• Journal of the Korean Ceramic Society
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• v.39 no.1
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• pp.92-98
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• 2002

To investigate the electrode structural effect on the ferroelectric electron emission, the electric field distribution in a 2-dimensional structure was calculated as a function of upper electrode diameter, and the switching charge density and emission charge were measured simultaneously. The simulation of the electric field distribution showed that an asymmetric electrode structure could cause a stray field on the bare surface of the ferroelectric cathode near the edge of upper electrode. The distance of stray field from the electrode edge increased with increasing ferroelectric thickness, but it did not depend on the upper electrode diameter. The switching charge density increased more on the cathode with smaller upper electrode diameter. This was attributed to the stray field on the bare ferroelectric surface near the electrode edge, because the stray field for the asymmetric ferroelectric cathode enhanced polarization switching near the electrode edge. From the switching charge density, the distance of stray field from the electrode edge was calculated as about 11-14${\mu}{\textrm}{m}$. The threshold voltage of electron emission was 61-68 kV/cm, which was almost 3 times lager than the coercive voltage. The threshold voltage was not determined just by coercive voltage, but by strength and distance of the stray-field, which largely depended on the geometrical structure of ferroelectric cathode.

• Journal of the Korean Vacuum Society
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• v.19 no.1
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• pp.52-57
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• 2010

$BiFeO_3/Pb(Zr_{0.52}Ti_{0.48})O_3$(BFO/PZT) multilayer thin films have been prepared on a Pt/Ti/$SiO_2$/Si(100) substrate by chemical solution deposition. BFO single layer, BFO/PZT bilayer and multilayer thin films were studied for comparison. X-ray diffraction analysis showed that the crystal structure of all films was multi-orientated perovskite phase without amorphous and impurity phase. The leakage current density at 500 kV/cm was reduced by approximately four and five orders of magnitude by bilayer and multilayer structure films, compared with BFO single layer film. The low leakage current density leads to saturated P-E hysteresis loops of bilayer and multilayer films. In BFO/PZT multlayer film, saturated remanent polarization of $44.3{\mu}C/cm^2$ was obtained at room temperature at 1 kHz with the coercive field($2E_c$) of 681.4 kV/cm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.5
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• pp.1-1
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• 2001

비휘발성 메모리 소자로의 응용의 관점에서, sol-gel 방법으로 La 을 10mo1% 로 고정시킨 PLZT (10/y/z) 박막을 제작하여 Zr/Ti 조성비에 따른 구조적 및 전기적 특성을 조사하였다. PLZT(10/40/60) 박막은 로제트와 파이로클로르 상이 관찰되었으며, Zr/Ti 조성비에서 Ti 함유량이 증가함에 따라, (100) 배향성, 결정립 크기와 표면 거칠기는 증가되었다. 또한 Zr/Ti 조성비에서 Ti 함유량이 증가함에 따라, 10㎑ 에서 비유전율은 600 에서 400 으로 감소된 반면, 유전손실은 0.028 에서 0.053 로 증가되었으며, 170 ㎸/cm 에서 누설전류밀도는 1.64×$10^{-6}$ 에서 1.26×$10^{-7}$A/㎠ 으로 감소되었다. 그리고 ± 170㎸/㎝ 에서 측정한 PLZT 박막의 이력곡선을 측정한 결과, Zr/Ti 조성비가 40/60 에서 0/100 로 변화함에 따라 PLZT 박막의 잔류분극과 항전계는 6.62 에서 12.86 μC/cm2, 32.15 에서 56.45㎸/㎝ 로 각각 증가되었으며, 피로와 retention 특성 역시 개선되었다. PLZT 박막에 ±5V 의 사각펄스를 $10^9$ 회 인가하여 피로특성을 측정한 결과, PLZT(10/40/60) 박막의 잔류분극은 초기분극값으로부터 50% 감소된 반면, PLZT(10/0/100) 박막은 30% 감소되었다. 또, $10^5$ 초의 retention 결과에서 PLZT(10/0/100) 박막은 초기분극값에서 오직 11% 만이 감소된 반면, PLZT(10/40/60) 박막은 40% 감소되었다.

• Korean Journal of Materials Research
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• v.7 no.8
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• pp.646-649
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• 1997

(111)과 (100)우선방위의 정방정계의 Pb(Zr$_{0.2}$, Ti$_{0.8}$)O$_{3}$박막의 강유전체 특성과 신뢰성특성을 상부 전극의 두께를 변화시키면서 연구하였다. (111)우선방위의 박막이 (100)우선방위의 박막보다 큰 잔류분극과 항전계 값을 갖고 있어 정방형의 이력곡선 특성을 보여주었다. 스위칭전하의 상부전극의 두께 의존성은 상부전극을 열처리 할 때 유도되는 압축응력에 의한 stress효과로 설명할 수 있었다. 상부전극의 두께가 얇은 박막은 초기에는 작은 스위칭 전하를 갖고 있으나 스위칭 횟수가 증대됨에 따라 기계적인 응력의 감소로 인하여 부분 수위칭 영역이 확대되어 내구성이 향상되었다.

• Electrical & Electronic Materials
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• v.10 no.10
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• pp.983-988
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• 1997

We investigated the structural and dielectric properties of PZT(20/80)/PZT(80/20) heterolayered thin films that fabricated by the alkoxide-based Sol-Gel method. PZT(20/80)/PZT(80/20) heterolayered thin films were spin-coated on the Pt/Ti/SiO$_2$/Si substrate with PZT(20/80) film of tetragonal structure and PZT(80/20) film of rhombohedral structure by turns. Each layers were dried to remove the organic materials at 30$0^{\circ}C$ for 30min and sintered at $650^{\circ}C$ for 1hr. This procedure was repeated several times to form PZT(20/80)/PZT(80/20) heterolayered films and thickness of the film obtained by one-times of drying/sintering process was approximately 80-90nm. PZt-1, 3, 5 films with top layer of PZT(20/80) film of tetragonal structure showed fine grain structure and PZT-2, 4, 6 films with top layer of PZT(80/20) film of rhombohedral structure showed the dense grain microstructure without rosette-type. Dielectric constant and dielectric loss of the PZT-6 film were approximaterly 1385 and 3.3% respectively. Increasing the number of coatings remanent polarization was increased and coercive field was decreased and the values of the PZT-6 film were 8.13$\mu$C/cm$^2$and 12.5kV/cm respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.2
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• pp.143-150
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• 2000

Ferroelectric SrxBi2+yTa2O9+$\alpha$ thin films with various compositions(x=0.7, 0.8, 1, y=0.3, 0.4) were prepared by sol-gel method. The film with moled ratio of 0.8:2.3:2.0 in Sr/Bi/Ta, which was deposited on Pt/SiO2/Si (100), showed better ferroelectric properties than other films. To investigate substrate effects, the same compositions were spin coated on Pt/Ti/SiO2/Si (100) substrates. At an applied voltage of 5V, the dielectric constant($\varepsilon$r), remanent polarization (2Pr) and coercive field (Ec) of the Sr0.8Bi2.3Ta2O9+$\alpha$ thin film prepared on Pt/Ti/SiO2/Si (100) were about 296, 24$\mu$C/$\textrm{cm}^2$ and Ec of 49kV/cm respectively. Both SBT films firred at 80$0^{\circ}C$ revealed no fatigue up to 1010 cycles. Retention characteristics of these capacitors showed no degradation up to 104 sec.

• Electrical & Electronic Materials
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• v.6 no.3
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• pp.241-247
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• 1993

본 연구에서는 투광성 0.085Ba(L $a_{1}$2/N $b_{1}$2/) $O_{3}$- 0.915Pb(Z $r_{y}$ $Ti_{1-y}$) $O_{3}$(0.45.leq.y.leq.0.70)세라믹을 2단 소성법으로 제작한 후, PbZr $O_{3}$조성 및 온도에 따른 구조적, 강유전적특성을 측정하였다. XRD측정 결과, PbZr $O_{3}$조성이 감소할수록 결자상수 및 단위격자 체적은 감소하였으며 시편의 결정구조는 입방정계에서 능면체정계, 정방정계로 변화되었다. 8.5/60/40시편의 경우 포화분극, 잔류분극 및 항전계가 각각 33.28[.mu.C/$cm^{2}$], 4.15[kV/cm]로 전형적인 메모리 특성을 나타내었으며 PbZr $O_{3}$조성이 증가함에 따라 강유전 이력곡선은 slim loop특성을 나타내었다. 잔류분극은 온도가 증가함에 따라 감소하였으며 특히 PE-FE상경계 부근에 위치한 조성의 경우, 상전이 온도 이하의 온도에서 급격히 감소하는 경향을 나타내었다.다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.204-205
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• 2007

Self-seed 층을 이용한 PLZT(9/65/35), 강유전체 박막을 Sol-Gel 법을 이용해 Pt/Ti/$SiO_2$/Si 기판 위에 증착한 후, Self-seed 층에 의한 PLZT(9/65/35) 박막의 구조적, 전기적 특성을 고찰하였다. Seed 층을 도입하지 않은 PLZT 박막의 경우 다결정 상으로 형성되는 것을 알 수 있었으며, seed 층을 도입한 PLZT 박막은 (110) 방향으로 우선 배향됨을 알 수 있었다. 증착된 PLZT(9/65/35) 박막의 유전율 및 유전손살은 10kHz에서 유전율 205, 유전손살 0.029 이었으며, Self-seed layer를 도입한 PLZT 박막의 경우 seed layer를 도입하지 않은 PLZT 박막보다 낮은 온도에서 결정화 되는 것을 관찰 할 수 있었다. Self-seed layer가 도입된 PLZT(9/65/35) 박막의 경우 잔류분극 ($P_r$) 값은 $9.1{\mu}C/cm^2$, 항전계($E_c$)는 47 kV/cm을 나타내었다.

• Korean Journal of Materials Research
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• v.7 no.6
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• pp.522-528
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• 1997

RF-magnetron Sputtering Process를 이용하여 Pt/Ti/Si(100)기판위에 lanthanum-modified lead titanate 박막을 제작하였다. 기판온도와 증착시간이 증가함에 따라 증착율은 감소하였다. 기판온도가 증가함에 따라 fine grain들은 large grain으로 변화하였다. Perovskite구조는 기판온도 54$0^{\circ}C$, gas pressure 30mtorr에서 나타나기 시작하였다. 본 실험에서 perovskite 박막제작에 대한 조건은 기판온도 58$0^{\circ}C$, gas pressure 30mtorr였다. Pt/Ti/Si(100) 우선 배향된 박막을 얻었다. La양이 증가함에 따라 유전율, 항전계, 잔류분극량은 증가하였다. 중심주파수가 44.7MHz, 전파속도는 2680m/sec를 가지는 SAW filter 특성을 얻었다.

• Journal of Sensor Science and Technology
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• v.4 no.4
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• pp.75-80
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• 1995

In order to fabricate the piezoelectric thin film of the PZT-PNN ternary compound, the metal alkoxides were used as starting materials. The electrical and crystalline properties of the thin film were evaluated. The X- RD study shows that the crystallization of the film is optimized at $550^{\circ}C$ of sintering temperature. According to the D-E hysterisis curve, the coercive field is 28.8 kV /cm, and the remanent polariztion is $18.3\;{\mu}C/cm^{2}$. The break down voltages of the thin films are $76.0\;{\sim}\;27.0\;MV/m$. When the sintering temperature is raised, the break down voltage is lowered. As a result of measuring the C-V characteristic curve of the ternary compound piezoelectric thin film, the relative dielectric constants are 406 for the composition (50:40:10), 1084 for the composition (50:30:20), 723 for the composition (45:35:20) and 316 for the composition (40:40:20).