• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.197-200
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• 2000

This paper proposes a CMOS low noise VGA. It describes the noise optimization method of the proposed VGA. The designed VGA provides of a 0 to 21.30dB gain variation and its bandwidth of 49MHz. The input reflected noise voltage is 4.84nV/sqrt-hz at 1MHz and noise figure is 14.53dB(Rs=50 Ω). The VGA was fabricated using a 0.35-${\mu}{\textrm}{m}$ CMOS technology.

• The Journal of the Korea institute of electronic communication sciences
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• v.6 no.5
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• pp.621-627
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• 2011

In this paper, we analysed performance for on-wafer GaN HEMT using load-pull in X-band, and studied optimum impedance point based on analysis result. We suggested method of optimum performance device by analysis of optimum impedance for solid state device on-wafer condition before packaging. The measured device is gate length 0.25um, and gate width is 400um, 800um. device 400um is performed $P_{sat}$=33.16dBm, PAE=67.36%, Gain=15.16dBm, and device 800um is performed $P_{sat}$=35.91dBm, PAE=69.23%, Gain=14.87dBm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.3
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• pp.69-76
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• 2008

This work proposes a 12b 1kS/s 65uA 0.35um CMOS algorithmic ADC for sensor interface applications such as accelerometers and gyro sensors requiring high resolution, ultra-low power, and small size simultaneously. The proposed ADC is based on an algorithmic architecture with recycling techniques to optimize sampling rate, resolution, chip area, and power consumption. Two versions of ADCs are fabricated with a conventional open-loop sampling scheme and a closed-loop sampling scheme to investigate the effects of offset and 1/f noise during dynamic operation. Switched bias power-reduction techniques and bias circuit sharing reduce the power consumption of amplifiers in the SHA and MDAC. The current and voltage references are implemented on chip with optional of-chip voltage references for low-power SoC applications. The prototype ADC in a 0.35um 2P4M CMOS technology demonstrates a measured DNL and INL within 0.78LSB and 2.24LSB, and shows a maximum SNDR and SFDR of 60dB and 70dB in versionl, and 63dB and 75dB in version2 at 1kS/s. The versionl and version2 ADCs with an active die area of $0.78mm^2$ and $0.81mm^2$ consume 0.163mW and 0.176mW at 1kS/s and 2.5V, respectively.

• Proceedings of the KIPE Conference
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• 2007.07a
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• pp.271-273
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• 2007

본 논문에서는 TV나 Audio등에 사용되는 2채널 30W급 Class-D amplifier를 동부하이텍의 0.35um BD350BA 공정을 사용하여 디지털 방식의 Class-D amplifier 출력단 구동에 적합하도록 설계하였다. 출력단은 Bootstrap 전원을 사용한 N-N type의 30V LDMOS 내장형이며 각각 $250m{\Omega}$의 턴 온 저항을 갖게 설계 되었다. THD+N 특성개선을 위한 Dead time 및 Delay 조정회로를 내장하였으며 보호회로로는 Over current, Over temperature, UVLO 가 있다.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.637-640
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• 1998

A 35 ㎓ GaAs MMIC power amplifier was designed using a monolithic technology with AlGaAs/InGaAs/GaAs power PM-HEMTs, rectangualr spiral inductors and Si3N4 MIM capacitors. The GaAs power MESFETs in the input and output stages have total gate widths of 120 um and 320 um, respectively. Total S21 gain of 10.82dB and S11 of -16.26 dB were obtained from the designed MMIC power amplifier at 35 ㎓. And the chip size of the MMIC amplifier was 1.4$\times$0.8 $\textrm{mm}^2$

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.569-572
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• 2014

This paper presents a CMOS switched-capacitor interface circuit for MEMS capacitive sensors. It consist of a capacitance to voltage converter(CVC), a second-order ${\Sigma}{\Delta}$ modulator, and a comparator. A bias circuit is also designed to supply constant bias voltages and currents. This circuit employes the correlated-double-sampling(CDS) and chopper-stabilization(CHS) techniques to reduce low-frequency noise and offset. The designed CVC has a sensitivity of 20.53mV/fF and linearity errors less than 0.036%. The duty cycle of the designed ${\Sigma}{\Delta}$ modulator output increases about 5% as the input voltage amplitude increases by 100mV. The designed interface circuit shows linearity errors less than 0.13%, and the current consumption is 0.73mA. The proposed circuit is designed in a 0.35um CMOS process with a supply voltage of 3.3V. The size of the designed chip including PADs is $1117um{\times}983um$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.379-382
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• 2013

In conventional solar energy harvesting systems, continuous perturbation techniques of the duty cycle or switching frequency of a power converter have been used to implement MPPT(Maximum Power Point Tracking) control. In this paper, we propose a new MPPT technique to control the duty cycle of a power switch powering a power converter. The proposed circuit is designed in 0.35um CMOS process, and the designed chip area including pads is $770um{\times}800um$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.8
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• pp.67-74
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• 2004

In this paper, a 3.3V 8-bit 500MSPS based on an interpolation architecture CMOS A/D converter is designed. In order to overcome the problems of high speed operation, a novel pre-amplifier, a circuit for the Reference Fluctuation, and an Averaging Resistor are proposed. The proposed Interpolation A/D Converter consists of Track ＆ Hold, four resistive ladders with 256 taps, 128 comparators, and digital blocks. The proposed A/D Converter is based on 0.35um 2-poly 4-metal N-well CMOS technology. The A/D Converter dissipates 440 mW at a 3.3 Volt single power supply and occupies a chip area of 2250um x 3080um.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.561-564
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• 2014

In this paper a photovoltaic energy harvesting charger with battery management circuit is proposed. The proposed circuit harvests maximum power from a solar cell by employing MPPT(Maximum Power Point Tracking) control and charges an external capacitor battery with the harvested energy. The charging state of the battery is controlled according to the signals from the battery management circuit. The proposed circuit is designed in a 0.35um CMOS process technology and its functionality has been verified through extensive simulations. The maximum efficiency of the designed entire system is 84.8%, and the chip area including pads is $1350um{\times}1200um$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.385-388
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• 2003

In this paper, a D-Latch is replaced by a memory cell on the proposed PFD to improve response tine by reducing reset me. The PFD has been simulated using HSPICE with a Hynix 0.35um CMOS process to prove the performance improvement.