• Title/Summary/Keyword: 형상기억 폴리머

Search Result 8, Processing Time 0.031 seconds

Deployment test of shape memory polymer specimens for space antenna design (우주 안테나 설계용 형상기억 폴리머 시편의 전개 시험)

  • Goo, Nam Seo;Le, Van Luong;An, Yongsan;Yu, Woong-Ryeol;Hwang, Jin Ok;Park, Jongkyoo
    • Journal of the Korean Society for Aeronautical & Space Sciences
    • /
    • v.45 no.12
    • /
    • pp.1007-1012
    • /
    • 2017
  • In this study, we performed the deployment test of shape memory polymer specimens for space antenna design. Poly(cyclootene) was cross-linked by dicumyl peroxide to make a PCO shape memory polymer. A miniature specimen with 120 mm diameter for a deployable antenna was fabricated with the PCO shape memory polymer. To investigate the deployment performance, the folded specimen as a temporary shape was heated by two heaters to the $15^{\circ}C$ higher temperature than the glass transition temperature of shape memory polymer. Firstly, the specimen was installed horizontally and tested. The deploying motion was captured by a digital camera and analyzed by a Tracker program. To reduce the effects of gravity, the specimen was installed vertically and tested again. The deployment performance of a shape memory polymer was investigated by comparing the results of horizontal and vertical installation tests.

Synthesis of Polyurethanes Containing Poly(dimethyl siloxane) and Their Thermal and Shape Memory Properties (폴리디메틸실록산 성분을 포함하는 폴리우레탄의 합성과 이들의 열적 및 형상기억 특성)

  • Ra, Sang Hee;Kim, Young Ho
    • Polymer(Korea)
    • /
    • v.38 no.5
    • /
    • pp.602-612
    • /
    • 2014
  • Polyurethanes containing poly(dimethyl siloxane) (PDMS) unit, PU-Si, were synthesized and their thermal and shape memory properties were investigated. Various amounts of PDMS units were incorporated via a solution polymerization method using mixed diols of poly(tetramethylene ether glycol) (PTMEG) and PDMS-diol as the soft segment (SS) and methylene diphenyl diisocyanate and 1,4-butanediol as the hard segment (HS). Two series of PU-Si samples with an HS content of 23% or 32% were prepared and analyzed. For PU-Si with an HS content of 23%, both the cold crystallization temperature ($T_{cc}$) and melt crystallization temperature of the SS domain moved higher temperature with increasing PDMS content, while the melting temperature ($T_m$) of the SS domain remained unaffected. The increase in HS content from 23% to 32% resulted in the increased $T_m$ and disappearance of $T_{cc}$. The shape recovery of PU-Si flim with an HS content of 32% increased while its shape retention decreased as PDMS content increased.

A Study of Dynamic Characteristics of Segmented Shape Memory Alloy Wire (구간 분할된 형상기억합금 와이어의 동특성에 관한 연구)

  • Jeong S.H.;Kim J.H.;Kim G.H.;Lee S.H.;Shin S.M.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2006.05a
    • /
    • pp.329-330
    • /
    • 2006
  • The research and development of an actuator are accelerating in the robotics industry. The electricity polymer and SMA actuator are designed simply and are produced a lot of forces per unit volume. Their motions are similar to human's motion, But the repeatability of the electricity polymer actuator is lower. The reaction velocity of the SMA actuator is slow and the travel is short. In this paper, the dynamic characteristic of the segmented SMA is studied. The SMA wire is divided by using the Thermo-electric module(TEM) to control each of segments independently. The MOSFET circuit is used to supply constant currents fer the Thermo-electric module(TEM). The hysteresis and displacement of the SMA wire according to load are measured.

  • PDF

Development of Conducting Shape Memory Polymer Actuators (전도성 형상 기억 폴리머 작동기의 개발)

  • 백일현;윤광준;조재환;구남서
    • Journal of Institute of Control, Robotics and Systems
    • /
    • v.10 no.11
    • /
    • pp.976-980
    • /
    • 2004
  • This study has introduced how to make conducting shape memory polyurethane(CSMPu) as a possible application to smart actuators. Different from conventional polyurethane, CSMPu can have a high conductivity and then electric power supplies enough energy to deform. To prepare conducting polyurethane, carbon nanotubes were incorporated into shape memory polyurethane. Basic experiments to reveal its characteristics have been conducted for a development of actuators. From the results conducted in the present study, optimized conditions for the process of actuating deformation were found. Thermo-electric characteristics such as the relation between temperature and specific resistance and trend curves of resistance variations according to elongations were measured. These data provided a strong possibility of CSMPu as a smart actuator.

Effect of interface bonding strength on the recovery force of SMA reinforced polymer matrix smart composites (형상기억합금 선재가 삽입된 폴리머기지 능동복합재료의 회복력에 미치는 계면 접합강도의 영향)

  • 김희연;김경섭;홍순형
    • Proceedings of the Korean Society For Composite Materials Conference
    • /
    • 2003.04a
    • /
    • pp.18-21
    • /
    • 2003
  • The effect of interface bonding strength on the recovery force of SMA wire reinforced polymer matrix composites was investigated by pullout test. Firstly, the recovery forces and transformation temperatures of various prestrained SMA wires were measured and 5% prestrained SMA wires were prepared for the reinforcements of composites. EPDM incorporated with 20vol% silicon carbide particles(SiCp) of 6, 12, $60{mutextrm{m}}$ size were used as matrix. Pullout test results showed that the interface bonding strength increased when the SiCp size decreased due to the increase of elastic modulus of matrix. Cyclic test of composites was performed through control of DC current at the constant displacement mode. The abrupt decrease of recovery force during cycle test at high current was occurred by thermal degradation of matrix. This was in good agreement with temperature related in the thermal degradation of matrix. The hysteresis of recovery force with respect to the temperature was compared between wire and composite and the hysterisis of composites was smaller than the wire due to less thermal conduction.

  • PDF