• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2110-2115
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• 2008

In this study, We disigned and manufactured the Hot Chuck which can be operated until $120^{\circ}C$. Its shape is circular, wide is 300mm and depth is 15mm. Two types working fluid was used as working fluid(distilled water, 0.1%-$TiO_2$ nanofluid). The experimental results were compared to each working fluid. The effect of various working fluid, charging volume ratio was investigated. Also we investigated heat transfer rate against each working fluid. By using nanofluid, heat transfer rate can be enhanced and the wick structure can be constructed automatically on smooth surface. The experiment of 40% charged 0.1%-$TiO_2$ nanofluid showed the best performance of thermal accuracy and uniformity. To improve performance of Hot Chuck, more study is needed.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2369-2374
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• 2008

In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ${\pm}1.5%$ during heating to $120^{\circ}C$. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type(300mm) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various liquids(aceton, FC-40, water) were used as the working fluid and charging ratio was changed($14{\sim}36\;vol.%$). Several cases were tested to improve temperature uniformity. Major working fluid to be investigated was water. Using water, various parameters such as charging ratio, wafer operation on-off time, different working fluids. In case of water, the temperature uniformity was ${\pm}1.5%$, response time of wafer were investigated.