• Title/Summary/Keyword: 회로정수 설계

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The Bandpass Filter with Transmission Zero Using . the Effect of Effective Inductance and Multi-layer PCB (유효 인덕턴스 효과와 적층 PCB를 이용한 하나의 전송 영점을 갖는 대역 통과 필터)

  • Kim, Yu-Seon;Nam, Hun;Lee, Geon-Cheon;Seo, In-Jong;Lim, Yeong-Seog
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.11 s.114
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    • pp.1089-1095
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    • 2006
  • In this paper, the circuit analysis of three-dimensional bandpass filter with transmission zero in multi-layer printed circuit board is presented. The equivalent circuit of bandpass filter is evaluated by microwave network analysis. Compare to the established paper that have configured the circuit model of filter except the effect of distribute element, the proposed model can include the effect. As a result, the multi-layer PCB bandpass filter with transmission zero has designed by extracting mutual capacitance from electrical component inside inductor. The structure size is only $10mm{\times}20mm{\times}1.251mm$. Measured data of the bandpass filter indicate 1.9 dB of insertion loss and 28 dB of return loss at the center frequency of 1.84 GHz, as well as 43 dB attenuation at the refraction frequency of 2.78 GHz.

A 900 MHz ZigBee CMOS RF Transceiver Using Switchless Matching Network (무스위치 정합 네트워크를 이용한 900 MHz ZigBee CMOS RF 송수신기)

  • Jang, Won Il;Eo, Yun Seong;Park, Hyung Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.28 no.8
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    • pp.610-618
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    • 2017
  • This paper presents a 868/915 MHz CMOS RF transceiver for the ZigBee application. Using a switchless matching network, the off chip switch is removed to achieve the low cost RF transceiver, and by the elimination of the switch's insertion loss we can achieve the benefits for the RF receiver's noise figure and transmitter's power efficiency at the given output power. The receiver is composed of low-noise amplifier, mixer, and baseband analog(BBA) circuit. The transmitter is composed of BBA, mixer, and driver amplifier. And, the integer N type frequency synthesizer is designed. The proposed ZigBee RF full transceiver is implemented on the $0.18{\mu}m$ CMOS technology. Measurement results show that the maximum gain and the noise figure of the receiver are 97.6 dB and 6.8 dB, respectively. The receiver consumes 32 mA in the receiver mode and the transmitter 33 mA in the transmission mode.

A Parasitic Elements Extraction of the Distributed Elements and an Application of the BPF Using the Short-Open Calibration Method (단락 개방 Calibration 방법을 이용한 분포 정수 소자의 기생 소자 추출 및 대역 통과 필터에의 응용)

  • Kim, Yu-Seon;Nam, Hun;Lim, Yeong-Seog
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.2
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    • pp.115-123
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    • 2009
  • In this paper, we extract the parasitic elements of the transmission line with the defected ground structure(DGS) and the short-circuited comb line section using the Short-Open Calibration(SOC). The scattering matrixes of short, open and the distributed elements in microstrip line are measured by full electro-magnetic(EM) simulator and Vector Network Analyser(VNA). The electro-magnetic effects of the proposed structures are considered by the II and T equivalent circuits with frequency independent elements, and the relations between the measured scattering parameters and the elements in the circuits are shown by performing 2 port network analysis. Moreover, to design the 2.4 GHz bandpass filter with second order butterworth prototype, the proposed methods are applied. As results, the measured $S_{11}$ and $S_{21}$ indicate -20 dB and -1.3 dB at center frequency, and these are shown within 5 % error compare to the predicted results at $0.5{\sim}5\;GHz$.

A Dual Integer Register File Structure for Temperature - Aware Microprocessors (온도 인지 마이크로프로세서를 위한 듀얼 레지스터 파일 구조)

  • Choi, Jin-Hang;Kong, Joon-Ho;Chung, Eui-Young;Chung, Sung-Woo
    • Journal of KIISE:Computer Systems and Theory
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    • v.35 no.12
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    • pp.540-551
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    • 2008
  • Today's microprocessor designs are not free from temperature as well as power consumption. As processor technology scales down, an on-chip circuitry increases power density, which incurs excessive temperature (hotspot) problem. To tackle thermal problems cost-effectively, Dynamic Thermal Management (DTM) has been suggested: DTM techniques have benefits of thermal reliability and cooling cost. However, they require trade-off between thermal control and performance loss. This paper proposes a dual integer register file structure to minimize the performance degradation due to DTM invocations. In on-chip thermal control, the most important functional unit is an integer register file. It is the hotspot unit because of frequent read and write data accesses. The proposed dual integer register file migrates read data accesses by adding an extra register file, thus reduces per-unit dynamic power dissipation. As a result, the proposed structure completely eliminates localized hotspots in the integer register file, resulting in much less performance degradation by average 13.35% (maximum 18%) improvement compared to the conventional DTM architecture.

Current Sensorless Three Phase PWM AC/DC Boost Converter with Unity Power Factor (전류센서리스 단위역률 3상 PWM AC/DC Boost 컨버터)

  • 천창근;김철우
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.17 no.6
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    • pp.105-112
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    • 2003
  • Diode rectifier which can't be controlled output voltage and phase control converter as AC/DC converter have low power factor and harmonics of lower order in the line current. In this paper, three phase PWM(Pulse Width Modulation) AC/DC boost converter is studied to solve these problems. The characteristics of a proposed converter are to control the phase of current without current sensor as a very simple control algorithm using circuit parameters only and to apply sinusoidal PWM method with fixed switching frequency due to a difficult design of input filter and switching device. We simulate for the proposed algorithm that high power factor is achieved and DC link voltage has fast dynamic response without ripple in rectifying and regenerating operation. As a result of experiment with circuit parameter(inductor, capacitor) decided in simulation, the proposed converter had high power factor and reduction of low order harmonics as against diode rectifier.

The New Type Pulse Generator Adopted Cascading Technique (소형트랜스의 Cascading 방식을 적용한 임펄스 출력특성)

  • Kyung-Ae Shin;Whi-Young kim;Myeong-Soon Kim
    • Journal of the Korea Computer Industry Society
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    • v.2 no.3
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    • pp.363-368
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    • 2001
  • This paper introduced cascading technique as a new technology composed of two pulse transformers and presented the experimental data and results. To obtain the stable pulse voltage adopted cascading technique, we designed and tested a compact pulse generator by adjusting the load resistors and input voltage. Adopting cascading technique to load, we found that average cascading voltage was about 62$\%$ of theoretical value. Cascading ratio was calculated at almost 19 compared with non cascading voltage.

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Design and Analysis of Mach-Zehnder-Interferometer-Based Silica Planar Lightwave Circuit Triplexer (마하젠더 간섭계로 구성된 실리카 평판 광 도파회로 트라이플렉서의 설계 및 분석)

  • Lee, Tae-Hyung;Lee, Dong-Hyun;Chung, Young-Chul
    • Korean Journal of Optics and Photonics
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    • v.18 no.6
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    • pp.447-451
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    • 2007
  • A triplexer based on a silica planar lightwave circuit Mach-Zehnder nterferometer(MZI) is proposed and its characteristics are analyzed through simulations. To separate 1310 nm band and $1480{\sim}1560nm$ band properly, the path length difference of an MZI is set to be the multiple and half of the wavelength 1310 nm and the balance of the directional coupler is optimized in the $1480{\sim}1560nm$ band. The same MZI is additionally cascaded to provide good crosstalk characteristics. The 1490 nm band and 1550 nm band are further separated using additional two stage MZI's. A three-dimensional BPM and transfer matrix method analysis predicts the low crosstalk characteristics and the fabrication-error-tolerance of the proposed triplexer.

Design of X band Microstrip Directional Couplers (X-대역 마이크로 스트? 방향성 결합기의 설계)

  • 양인응;홍완희
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.12 no.4
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    • pp.7-14
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    • 1975
  • A significant new technique in the dsvelopment of micro-wave circuits is the process of untilization of coupled lines in the transverse electro-magnetic field. The bases for this technique are the application of even-and odd-mode characteristic impedances of the transmission line. This article describes the properties of directional couplers and explains a prccfdure usrd to design micro-strip directional couplers with the aid of the computer. The article also describes the experimental results obtained from seven microstrip couplers, which were built to verify the computer program and the approximate solutions. It can be seen that in cases at X-band where couplings of 10 to 20dB are required, the computer program and approximate solutions will produce good results.

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Computation of the Critical Lengths of the Vertical Grounding Electrode in Multi-Layered Soil Structures (다층 대지구조에서 수직 접지전극의 임계길이 산정)

  • Kim, Ki-Bok;Joe, Jeong-Hyeon;Lee, Bok-Hee
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.4
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    • pp.73-80
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    • 2010
  • The grounding impedance is not lowered by expanding the dimension of the grounding electrode, and the length of grounding electrode which shows the minimum value of the grounding impedance for each condition of frequency and soil characteristics is existent, and it is defined as Critical Length. In this paper, a new distributed parameter circuit model considering the condition of the multi-layered soil structures was proposed, and the grounding impedance and critical length of the vertical grounding electrode were analyzed by using the newly proposed simulation model and the MATLAB program. As a consequence, it was found that the effect of the soil structure on the frequency-dependent grounding impedance and critical length of the vertical grounding electrode is significant. It is desirable to consider the soil structure in optimal design of the grounding system.

Fabrication and Evaluation of the Super Thin-Type EM Wave Absorber for Suppressing EM Noises in 2.4 GHz Band (2.4 GHz 대역용 불요전자파 억제용 초박형 전파흡수체의 제작 및 평가)

  • Kim, Dong Il;Kwak, Hyun Soo;Joo, Yang Ick;Park, Soo Hoon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.19 no.3
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    • pp.500-506
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    • 2015
  • In this paper, we designed and fabricated the EM wave absorber consisted of Sendust for suppressing EM wave noise PCB in ISM (Industrial, Scientific and Medical) band of 2.4 GHz. We fabricated several samples with different composition ratios of some kinds of Sendust to CPE (Chlorinated Ploy-ethylene) as a binder, and it was confirmed that the optimum composition ratio of absorbing materials was Flaked Sendust : CPE = 72.5 : 27.5 wt.%.. The absorbing abilities were simulated by changing the thickness and the measured material constants of EM wave absorber. The measured absorption abilities were analyzed and compared with the simulated ones. As a result, the simulated results agree well with the measured ones, and the developed EM wave absorber with extremely thin thickness of 0.6 mm has absorption ability of 5.4 dB at 2.4 GHz is excellent one. The thin type EM wave absorber can be applied for suppressing and absorbing electromagnetic noises from information and communication equipments.