI LabVIEW. The dimension measuring program is composed of a FPGA program, Real Time program and Host program. The method of the experiment compares master vane with target vane for measure the length of the carbon material vane. The experimental results confirmed the usefulness of the accuracy within ${\pm}4um$.

ESPI에 의한 원공판의 2차원 면내변위 측정에 관한 연구 (A study on the measurement of two-dimensional in-plane displacements of the plate with a circular hole by ESPI method)

  • 김경석;최형철;양승필;김형수;홍명석;정운관
    • 한국정밀공학회지
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    • 제11권5호
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    • pp.161-170
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    • 1994
  • This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interfermetry(ESPI) method, in measuring two-dimensional in- plane displacement. The analysis result of measurement by ESPI is quite comparable to that of measurement by strain gauge method. This implieds that the method of ESPI is a very effective tool in non-contact two-dimensional in-plane strain analysis. But there is a controversial point, measurement error. This error is discussed to be affected not by ESPI method itself, but by its analysis scheme of the interference fringe, where the first-order interpolation has been applied to the points of strain measured. Further development of advanced first-order interpolation method is being undertaken for the more precise in-plane strain measurement.

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