• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.3
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• pp.907-915
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• 1991

본 연구에서는 피로 크랙 발생 및 파단수명의 통계학적 분포특성을 명확히 하 기 위해서 단축인장을 받고, 크랙 선단 곡율반경이 일정한 중앙 크랙을 가진 81개의 시험편을 사용하여 4개의 응력 레벨하에서 피로 시험을 행한후 많은 데이터들로 부터 피로크랙의 발생, 파단특성에 대한 신뢰성 있는 통계학적 확률특성을 제시하고, 이들 데이터를 활용하여 수명예측을 행해보고저 한다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.9 no.3
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• pp.301-308
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• 1985

본 논문에서는 불규칙 하중을 받는 부재에 대한 연구의 고초로서 간단한 응력 모델을 설정하고 이들 변동응력이 가해지는 시기를 명확히 구분하여 크랙전파곡선의 거동을 고찰하였다. 특히 부하되는 응력 진폭의 크기에 따라서 크랙선단부의 미시적 인 변화의 크기가 다르고 이로인하여 크랙전파에 대한 피해의 정도가 달라진다고 하면 크랙전파의 지연 및 가속현상이 나타날 것이 예측이 되고 따라서 이때 나타나는 피해 정도의 크기를 미소 경도치로 환산하여 그것과 피로크랙 전파 특성과를 비교 검토 하 였다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.3
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• pp.880-886
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• 1991

본 연구에서는 이미 크랙전파의 제단계에 있는 평골재의 정유 크랙을 대상으 로, COD를 고정밀도로 측정하는 것을 주된 수단으로하여, 피로한도의 존재유무를 지배 하는 미소크랙의 정유구조를 상세히 밝히고자 한다. 또한 변형시교에 근거한 현상으 로만 알려져온 과소응력효과, coaxing효과를 크랙폐구현상의 관점에서 검토하여, 크랙 정유현상의 본질적인 이해를 얻고자 한다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.9 no.4
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• pp.421-429
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• 1985

This study has been made to investigate into the relation between fatigue crack behavior and ferrite grain size. As experimental observation of the low-carbon steel specimen with the drilled micro-hole under rotating bending stress was made to accomplish this investigation. Obtained results are as follows; (1) The fatigue limit of micro-hole depends upon the magnitude of ferrite grain size, as indicated by the Hall-Petch formula. (2) The fatigue crack occurring around the micro-hole is of shear type, and the frequency of fatigue crack initiation depends upon the ferrite grain size. (3) The magnitude of ferrite grain size affects the behavior of fatigue crack propagation up to the crack size of 0.3mm. The effect, however, is negligible for the crack size larger than 0.3mm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.311-315
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• 1992

일반적으로 기계구조물에서는 비교적 응력확대계수 K의 해석이 용이한 판 두께를 관통하는 관통크랙보다는 표면에 존재하는 결함에서 발생, 전파하는 표면 크랙이 대부분이다. 표면은 내부보다 소성변형에 대한 저항이 작고, 대기에 직접 접해 있으며, 평활재에 있어서의 인장, 압축이외의 응력은 일반적으로 표면에서 최대가 되는 등의 이유로 내부보다 쉽게 피로재해를 받는다. 침탄질화 열처리를 하는 중요한 목적이 재료 표면에 있어서 경화능과 피로강도의 향상이므로 침탄질화 처리재의 표면 크랙에 관한 연구가 절실히 요구됨은 당연하다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.5
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• pp.842-849
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• 1997

The aim of this study is an investigation of the interaction of two micro hole defects affecting fatigue crack initation life and propagation behavior. The locatio of two micro hole defects was considered as an angle of alignment and the distance between the centers of two micro hole defects. The fatigue cracking behavior is experimented under bending. When micro defects are located close to each other, the fatigue crack initiation lives are varied with their relative locations. In the experiments, the area of local plastic strain strongly played a role in the fatigue crack initiation lives. Therefore we introduce a parameter which contains the plastic deformation area at stress concentrations and propose a fatigue crack initiation life prediction curve. In addition, the directions and propagation rates of fatigue cracks initiated at two micro hole defects are studied experimentally.

• Journal of Ocean Engineering and Technology
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• v.1 no.2
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• pp.74-82
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• 1987

This study has been made to investigate into the behavior of fatigue limit, of fatigue crack initiation, and of fatigue crack propagation under the condition of rotating bending stress; specifically on the independency of stress field as well as the crack behavior of surface micro hole defect, which is made artificially through the specimen. The results obtained can be summarized as followa; 1) For the single micro hole defect, initiation of fatigue crack is occurred at both tips of microhole defect simultaneosly along the slip which are produced in the range of maximum principal stress arround micro hole defect independent of the size of micro hole defect. 2) For the neighbored deuble micro hole defects with equal size, in the range ($\frac{L}{r}$)ratio $\gtrsim$ 3 defined as the size of micro hole defect(2r) to the distance between the centers of micro hole defects (2L), the crack behavior of the micro hole defects is same as single one. However, for the range of $\frac{L}{r}$<3, the interference effect becomes significant as the ratio approaches to 1.

• Journal of Power System Engineering
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• v.6 no.1
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• pp.61-67
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• 2002

15Cr-5Ni 석출강화 스테인리스강 3종류의 피로균열 발생과 성장 특성 및 파괴인성에 대하여 노치함수로서 연구하였다. 3종류강의 열처리 조건은 $482\;^{\circ}C,\;579\;^{\circ}C$ 및 $621\;^{\circ}C$이다. $621\;^{\circ}C$에서 4시간동안 열처리한 시험편 C는 약 $280\;MPa\;\sqrt{m}$의 가장 높은 파괴인성을 보였으며, 3종류에서 피로균열 성장이 가장 늦었다. $482\;^{\circ}C$에서 1시간 열처리한 시험편 A에서, 피로균열발생한계, ${\Delta}k{\rho}$, 는 노치반경0.3 mm에서 약 $280\;MPa\;\sqrt{m}$의 가장 높은 값을 보였다. 시험편 A는 시험편 B와 C보다 피로균열 성장이 빨랐지만, 피로균열 발생이 늦었다. 예 하중에 의한 노치선단의 압축잔류응력은 노치 시험편의 피로강도 향상에 유용한 방법이었다.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.24 no.1
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• pp.44-49
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• 1988

The paper presents the preliminary results of an esperimental study on crack growth under tension-tension fatigue loading. A purpose of the study is to find the effect of the specimen thickness on crack propagation behaviors. The thickness of the low catbon steel specimens the are used in the experiments are 5, 10, 15,20, and 25 mm. the type of specimen considering in the present study is compact tension specimen.Crack growth behaviors are obseved and measured by travelling microscope. From the study, the followings are found; 1. There is a certain specimen thickness that is the shortest farigue life. The fatigue life of 15mm specimen is the shorter then that of any other opecimen 2. The crack initiation of the thick specimen is slower than that of thin specimen. But the crack propagation rate is just the opposite. 3. The range which is the exponent, m of power law(paris) is 1.98-4.59. the thicker the spec-imen is, the higher the value of m is.