• Title/Summary/Keyword: 합금도금

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Optimization of Resistance Spot Weld Condition for Single Lap Joint of Hot Stamped 22MnB5 by Taking Heating Temperature and Heating Time into Consideration (핫스템핑 공정에서 가열온도 및 유지시간을 고려한 22MnB5의 단일겹치기 저항 점용접 조건 최적화)

  • Choi, Hong-Seok;Kim, Byung-Min;Park, Geun-Hwan;Lim, Woo-Seung;Lee, Sun-Bong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.10
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    • pp.1367-1375
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    • 2010
  • In this study, optimization of the process parameters of the resistance spot welding of a sheet of aluminum-coated boron alloyed steel, 22MnB5, used in hot stamping has been performed by a Taguchi method to increase the strength of the weld joint. The process parameters selected were current, electrode force, and weld time. The heating temperature and heating time of 22MnB5 are considered to be noise factors. It was known that the variation in the thickness of the intermetallic compound layer between the aluminum-coated layer and the substrate, which influences on the formation of nugget, was generated due to the difference of diffusion reaction according to heating conditions. From the results of spot weld experiment, the optimum weld condition was determined to be when the current, electrode force, and weld time were 8kA, 4kN, and 18 cycles, respectively. The result of a test performed to verify the optimized weld condition showed that the tensile strength of the weld joint was over 32kN, which is considerably higher than the required strength, i.e., 23kN.

Preparation and Characterization of a Sn-Anode Fabricated by Organic-Electroplating for Rechargeable Thin-Film Batteries (유기용매 전해조를 이용한 리튬이차박막전지용 Sn 음극의 제조)

  • Kim, Dong-Hun;Doh, Chil-Hoon;Lee, Jeong-Hoon;Lee, Duck-Jun;Ha, Kyeong-Hwa;Jin, Bong-Soo;Kim, Hyun-Soo;Moon, Seong-In;Hwang, Young-Ki
    • Journal of the Korean Electrochemical Society
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    • v.11 no.4
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    • pp.284-288
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    • 2008
  • Sn-thin film as high capacitive anode for thin film lithium-ion battery was prepared by organic-electrolyte electroplating using Sn(II) acetate. Electrolytic solution including $Li^+$ and $Sn^{2+}$ had 3 reduction peaks at cyclic voltammogram. Current peak at $2.0{\sim}2.5\;V$ region correspond to the electroplating of Sn on Ni substrate. This potential value is lower than 2.91 V vs. $Li^+/Li^{\circ}$, of the standard reduction potential of $Sn^{2+}$ under aqueous media. It is the result of high overpotential caused by high resistive organic electrolytic solution and low $Sn^{2+}$ concentration. Physical and electrochemical properties were evaluated using by XRD, FE-SEM, cyclic voltammogram and galvanostatic charge-discharge test. Crystallinity of electroplated Sn-anode on a Ni substrate could be increased through heat treatment at $150^{\circ}C$ for 2 h. Cyclic voltammogram shows reversible electrochemical reaction of reduction(alloying) and oxidation(de-alloying) at 0.25 V and 0.75 V, respectively. Thickness of Sn-thin film, which was calculated based on electrochemical capacity, was $7.35{\mu}m$. And reversible capacity of this cell was $400{\mu}Ah/cm^2$.

The Environmental Hazard Assessment of Siting Restricted Industries from Industrial Complex in Rural Area Applied by Chemical Ranking and Scoring System (화학적 등급화기법을 적용한 농공단지 입주제한업종의 환경유해성 평가)

  • Hong, Sang-Pyo
    • Journal of Environmental Impact Assessment
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    • v.24 no.6
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    • pp.549-560
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    • 2015
  • The priorities of siting restriction was derived from quantification of environmental hazard according to industrial classification based on 'Chemical Ranking and Scoring System(CRS)' which is handling the discharge characteristics of 31 industrial classifications regulated from locating at 'Industrial Complex in Rural Area(ICRA)'. CRS that is utilizing the data of 'Pollutant Release and Transfer Registers(PRTR)' is applied to determine human health risk and ecological risk which are calculated by discharged amount and materials $LC_{50}$ according to water, soil and air media based on industrial classification. From this process, exposure assessment and toxicity assessment for integrating the adverse environmental impact and the mitigation effect of environmental risk according to the development of environmental technologies into establishing the rational landuse management method for the 31 industrial classifications regulated from locating at ICRA was analyzed. From the assessment result of the siting restriction removal at ICRA for 31 industrial classifications, based on 2012 year reference 6 industries that includes Manufacture of Guilt Coloration Surface Processing Steel Materials, Manufacture of Biological Product, Manufacture of Smelting Refining and Alloys of Copper, Dyeing and Finishing of Fibers and Yarns, Manufacture of Other Basic Iron and Steel n.e.c., Rolling Drawing and Extruding of Non-ferrous Metals n.e.c. are calculated as having relatively lower environmental hazards, thus it is judged that the siting restriction mitigation at ICRA is possible for the 6 industrial classifications that are not discharging the specific hazardous water contaminants during manufacturing process.

Quantitative Analysis and Archaeometric Interpretation for Molten Glass and Bronze Materials within Baekje Crucibles from the Ssangbukri Site in Buyeo, Korea (부여 쌍북리유적 출토 백제 도가니 내부 유리 및 청동 용융물질의 정량분석과 고고과학적 해석)

  • Lee, Chan-Hee;Park, Jin-Young;Kim, Ji-Young
    • Journal of Conservation Science
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    • v.26 no.2
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    • pp.157-169
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    • 2010
  • This study focused on the material characteristics and archaeometric relationship between the molten glass and bronze materials within the crucibles and gilt-bronze Bodhisattva statue excavated from the Ssangbukri site in Buyeo, Korea. Yellowish green to red brown vitreous material in the crucibles was identified as lead glass which contained scarce amount of BaO, and low $Al_2O_3$ and CaO. Metallic molten material was identified as bronze of copper-tin-lead alloy with low amount of impurities that indicated well-refined materials. Also, cassiterite was used for raw metal ore of tin. The Bodhisattva statue consisted of major copper with trace impurities in the core metal, and gold amalgam in the gilded layer. Though lead isotopic analysis showed contradictory results in each lead glass, bronze and Bodhisattva statue that required further examination, it could be stated that the statue was made in the Ssangbukri site based on the high-level technical skills of bronze production.

Effect of magnetic separation in removal of Cr and Ni from municipal solid waste incineration (MSWI) bottom ash (생활폐기물(生活廢棄物) 소각(燒却) 바닥재의 자력선별(磁力選別)에 따른 크롬과 니켈의 거동(擧動))

  • Ahn, Ji-Whan;Um, Nam-Il;Cho, Kye-Hong;Oh, Myung-Hwan;You, Kwang-Suk;Han, Gi-Chun;Cho, Hee-Chan;Han, Choon;Kim, Byong-Gon
    • Resources Recycling
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    • v.16 no.6
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    • pp.3-9
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    • 2007
  • Although the ferrous material was separated by the magnetic separation before the incineration process, the municipal solid waste incineration bottom ash generated during incinerator in metropolitan area consists of many iron products which account for about $3{\sim}11%$ as well as ceramics and glasses. The formation of $NiFe_2O_4$ and $FeCr_2O_4$ with a $Fe_3O_4-Fe_2O_3$ (similar to pure Fe) on the surface of iron product was found during air-annealing in the incinerator at $1000^{\circ}C$, because Ni and Cr has a chemical attraction about iron is using to coat with Ni and Cr metals for poish or to prevent corrosion. Therefore, Fe-Ni Cr oxide can be formed on durface of the iron product and it can be separated from bottom ash through the magnetic separation. So, in this study, the separation ratio of heavy metals as magnetic separation and mineralogical formation of Fe-ion(heavy metal) in ferrous metals corroded were investigated. As the result, the separation ratio of Ni and Cr based on particle sizes accounted for about $45{\sim}50%$, and Cu and Pb accounted for below 20%. Also, the leaching concentration of Ni and Cr in bottom ash separated by magnetic separation was lower than that in fresh bottom ash.

내장형 선형 ICP(Inductively Coupled Plasma) system에서 자장이 플라즈마와 PR 식각특성에 미치는 영향

  • 김경남;이영준;경세진;염근영
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2003.05a
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    • pp.3-3
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    • 2003
  • 고밀도 플라즈마를 생산할 수 있는 대면적용 플라즈마 소스의 개발은 미세전자구조 산업에서부터 FPD 산업에 이르기까지 많은 영역에 걸쳐 필수 불가결한 기술요소가 되어가고 있 다. 이러한 대면적용 고밀도 플라즈마에의 적용을 위하여 새로운 유도결합형 플라즈마 소오스의 개발이 진행되고 있으며, 차세대 반도체 식각 및 세정 공정을 위하여 여러 형태의 안 테나가 연구되어지고 있다. 그러나 TFT -LCD에 적용이 가능하게끔 기존의 ICP 소오스를 직 접적으로 대면적화 하는 데에는 여러 가지 문제점들로 인해 그 한계점이 들어났다. 그 예로 안테나의 길이가 길어짐에 따른 안테나 저항 값이 커지며, 안테나 소스 길이자체가 사용하는 인가전력(13.56MHz)의 반파장에 해당되는 길이가 되었을 경우 생기는 심각한 정상파 효과, 유전물질의 두께 증가 및 그에 따른 재료비의 상승 및 관리상의 어려움들이 바로 그것 이라 할 수 있겠다. 그러므로, 본 연구에서는 차세대 TFT -LCD 대면적 공정에 적용 가능한 고밀도 플라즈마 를 발생시키기 위해서 내장형 유도결합형 선혈 안테나를 사용하였다. 내장형 유도결합형 선 혈 안테나가 가지고 있는 고유의 정전기적 결합효과를 최소화시키기 위해 직사각형모앙의 플라즈마 댐버(830mm*1,020mm)에서 영구자석을 사용하여 multi-cusp 자장효과 및 다양 한 자장의 배열에 따른 플라즈마 특성변화를 살펴보았다. 영구자석을 사용하여 외부자장을 인가하였을 때가, 그럴지 않은 때보다 RF 안테나 코일의 전압을 낮춰주었으며, 영구자석의 배열에 따라 코일의 인덕턴스의 값이 크게 변함을 알 수 있었다. 그리고 최적화된 자장의 배열은 플라즈마의 이온밀도를 증가시켰으며, 플라즈마의 균일도도 10% 이내로 유지됨을 알 수 있었다. 또한 영구자석에 의한 자장의 유무 및 공정압력과 인가전력에 따른 P Photoresist Film의 식각특성에 관해 살펴보았다.증을 위한 실험.측정장비의 구입 및 업계와의 공동활용, 국내.외 최신기술 정보자료의 수집과 신속제공, 국내.외 전문가 초청 활 용, 미래 지향적 목적활용 기초연구사업 수행, 미래기술 동향예측 및 홍보 등을 통해 서 국내 도금기술의 기술자립 및 고도화를 위한 여건마련을 위하여 노력하고 있다.빛 이때의 부식속도(선형분극법), 인위적인 피막 파괴 전,후 의 전위 변화 및 부식속도 측정법에 의한 국부부식 발달 저지능 등을 평가하여 각 실험결과를 비교분석하여 보았다. 수록 민감하여 304 의 IGSCC 와 매우 유사한 거동을 보인다. 본 강연에서는 304 와 600 의 고온 물에서 일어나는 IGSCC 민감도에 미치는 환경, 예민화처리, 합금원소의 영향을 고찰하고 이에 대한 최근의 연구 동향과 방식 방법을 다룬다.다.의 목적과 지식)보다 미학적 경험에 주는 영향이 큰 것으로 나타났으며, 모든 사람들에게 비슷한 미학적 경험을 발생시키는 것 이 밝혀졌다. 다시 말하면 모든 사람들은 그들의 문화적인 국적과 사회적 인 직업의 차이, 목적의 차이, 또한 환경의 의미의 차이에 상관없이 아름다 운 경관(High-beauty landscape)을 주거지나 나들이 장소로서 선호했으며, 아름답다고 평가했다. 반면에, 사람들이 갖고 있는 문화의 차이, 직업의 차 이, 목적의 차이, 그리고 환경의 의미의 차이에 따라 경관의 미학적 평가가 달라진 것으로 나타났다.corner$적 의도에 의한 경관구성의 일면을 확인할수 있지만 엄밀히 생각하여 보면 이러한 예의 경우도 최락의 총체적인 외형은 마찬가지로 $\ulcorner$순응$\lrcorner$의 범위를 벗어나지 않는다. 그렇기 때문에도 $\ulcorner$순응$\lrcorner$$\ulcorner$표현$\lrcorner$

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Fabrication of Porous Cu Layers on Cu Pillars through Formation of Brass Layers and Selective Zn Etching, and Cu-to-Cu Flip-chip Bonding (황동층의 형성과 선택적 아연 에칭을 통한 구리 필라 상 다공성 구리층의 제조와 구리-구리 플립칩 접합)

  • Wan-Geun Lee;Kwang-Seong Choi;Yong-Sung Eom;Jong-Hyun Lee
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.4
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    • pp.98-104
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    • 2023
  • The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.