• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2286-2291
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• 2008

Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.402-407
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• 2001

This paper reports a result of numerical heat transfer analysis for heat spreader with various ribs. Four different ribs are compared in this study. In general, the heat transfer on a vertical plate is enhanced when a rib is attached as the surface area increases, and the growth of the boundary layer is interrupted. However, for a low flow less than 0.1m/s, it is observed that the heat transfer is sensitive to the height of a rib: it decreases as the height increases. Among the four ribs, the H-shaped rib showed better performance than other ribs.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.13-16
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• 2013

A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.612-617
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• 2001

This paper reports the cooling performance of a PDP(plasma display panel) with a heat spreader by means of numerical analysis. Due to the simplifications and assumptions inherent in the analysis, computed results are found to differ those of the experiment by 13%. Calculation shows a maximum temperature of $65^{\circ}C$ for the plasma glass, as opposed to the allowable temperature of $90^{\circ}C$, producing a temperature difference of $25^{\circ}C$ between the upper and lower regions. This is enough to cause cracks in the plasma glass. In order to avoid this, more ventholes are added at the upper center region of the back cover, thereby causing a $3^{\circ}C$ drop in the maximum temperature, which reduces the temperature difference to $12^{\circ}C$. The new design gives more uniform temperature distribution across the plasma glass.