• Title/Summary/Keyword: 피노실

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Apoptotic Effect of Pinosylvin at a High Concentration Regulated by c-Jun N-Terminal Kinase in Bovine Aortic Endothelial Cells (혈관내피세포에서 c-Jun N-terminal kinase에 의해 조절되는 세포사멸에 고농도의 피노실빈이 미치는 효과)

  • Song, Jina;Park, Jinsun;Jeong, Eunsil;So, A-Young;Pyee, Jaeho;Park, Heonyong
    • Journal of Life Science
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    • v.25 no.4
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    • pp.416-424
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    • 2015
  • Pinosylvin is a stilbenoid found in the Pinus species. Pinosylvin at ~pM to ~nM concentrations induces cell proliferation, cell migration and anti-inflammatory activity in endothelial cells. However, it was recently reported that pinosylvin at high concentrations (50 to 100 μM) induces cell death in bovine aortic endothelial cells. In this study, we conducted a series of experiments to discover how pinosylvin at a high concentration (50 μM) induces endothelial cell death. Pinosylvin at the high concentration was shown to induce endothelial cell apoptosis through enhancing caspase-3 activity, flip-flop of phosphatidyl serine, and nuclear fragmentation. We found that pinosylvin at the high concentration additively increased caspase-3 activity enhanced by serum-starvation or treatment with 100 μM etoposide. We also determined that pinosylvin at the high concentration promoted activations of c-Jun N-terminal kinase (JNK) and endothelial nitric oxide synthetase (eNOS). We further ran a series of experiments to find out which signaling molecule plays a critical role in the pinosylvin-induced apoptosis. We finally found that SP-600125, a JNK inhibitor, had an inhibitory effect on the pinosylvin-induced endothelial cell death, but L-NAME, an eNOS inhibitor, had no effect. These data indicate that JNK is involved in the pinosylvin-induced apoptosis. Collectively, pinosylvin at high doses induces cell apoptosis via JNK activation.

Design and Analysis of Static Firing Test for KM Subscale Motor (KM 축소형 추진기관에 대한 설계 및 시험결과분석)

  • Kwon Taehoon;Lee Wonbok;Hwang Jongsun;Cho Inhyun
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • v.y2005m4
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    • pp.16-19
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    • 2005
  • The basic research on KM(Kick Motor) for space launch vehicle was carried out. KM whick will be used as 2nd stage solid rocket motor. in Korean Satellite Launch Vehicle(I) has been developing. KM is a solid rocket motor using composite propellant based on HTPB and is composed of composite motor case and submerged nozzle. To develop KM rocket motor satisfing a given set of requirement, firstly the full-scale KM was designed, then sub-scale motor reduced about $50\%$ were manufactured and tested.

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Analysis of Burn-back Tendency on the Finocyl Grain (Finocyl 그레인의 Burn-back 경향성 분석)

  • Park, Chan Woo;Roh, Tae-Seong;Lee, Hyoung Jin;Jung, Eunhee
    • Journal of the Korean Society of Propulsion Engineers
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    • v.25 no.2
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    • pp.55-65
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    • 2021
  • In this study, the design criteria is presented for Finocyl grain, which is easy to generate neutral thrust when designing solid rocket motors. For this purpose, an automated program using drafting method was developed for burn-back analysis and its accuracy was validated. Using this developed program, burn-back analysis was performed with various configuration parameters of Finocyl grain, and the tendency and sensitivity analysis on burning characteristics were performed. Based on this analysis, the design criteria were presented to generate the neutral burning surface area trace for a Finocyl grain.

Development of Ultrasonication-assisted Extraction Process for Manufacturing Extracts with High Content of Pinosylvin from Pine Leaves (솔잎의 피노실빈 고함유 추출물 생산을 위한 초음파 추출 공정 개발)

  • 조용진;이상국;안용현;피재호
    • Journal of Biosystems Engineering
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    • v.28 no.4
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    • pp.325-334
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    • 2003
  • Pinosylvin, a stilbenoid phytoalexin, is a health ingredient to be extracted from pine leaves. In this study, ultrasonication-assisted extraction process for manufacturing extracts with high content of pinosylvin from pine leaves was investigated. As process and system variables, ultrasonic power, sonication time and solvent ratio were selected. According to the experimental results, the effective yield of pinosylvin increased with the increase of ultrasonic power and sonication time and the decrease of solvent ratio. When the ultrasonic power of 2400 W/L was added to the solution of pulverized pine leaves of 8 g per 1 L of a solvent for 10 minutes, yield of extracts and purity, effective yield and concentration ratio of pinosylvin were 0.3166 g/g, 0.7247 mg/g, 0.2294 mg/g and 23.0, respectively.

Direct Bonding of Si(100)/NiSi/Si(100) Wafer Pairs Using Nickel Silicides with Silicidation Temperature (열처리 온도에 따른 니켈실리사이드 실리콘 기판쌍의 직접접합)

  • Song, O-Seong;An, Yeong-Suk;Lee, Yeong-Min;Yang, Cheol-Ung
    • Korean Journal of Materials Research
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    • v.11 no.7
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    • pp.556-561
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    • 2001
  • We prepared a new a SOS(silicon-on-silicide) wafer pair which is consisted of Si(100)/1000$\AA$-NiSi Si (100) layers. SOS can be employed in MEMS(micro- electronic-mechanical system) application due to low resistance of the NiSi layer. A thermally evaporated $1000\AA$-thick Ni/Si wafer and a clean Si wafer were pre-mated in the class 100 clean room, then annealed at $300~900^{\circ}C$ for 15hrs to induce silicidation reaction. SOS wafer pairs were investigated by a IR camera to measure bonded area and probed by a SEM(scanning electron microscope) and TEM(transmission electron microscope) to observe cross-sectional view of Si/NiSi. IR camera observation showed that the annealed SOS wafer pairs have over 52% bonded area in all temperature region except silicidation phase transition temperature. By probing cross-sectional view with SEM of magnification of 30,000, we found that $1000\AA$-thick uniform NiSi layer was formed at the center area of bonded wafers without void defects. However we observed debonded area at the edge area of wafers. Through TEM observation, we found that $10-20\AA$ thick amourphous layer formed between Si surface and NiSix near the counter part of SOS. This layer may be an oxide layer and lead to degradation of bonding. At the edge area of wafers, that amorphous layer was formed even to thickness of $1500\AA$ during annealing. Therefore, to increase bonding area of Si NiSi ∥ Si wafer pairs, we may lessen the amorphous layers.

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