• Title/Summary/Keyword: 홀 가공

Search Result 148, Processing Time 0.03 seconds

Comparison of Optimum Drilling Conditions of Aircraft CFRP Composites using CVD Diamond and PCD Drills (CVD 다이아몬드 및 PCD이 드릴을 이용한 항공용 CFRP 복합재료의 홀 가공성 비교)

  • Kwon, Dong-Jun;Wang, Zuo-Jia;Gu, Ga-Young;Park, Joung-Man
    • Composites Research
    • /
    • v.24 no.4
    • /
    • pp.23-28
    • /
    • 2011
  • Recently CFRP laminate joints process by bolts and nets are developed rapidly in aircraft industries. However, there are serious drawback during jointing process. Many hole processes are needed for the manufacturing and structural applications using composite materials. Generally, very durable polycrystalline crystalline diamond (PCD) drill has been used for the CFRP hole process. However, due to the expensive price and slow process speed, chemical vapor deposition (CVD) diamond drill has been used increasingly which are relatively-low durability but easily-adjustable process speed via drill shape change and price is much lower. In this study, the comparison of hole process between PCD and CVD diamond coated drills was done. First of all, CFRP hole processbility was evaluated using the equations of hole processing conditions (feed amount per blade, feed speed). The comparison on thermal damage occurring from the CFRP specimen was also studied during drilling process. Empirical equation was made from the temperature photo profile being taken during hole process by infrared thermal camera. In addition, hole processability was compared by checking hole inside condition upon chip exhausting state for two drills. Generally, although the PCD can exhibit better hole processability, hole processing speed of CVD diamond drill exhibited faster than PCD case.

미세 변위 측정기 개발에 관한 연구

  • 김대현;최재원;최경현;이석희;김승수;나경환
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2004.05a
    • /
    • pp.124-124
    • /
    • 2004
  • 최근 MEMS공학의 발전으로 미소 가공물과 그 미소 가공물을 가공하는 공작기계의 발전이 두드러지고 있다. 마이크로 성형기는 이러한 미소 가공물을 만드는 공작기계들 중의 하나이다. 마이크로 성형기(micro former)는 마이크로 홀(micro holl)을 만드는 성형기로써 크랭크 축의 회전에 의한 펀치의 직선 운동으로 마이크로 홀을 뚫는 성형기이다. 마이크로 홀을 성형할 때에는 상하, 좌우의 미세한 변위가 생길 수 있다.(중략)

  • PDF

Parametric Study for Hole Machining in Natural Fiber Composites (천연섬유 복합재료의 홀 가공을 위한 파라메트릭 연구)

  • Lee, Dong-Woo;Oh, Jung-Suck;Song, Jung-Il
    • Composites Research
    • /
    • v.30 no.1
    • /
    • pp.35-40
    • /
    • 2017
  • In this study, natural fiber composites including flax fiber reinforcement was manufactured. It was tried to find optimum design of drill and machining factor for minimizing the damage during hole machining in natural fiber composites. Taguchi optimization was used for minimizing the number of experiments and evaluation of the effect of machining factor during hole machining in natural fiber composites. The experimental results indicate that the newly designed drill distributes cutting resistance well and minimizes surface roughness and produces fine surfaces. Developed new drill has been dispersed in the cutting resistance during processing, it was possible to obtain the smooth hole surface. Also, it was found that optimal rotational speed and feed rate of drill for hole machining.

세포 포집 소자 제작을 위한 펨토초 레이저 미세 가공

  • Park, Hyeon-Ae;Lee, Jun-Gi;Choe, Byeong-Deok
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2011.08a
    • /
    • pp.303-303
    • /
    • 2011
  • 최근 세포 포집 소자 제작에 있어 세포의 종류와 크기의 다양성을 고려하여 정확하게 포집하기 위한 고정밀화, 소형화 된 도구 제작 기술 개발이 중요한 현안으로 떠오르고 있다. 본 연구에서는 선행 기술에서의 세포 포집 한계를 극복하기 위한 방안으로 펨토초 레이저 가공을 통한 미세 세포 포집 장치 제작에 관한 실험을 진행하였다. 펨토초 레이저의 짧은 파장의 대역 범위와 전력 특성이 미세 소자 제작을 가능하게 함에 따라 수백, 수천 개의 세포 포집에 있어 보다 안정적이고 신뢰도 높은 포집 장치 구현을 실현시킬 수 있다. 실험에서는 펨토초 레이저의 가공 조건을 가변하며 MEMS 소자에 홀(hole)을 형성시켰다. flatness 200인 Polycarbonate 재질의 기판 위에 CNC공작기계를 사용하여 유로를 제작하고 상부에 젤라틴 코팅 부분 2를 포함한 총 두께 12의 membrane 필름을 부착하였다. 이후 775 nm 파장의 펨토초 레이저를 사용하여 10${\times}$10 개수의 홀을 형성 한 후 홀 주위의 thermal damage와 레이저의 파워에 따른 홀의 형태와 크기 변화를 비교하였다. 실험 결과 membrane 막의 젤라틴 코팅 측면 홀의 평균 직경은 레이저의 파워와 비례하여 증가하였으며, 레이저 파워가 일정한 임계치에 도달하면 특정 시점에서 수렴됨을 확인하였다. 또한 PET 측면의 직경은 서서히 증가하고 빠르게 일정한 값으로 수렴됨을 확인하였다. 본 실험에서는 펨토초 레이저의 특성 파라미터와 레이저의 가공 조건을 수립함으로써 실험에서 사용 된 레이저를 이용한 드릴링 방안을 제시한다.

  • PDF

A Fuzzy Logic Decision-Making for Vision-Based Inspection system (비전기반 검사시스템에서의 퍼지로직을 이용한 정상-불량 판단)

  • Choi Kyung-Jin;Lee Young-Hyun;Park Chong-Kug
    • Proceedings of the Korean Institute of Intelligent Systems Conference
    • /
    • 2005.11a
    • /
    • pp.463-466
    • /
    • 2005
  • 본 논문은 퍼지로직을 이용하여 메탈스텐실의 홀의 정상-불량 판단을 수행한다. 메탈스텐실 은 PCB의 SMD의 패드 위에 납을 도포하기 위해 사용되는 것으로, 레이저를 이용하여 패드모양과 동일하게 홀을 생성한다. 가공 시 발생하는 불량은 레이저 출력의 약화로 홀이 정상적으로 가공되지 않는 것이다. 검사를 위해 비전시스템을 이용하여 메탈스텐실에 대한 카메라이미지를 획득하고, 기준이미지는 메탈스텐실을 제조하기 위해 사용되는 거버 파일을 이용하여 생성한다. 퍼지로직의 입력변수는 각 이미지에서의 검사대상 홀의 위치오차와 크기비율이고, 출력변수는 홀의 정상판단율이다. 홀의 위치와 크기는 두 이미지에 대해 영상처리를 수행하여 계산한다. 퍼지규칙은 작업자의 판단 규칙을 적용하여 작성한다. 4종류의 메탈스텐실에 대해 정상-불량 판단을 위해 고정된 임계치를 사용하였을 경우와 제안된 퍼지로직을 적용한 실험결과에 대해 설명한다.

  • PDF

Stress Modeling of the Laser Drilling Process in Carbon Steel (레이저 드릴링을 통한 강판 가공 시 응력 모델링)

  • Lee, Wooram;Kim, Joohan
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.37 no.7
    • /
    • pp.857-864
    • /
    • 2013
  • A laser machining process has been applied in many manufacturing fields and it provides an excellent energy control for treating materials. However, a heat effect during laser machining can deteriorate material properties. Specifically, a thermally induced stress can be a problem in laser-machined structures on a metal surface. In this study, temperature and stress on cold-rolled carbon steel sheet machined with laser hole drilling were explored in an experimental approach and a numerical method. Stresses by temperature gradients inside the materials were generated in fast cooling. The stresses were measured by using a hole-drilling method and the material properties of carbon steel (SCP1-S) were obtained in the experiment. It was found that the stress predicted from the numerical analysis was in agreement with the stresses measured by using the hole-drilling method. The analysis can be applied for evaluating structure characteristics machined with a laser.

Development of Hole Inspection Program using Touch Trigger Probe on CNC Machine Tools (CNC 공작기계 상에서 접촉식 측정 프로브를 이용한 홀 측정 프로그램 개발)

  • Lee, Chan-Ho;Lee, Eung-Suk
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.36 no.2
    • /
    • pp.195-201
    • /
    • 2012
  • According to many customers' requests, optical measurement module (OMM) applications using automatic measuring devices to measure the machined part rapidly on a machine tool have increased steeply. Touch trigger probes are being used for job setup and feature inspection as automatic measuring devices, and this makes quality checking and machining compensation possible. Therefore, in this study, the use of touch trigger probes for accurate measurement of the machined part has been studied and a macro program for a hole measuring cycle has been developed. This hole is the most common feature to be measured, but conventional methods are still not free from measuring error. In addition, the eccentricity change of the least square circle was simulated according to the roundness error in a hole measurement. To evaluate the reliability of this study, the developed hole-measuring program was executed to measure the hole plate on the machine and verify the roundness error in the eccentricity simulation result.

Femto-second Laser Ablation Process for Si Wafer Through-hole (펨토초 레이저 어블레이션을 이용한 Si 웨이퍼의 미세 관통 홀 가공)

  • Kim, Joo-Seok;Sim, Hyung-Sub;Lee, Seong-Hyuk;Shin, Young-Eui
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.14 no.3
    • /
    • pp.29-36
    • /
    • 2007
  • The main objectives of this study are to investigate the micro-scale energy transfer mechanism for silicon wafer and to find an efficient way for fabrication of silicon wafer through-hole by using the femtosecond pulse laser ablation. In addition, the electron-phonon interactions during laser irradiation are discussed and the carrier number density and temperatures are estimated. In particular, the present study observes the shapes of silicon wafer through-hole with $100\;{\mu}m$ diameter and it also measures the heat-affected area and the ablation depths fur different laser fluences by using the optic microscope and the three-dimensional profile measurement technique. First, from numerical investigation, it is found that the nonequilibrium state exists between electrons and phonons during laser irradiation. From experimental results, it should be noted that the heat-affected area increases with laser fluence, and the optimal conditions for through-hole formation with minimum heat affected zone are finally obtained.

  • PDF

Optimization of Laser Process Parameters for Realizing Optimal Via Holes for MEMS Devices (MEMS 소자의 비아 홀에 대한 레이저 공정변수의 최적화)

  • Park, Si-Beom;Lee, Chul-Jae;Kwon, Hui-June;Jun, Chan-Bong;Kang, Jung-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.34 no.11
    • /
    • pp.1765-1771
    • /
    • 2010
  • In the case of micro.electro-mechanical system (MEMS) devices, the quality of punched via hole is one of the most important factors governing the performance of the device. The common features that affect the laser micromachining of via holes drilled by using Nd:$YVO_4$ laser are described, and efficient optimization methods to measure them are presented. The analysis methods involving an orthogonal array, analysis of variance (ANOVA), and response surface optimization are employed to determine the main effects and to determine the optimal laser process parameters. The significant laser process parameters were identified and their effects on the quality of via holes were studied. Finally, an experiment in which the optimal levels of the laser process parameters were used was carried out to demonstrate the effectiveness of the optimization method.

A study on the sintered monolithic component of piston and rebound for automobile shock absorber (자동차 쇼크 업 소버용 피스톤과 리바운드 1체형 소결부품 제작에 관한 연구)

  • 임태환;장태석;엄호성
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.5 no.1
    • /
    • pp.65-68
    • /
    • 2004
  • When a monolithic component of piston and rebound is produced by sintering process, some technical problems such as clogging of holes during post-machining, dimensional change around the holes, and cracking of the component edges due to concentration of mechanical stress during machining are frequently encountered. To solve these problems, we systematically evaluated and investigated the density of green compacts and sintered parts, the microstructural change around the holes, and the attenuation and durability of the sintered parts in this study. By doing so, it was able to solve above problems.

  • PDF