• Korean Journal of Materials Research
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• v.6 no.12
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• pp.1213-1220
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• 1996

산소분압과 온도변화에 따라 비양론성 rutile(TiO2-x)의 결함모델을 전기전도 측정법에 의해 연구하였다. 산소분압과 전기전도도의 상관관계에 의하면, rutile에서 주결함은 2가로 하전된 산소빈자리와 4가로 하전된 침입형 티타늄이온이다. 117$0^{\circ}C$이상의 온도에서는 침입형 Tii…이온이 지배적인 결함이었으나, 117$0^{\circ}C$이하의 낮은 산소분압대에서는 2가로 하전된 산소빈자리가 주된 결함이었다. rutile의 전기전도 실험에서 제안된 결함모델은 본 연구팀이 O18추적자 확산실험에 의해 제안하였던 결과치와 일치하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.4
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• pp.125-131
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• 2023

Ga₂O₃ thin films were deposited on Ti substrates using metal organic chemical vapor deposition (MOCVD) at temperatures ranging from 350 to 500℃. Lower deposition temperatures were chosen to minimize thermal deformation of the Ti substrate and its impact on the Ga₂O₃ film. Film surfaces tended to become rough at temperatures below 500℃ due to three-dimensional growth, but the film formed at 500℃ had the most uniform surface. All deposited films were amorphous in structure. Vertical Schottky diodes were fabricated and I-V and C-V measurements were performed. I-V measurements showed higher operating voltages compared to a typical SBD for films grown at different temperatures. The sample grown at 500℃, which had the most uniform surface, exhibited the lowest operating voltage. Higher growth temperatures resulted in higher capacitance values according to C-V measurements.

• Proceedings of the Optical Society of Korea Conference
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• 1991.06a
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• pp.22-22
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• 1991

광의 병렬처리 능력을 잘 활용한 1$\times$4 매트릭스 스위치의 구조와 전극구조를 설계하고 스위치 특성을 조사하기 위하여 beam propagation method(BPM)를 이용하여 수치계산을 하였다. 기존의 매트릭스 스위치는 대부분의 경우 방향성 결합기를 스위치 element로 이용하여 왔으나 이 결합기는 소자의 길이가 길기 때문에 단일 LinBO3 웨이퍼상에 집적할 수 있는 매트릭스 스위치의 크기가 제한되는 단점이 있다. 본 연구에서는 두 도파로 사이에 세 번째 도파로를 삽입하여 두 도파로를 결합시키는 세 도파로 결합기를 스위치 element로 사용하여 세 개의 스위치 element를 LiNbO3기판위에 직렬로 집적시킨 1$\times$4 매트릭스 스위치를 구성하였다. 스위치 element와 1$\times$4 매트릭스 스위치를 구성하였다. 스위치 element와 1$\times$4 매트릭스 스위치의 특성을 BPM을 사용하여 수치계산할 때 단일 모드 도파로의 유효 굴절을 분포는 n(X) = nm + $\Delta$ncosh-2(2x/w)의 형태로 가정했으며, 사용된 파라미터의 값은 각각 nm=2.1455, $\Delta$n=0.003, W=5$mu extrm{m}$, d=5$\mu\textrm{m}$, λ=1.3$\mu\textrm{m}$ 이고 S-파라메터의 값은 0.95927이므로 단일 모드 도파로가 된다. 계산결과 스위치 element의 결합길이는 3810$\mu\textrm{m}$이며 도파로의 길이가 결합길이와 같을 때 전극에 인가된 전압에 의한 도파로의 굴절을 섭등의 함수로 출력광의 세기를 계산한 결과 스위칭 전압은 14.85volt이고 crosstalk는 -18.9dB였다. 이 스위치 element로 구성된 1$\times$4 매트릭스 스위치는 스위칭 전압을 세 개의 전극에 적절한 조합으로 인가함으로써 한 입력 도파로에 결합된 광이 내개의 출력 도파로중 한 도파로에 스위칭 된다. 한편 수치계산의 결과를 실험적으로 확인하기 위해 스위치 element와 1$\times$4 매트릭스 스위치를 z-cut의 LinbO3 결정에 Ti을 열확산시켜 제작한 소자의 스위칭 특성을 발표할 예정이다.

• Journal of Korean Society of Environmental Engineers
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• v.27 no.3
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• pp.253-261
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• 2005

Catalytic wet oxidation of ppm levels of trichloroethylene (TCE) in water has been conducted using $TiO_2$-supported cobalt oxides at a given temperature and weight hourly space velocity. 5% $CoO_x/TiO_2$ might be the most promising catalyst for the wet oxidation at $36^{\circ}C$ although it exhibited a transient behavior in time on-stream activity. Not only could the bare support be inactive for the wet decomposition reaction, but no TCE removal also occurred by the process of adsorption on $TiO_2$ surface. The catalytic activity was independent of all particle sizes used, thereby representing no mass transfer limitation in intraparticle diffusion. Characterization of the $CoO_x$ catalyst by acquiring XPS spectra of both fresh and used Co surfaces gave different surface spectral features of each $CoO_x$. Co $2p_{3/2}$ binding energy of Co species exposed predominantly onto the outermost surface of the fresh catalyst appeared at 781.3 eV, which is very similar to the chemical states of $CoTiO_x$ such as $Co_2TiO_4$ and $CoTiO_3$. The spent catalyst possessed a 780.3 eV main peak with a satellite structure at 795.8 eV. Based on XPS spectra of reference Co compound, the TCE-exposed Co surfaces could be assigned to be in the form of mainly $Co_3O_4$. XRD measurements indicated that the phase structure of Co species in 5% $CoO_x/TiO_2$ catalyst even before reaction is quite comparable to the diffraction lines of external $Co_3O_4$ standard. A model structure of $CoO_x$ present on titania surfaces would be $Co_3O_4$, encapsulated in thin-film $CoTiO_x$ species consisting of $Co_2TiO_4$ and $CoTiO_3$, which may be active for the decomposition of TCE in a flow of water.

• Journal of the Korean Vacuum Society
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• v.9 no.2
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• pp.162-166
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• 2000

High quality $Si_3N_4$ metal-insulator-metal (MIM) capacitors were realized by plasma enhanced chemical vapor deposition (PECVD). Titanium nitride (TiN) adapted as a diffusion barrier reduced the interfacial reaction between $Si_3N_4$ dielectric layer and aluminum metal electrode showing neither hillock nor observable precipitate along the interface. The capacitance and the current-voltage characteristics of the MIM capacitors showed that the minimum thickness of $Si_3N_4$ layer should be limited to 500 $\AA$ under the present process, below which most of the capacitors were electrically shorted resulting in the devastation of on-wafer yield. According to the transmission electron microscopy (TEM) on the cross-sectional microstructure of the capacitors, the dielectric breakdown was caused by slit-like voids formed at the interface between TiN and $Si_3N_4$ layers when the thickness of $Si_3N_4$ layer was less than 500 $\AA$. Based on the calculation of thermally-induced residual stress, the formation of voids was understood from the mechanistic point of view.

• Korean Journal of Materials Research
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• v.4 no.1
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• pp.81-89
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• 1994

Ti film of lOnm thickness and Co film of 18nm thickness were sequentially e-heam evaporated onto Si (100) substrates. Metal deposited samples were rapidly thermal-annt.aled(KTA) in thr N1 en vironment a t $900^{\circ}C$ for 20 sec. to induce the reversal of metal bilayer, so that $CoSi_{2}$ thin films could be formed. The sheet resistance measured by the 4-point probe was 3.9 $\Omega /\square$This valur was maintained with increase in annealing time upto 150 seconds, showing high thermal stab~lity. Thc XRII spectra idrn tified the silicide film formed on the Si substrate as a $CoSi_{2}$ epitaxial layer. The SKM microgr;iphs showed smooth surface, and the cross-sectional TKM pictures revealed that the layer formed on the Si substrate were composed of two Co-Ti-Si alloy layers and 70nm thick $CoSi_{2}$ epl-layer. The AES analysis indicated that the native oxide on Si subs~rate was removed by TI ar the beginning of the RTA, and Ihcn that Co diffused to clean surface of Si substrate so that epitaxial $CoSi_{2}$ film could bt, formed. In thc rasp of KTA at $700^{\circ}C$. 20sec. followed by $900^{\circ}C$, 20sec., the thin film showed lower sheet resistance, but rough surface and interface owing to $CoSi_{2}$ crystal growth. The application scheme of this $CoSi_{2}$ epilayer to VLSI devices and the thermodynarnic/kinetic mechan~sms of the $CoSi_{2}$ epi-layer formation through the reversal of Co/Ti bdayer were discussed.

• Journal of dental hygiene science
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• v.9 no.4
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• pp.405-412
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• 2009

The purpose of this study investigated the effect of Au coating on adhesion between porcelain matrix and metal substructure interface. Titanium, Ni-Cr alloy and Co-Cr alloy are well known as proper metal for the dental restorations. The success of a porcelain fused to metal (PFM) restoration depends upon the quality of the porcelain-metal bond. However, adhesion between dental alloys and porcelain is related to diffusion of oxygen during ceramic firing. The excessive oxidized layers make hard adhesion between dental alloy and ceramic. Ni-Cr and Co-Cr specimens were divided into test and a control group and Titanium specimens were divided into three test groups and a control group. Each group had 20 specimens. The adhesion characteristics of porcelain and metal with Au coating layer and without Au coating layer were observed with scanning electron microscopy(SEM). The adhesion was evaluated by a biaxial flexure test and volume fraction of adherent porcelain was determined by SEM/EDS analysis. Result of this study suggest that Au coating layer is effective barrier to diffuse oxide layer completely protect non-precious alloys from oxidation during the porcelain firing. The SEM photomicrographs of cross-section specimens showed a smooth interface between Au coating layer and metals and porcelain which suggested proper chemical bonding, and no gap, porosity were observed. The mode of failure was mainly adhesive for Ti tested specimens, but mixed failures with adhesive and cohesive were observed in Ni-Cr and Co-Cr specimens. The adhesion between non-precious metals and porcelain would not be improved by Au coating agent. However, It is suggested that the continuous study is required further investigation and development.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.456-456
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• 2010

CMOS 소자가 서브마이크론($0.1\;{\mu}m$) 이하로 스케일다운 되면서 단채널 효과(short channel effect), 게이트 산화막(gate oxide)의 누설전류(leakage current)의 증가와 높은 직렬저항(series resistance) 등의 문제가 발생한다. CMOS 소자의 구동전류(drive current)를 높이고, 단채널 효과를 줄이기 위한 가장 효율적인 방법은 소스 및 드레인의 얕은 접합(shallow junction) 형성과 직렬 저항을 줄이는 것이다. 플라즈마 도핑 방법은 플라즈마 밀도 컨트롤, 주입 바이어스 전압 조절 등을 통해 저 에너지 이온주입법보다 기판 손상 및 표면 결함의 생성을 억제하면서 고농도로 얕은 접합을 형성할 수 있다. 그리고 얕은 접합을 형성하기 위해 주입된 불순물의 활성화와 확산을 위해 후속 열처리 공정은 높은 온도에서 짧은 시간 열처리하여 불순물 물질의 활성화를 높여주면서 열처리로 인한 접합 깊이를 얕게 해야 한다. 그러나 접합의 깊이가 줄어듦에 따라서 소스 및 드레인의 표면 저항(sheet resistance)과 접촉저항(contact resistance)이 급격하게 증가하는 문제점이 있다. 이러한 표면저항과 접촉저항을 줄이기 위한 방안으로 실리사이드 박막(silicide thin film)을 형성하는 방법이 사용되고 있다. 본 논문에서는 (100) p-type 웨이퍼 He(90 %) 가스로 희석된 $PH_3$(10 %) 가스를 사용하여 플라즈마 도핑을 실시하였다. 10 mTorr의 압력에서 200 W RF 파워를 인가하여 플라즈마를 생성하였고 도핑은 바이어스 전압 -1 kV에서 60 초 동안 실시하였다. 얕은 접합을 형성하기 위한 불순물의 활성화는 ArF(193 nm) excimer laser를 통해 $460\;mJ/cm^2$의 에니지로 열처리를 실시하였다. 그리고 낮은 접촉비저항과 표면저항을 얻기 위해 metal sputter를 통해 TiN/Ti를 $800/400\;{\AA}$ 증착하고 metal RTP를 사용하여 실리사이드 형성 온도를 $650{\sim}800^{\circ}C$까지 60 초 동안 열처리를 실시하여 $TiSi_2$ 박막을 형성하였다. 그리고 $TiSi_2$의 두께를 측정하기 위해 TEM(Transmission Electron Microscopy)을 측정하였다. 화학적 결합상태를 분석하기 위해 XPS(X-ray photoelectronic)와 XRD(X-ray diffraction)를 측정하였다. 접촉비저항, 접촉저항과 표면저항을 분석하기 위해 TLM(Transfer Length Method) 패턴을 제작하여 I-V 특성을 측정하였다. TEM 측정결과 $TiSi_2$의 두께는 약 $580{\AA}$ 정도이고 morphology는 안정적이고 실리사이드 집괴 현상은 발견되지 않았다. XPS와 XRD 분석결과 실리사이드 형성 온도가 $700^{\circ}C$에서 C54 형태의 $TiSi_2$ 박막이 형성되었고 가장 낮은 접촉비저항과 접촉저항 값을 가진다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.225-225
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• 2008

PLZT 박막을 Pt/Ti/$SiO_2$/Si 기판 위에 RF-마그네트론 스퍼터링방법으로 형성할 때 기판온도에 따른 PLZT 박막의 결정성과 전기적 특성 및 강유전 특성에 미치는 영향에 관하여 연구하였다. 하부전극 Pt와 PLZT 박막 사이에는 완충층으로 $TiO_2$를 사용하여 계면에서의 상호확산을 제어하면서 우수한 물성의 PLZT 박막을 얻고자 하였으며, 여러 기판온도에서 PLZT 박막을 증착한 후, 박막의 결정화를 위해 급속열처리법으로 $700^{\circ}C$로 후열처리하였다. 그 결과 기판온도 $400^{\circ}C$에서 증착한 PLZT 박막이 가장 우수한 특성을 나타내었으며, 이때의 잔류분극과 누설전류밀도는 각각 15.8 ${\mu}C/cm^2$, $5.4\times10^{-9}A/cm^2$ 이였다. 그러나 $500^{\circ}C$에서는 결정립 조대화현상이 나타나면서 잔류분극과 누설전류밀도는 9 ${\mu}C/cm^2$, $3.09\times10^{-7}A/cm^2$로 특성이 저하되었다.

• Korean Chemical Engineering Research
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• v.43 no.2
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• pp.206-214
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• 2005

Heterogeneously-catalyzed oxidation of aqueous phase trichloroethylene (TCE) over supported metal oxides has been conducted to establish an approach to eliminate ppm levels of organic compounds in water. A continuous flow reactor system was designed to effect predominant reaction parameters in determining catalytic activity of the catalysts for wet TCE decomposition as a model reaction. 5 wt.% $CoO_x/TiO_2$ catalyst exhibited a transient period in activity vs. on-stream time behavior, suggesting that the surface structure of the $CoO_x$ might be altered with on-stream hours; regardless, it is probable to be the most promising catalyst. Not only could the bare support be inactive for the wet decomposition reaction at $36^{\circ}C$, but no TCE removal also occurred by the process of adsorption on $TiO_2$ surface. The catalytic activity was independent of all particle sizes used, thereby representing no mass transfer limitation in intraparticle diffusion. Very low TCE conversion appeared for $TiO_2$-supported $NiO_x$ and $CrO_x$ catalysts. Wet oxidation performance of supported Cu and Fe catalysts, obtained through an incipient wetness and ion exchange technique, was dependent primarily on the kinds of the metal oxides, in addition to the acidic solid supports and the preparation routes. 5 wt.% $FeO_x/TiO_2$ catalyst gave no activity in the oxidation reaction at $36^{\circ}C$, while 1.2 wt.% Fe-MFI was active for the wet decomposition depending on time on-stream. The noticeable difference in activity of the both catalysts suggests that the Fe oxidation states involved to catalytic redox cycle during the course of reaction play a significant role in catalyzing the wet decomposition as well as in maintaining the time on-stream activity. Based on the results of different $CoO_x$ loadings and reaction temperatures for the decomposition reaction at $36^{\circ}C$ with $CoO_x/TiO_2$, the catalyst possessed an optimal $CoO_x$ amount at which higher reaction temperatures facilitated the catalytic TCE conversion. Small amounts of the active ingredient could be dissolved by acidic leaching but such a process gave no appreciable activity loss of the $CoO_x$ catalyst.