• Clean Technology
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• v.14 no.2
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• pp.103-109
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• 2008

In this study, in order to develop evaluation method of the cleaning efficiency of residual flux which remains on the surface after soldering with solder paste, a specially designed metal tool is used to reduce spread uncertainty of flux while soldering. Using this tool, the measurement of cleaning efficiency of flux after soldering for some typical alternative semi-aqueous cleaners and 1,1,1-TCE by weighing method was conducted. As the test result of cleaning efficiency for each cleaner at several different cleaning times, the precision of the data is confirmed to within about 4% relative standard deviation (RSD) range. So, it is considered that this would be a good evaluation method for evaluating the cleaning efficiency of the residual flux which remains after solder paste soldering in the alternative cleaning. The results of this test method shows that the cleaning efficiency of ST 100SX and Neozal 750H in the cleaning of residual flux was better than other semi-aqueous cleaners, but its cleaning efficiency was clearly inferior to 1,1,1-TCE.

• Clean Technology
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• v.19 no.3
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• pp.219-225
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• 2013

Environment-friendly and surfactant-free aqueous cleaning agents have been developed in order to solve various problems generated by surfactants in the aqueous cleaning agents. Aqueous surfactant-free cleaning agents, S-1 and S-2 have been formulated with water-soluble solvents such as propylene glycol and propylene glycol ether on their main components and with some additives. These solvents were chosen because of their good solubility in water and excellent solubility of fluxes which are major contaminants of printed circuit board in the electronic industry. Physical properties of the formulated and the imported cleaning agents were measured to predict their cleaning performance, and their cleaning abilities of flux and solder contaminants were evaluated under the various ultrasonic frequencies by a gravimetric method. The measurement results show that the physical properties of cleaning agent V are generally similar with those of formulated cleaning agents S-1 and S-2. Both the cleaning agent V and the formulated cleaning agents S-1 and S-2 showed similar trends that their pH decrease in the beginning and then increases later on with the increase of their dilution in water. It is considered that the wetting indices of the cleaning agents calculated with experimental values do not not have any influence on their cleaning ability. In ultrasonic cleaning tests under three ultrasonic frequencies of 28, 45, and 100 kHz, their best performances of cleaning solder and flux were obtained at 45 kHz and 28 kHz, respectively, and the cleaning performance of the formulated cleaning agents S-1 and S-2 was better than that of the cleaning agent V. However, in the case of the recommended diluted concentration of 25 wt% cleaning solution, the cleaning performance of the cleaner V for solder and flux was better in the initial stage of cleaning compared to the formulated cleaners. And it may be concluded that the formulated cleaning agents S-1 and S-2 can be applied to cleaning of solder and flux in the industry, based on the experimental results in this study.

• Clean Technology
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• v.14 no.2
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• pp.95-102
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• 2008

In order to choose alternative environmental-friendly cleaning agents, it is very important in the present point that the systematic selection procedures should be introduced and applied to the industry through the evaluation of their cleaning ability, environmental characteristics, and economical factors, and that the objective and effective evaluation methods of cleanliness should be established for the industry. Thus, a novel cleaning evaluation method utilizing optically stimulated electron emission (OSEE) among various methods of cleaning ability was studied in this study. The contaminants used in this cleaning experiments were flux, solder, grease, cutting oil, and mixed soil of 35% grease and 65% cutting oil. The cleaning agents developed or prepared in our laboratory were employed and their cleaning ability were comparatively evaluated by the OSEE, gravimetry and contact angle methods. The experimental results in this work showed that flux cleaning efficiency measured by the OSEE method was similar to that of the gravimetric method, but that the OSEE method could not be compared with gravimetric method for the case of solder or grease cleaning because the contaminants radiate or absorb ultra-violet light. In case of cutting oil cleaning, the gravimetric method indicated its limitation of cleaning efficiency of cutting oil since it showed cleaning efficiency of 100%, even though residual soil remaining on the substrate surface a little after its cleaning. The comparative experimental results of cleaning ability evaluated by the OSEE- and contact angle measurement methods showed that they were similar in case of cleaning of flux, mixed soil and cutting oil. It was judged that the contact angle measurement method could evaluate the cleaning ability more precisely than the OSEE method for cleaning solder and grease.

• Clean Technology
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• v.13 no.2
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• pp.143-150
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• 2007

The objective of this study is to develop hydrocarbon-based cleaning agents by blending paraffins, glycol ethers and siloxanes in oder to effectively clean contaminants such as flux, solder and grease. And the effect of cleaning ability by wetting index, aniline points and solubility parameter of the formulated hydrocarbon-based cleaning agents were studied in this work. The formulated hydrocarbon-based cleaning agents were prepared on the base of physical properties of their individual components. Wetting indexes and aniline points of their were measured through experiments and solubility parameters of their were calculated based on the Hansen's equation. In this study, evaluation of cleaning ability by cleaning agents were carried out using contaminants such as flux, solder, and grease. The experimental results showed that the cleaning ability of the formulated cleaning agents was excellent in cleaning contaminants such as flux, solder and grease and that the influencing parameters on their cleaning efficiency were found to be different according to contaminant types. MC($20.3MPa^{1/2}$), DF-1 ($24.2MPa^{1/2}$) and DF-2($21.5MPa^{1/2}$) with similar solubility parameter as flux ($21.3MPa^{1/2}$) showed 100% cleaning efficiency within 3 minutes in flux cleaning. And CFC-113, MC and 1,1,1-TCE with low aniline point less than $-20^{\circ}C$ showed excellent cleaning efficiency in solder cleaning. DG-1($16.2\;MPa^{1/2}$) and DG-2($15.5\;MPa^{1/2}$) with similar solubility parameter as grease($15.0{\sim}17.0\;MPa^{1/2}$) showed relatively low cleaning efficiency of grease, but CFC-113 and MC with high wetting index and low aniline point showed good cleaning efficiency in grease cleaning. As a result of this study, the hydrocarbon-based cleaning agents alternative to regulated cleaning agents such as CFC-113, 1,1,1-TCE and MC were able to be developed through properly blending paraffins, glycol ethers and siloxanes for cleaning flux, solder and grease. And it can be shown that various influencing parameters of cleaning efficiency such as wetting index, aniline point, solubility parameter and etc. of the non-aqueous cleaning agent should be reviewed for prediction of their cleaning ability and can be applied to formulation of cleaning agents.

• Clean Technology
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• v.12 no.4
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• pp.250-258
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• 2006

CFC compounds such as CFC-113 and 1,1,1-TCE, etc. have been used in various industries due to their excellent chemical stability, thermodynamic characteristics, non-inflammability and anti-corrosiveness. However, in oder to protect the earth environment, "the Montreal Protocol on substances that deplete the ozone layer" was adopted in 1989 for prevention of production and utilization of these CFC compounds and alternative cleaning agent have been required in the industry. The objective of this study is to develop non-aqueous cleaning agents that do not require major change of cleaning system, have excellent cleaning efficiency, are favorable to the environment, are harmless to the human body, and are not generated corrosive materials. In this work, non-aqueous cleaning agents have been formulated with glycol ether series and paraffinic hydrocarbon series with siloxane, and their physical properties and cleaning efficiencies were analyzed and compared with those of regulated materials. As a result of physical properties measurement of the formulated cleaning agents, it is expected that they may have good penetration ability into contaminated materials due to their properties with low density and low surface tension. Measurement of flash point and vapor pressure of the cleaning agents will be helpful for evaluation of their safety and working environment. The experimental results of cleaning flux, solder and grease by the formulated cleaning agents show that their cleaning abilities of soils were good and that there were no residues on the substance after cleaning. Therefore, alternative cleaning agents which have equivalent cleaning ability to regulating materials, good penetration ability and low hazard to human body, have been developed in this work.

• Clean Technology
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• v.17 no.4
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• pp.306-313
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• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.

• Applied Chemistry for Engineering
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• v.16 no.4
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• pp.533-541
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• 2005

Non-aqueous cleaning agents were formulated with 2,2,2-trifluoroethanol (TFEA) and hydrofluoroether (HFE), and their physical properties and cleaning abilities were examined. TFEA-based aqueous cleaning agents were also formulated with nonionic surfactants, hydrotropes and builders, and their cleaning abilities were compared. Possibilities of these cleaning agents as substitutes for CFC-113 and 1,1,1-TCE were finally evaluated. In this work, fluxes, cutting oils, greases, and fluoric oils were selected as model contaminants for cleaning experiments. These contaminants have different properties of water-solubility or hydrophilicity, and fat-solubility or lypophilicity. Cleaning abilities of TFEA-based cleaning agents were analyzed and compared through the measurement of contaminant weight changes as a function of cleaning time, and their possibilities as alternative cleaning agents were evaluated. As a result, it was shown that TFEA and HFE-based non-aqueous cleaning agents have quite a good cleaning power for fluxes and fluorine soils but low one for greases. And TFEA-based agueous cleaning agents which consisted of nonionic surfactants, hydrotrope, and builders were very effective for cleaning fluxes and greases under certain formulation conditions. Thus, it was revealed that the TFEA-based cleaning agents were very effective for cleaning specific contaminants and can be used as substitutes for CFC-113 and 1,1,1-TCE in some industrial applications.

• Proceedings of the Membrane Society of Korea Conference
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• 1996.04a
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• pp.46-47
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• 1996

막분리 공정의 공업적인 이용을 위해서는 막을 특정 용기에 적재한 모듈의 형태가 요구되는데 모듈의 형태에 따라 평판형(plate and frame), 나권형(spiral wound), 관형(tubular), 중공사형(hollow fiber)모듈 등이 있다. 이 중에서 관형 시스템은 내경이 12.5~25 mm, 길이 0.6~6.4 m에 이르는 비교적 큰 open channel로 되어 있으며 공급액 유로가 일반적으로 커서 전처리를 행하지 않고도 fouling이 적으며, 또한 막 표면의 세정이 약품에 의한 것 이외에 스폰지 볼 등에 의한 물리적 세정도 가능하므로 응용 범위가 넓다는 것이 특징이다. 한외여과 공정의 가장 큰 문제점은 농도분극 및 fouling 현상에 의한 플럭스 감소이다. 농도분극 현상은 경계층에서 용질의 대류,확산적인 전달에 기인하여 막 표면으로 갈수록 진해지는 용액층의 형성을 의미한다. 이 현상은 가역적인 과정으로서 감압함으로 원상태로 회복이 가능하며 조작 압력에서 정상상태가 되면 막투과 플럭스는 일정한 값을 유지한다.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• 한국생물공학회:학술대회논문집
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• 2002.04a
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• pp.145-148
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• 2002

Membrane bioreactors for wastewater treatment must operate for long periods without chemical cleaning. This study investigates the critical flux concept introduced by Field et al. as a means for achieving this goal. We conducted two series of tests: at fixed transmembrane pressure(TMP) and at fixed permeate flux. set by a volumetric pump on the permeate. Comparison of constant pressure and constants flux tests under same conditions showed that the critical flux is almost identical to the limiting or pressure independent flux obtained in constant pressure. More generally, constant flux procedure below the critical flux avoids overfouling of the membrane in the initial stage and is more advantageous for membrane bioreactor operation.