• Applied Chemistry for Engineering
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• v.32 no.1
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• pp.49-54
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• 2021

Plasma-polymerized methyl methacrylate (MMA) thin films were synthesized by remote plasma, and effects of plasma power, reaction pressure and direct-indirect plasma on the growth rate and chemical bonding were investigated with alpha-step, FT-IR, XPS and Langmüir probe method. As the plasma power and pressure increased, the tendency of growth rate showed maximum value at a certain range. FT-IR and XPS analyses revealed that composition ratio of C/O and hydrocarbon (C-C) % in the deposited films increased with plasma power, but ester (COO) C % decreased with it. Direct plasma method was effective for fast growth rate, but indirect plasma method was favorable for maintaining the chemical structure of MMA.

• Journal of the korean academy of Pediatric Dentistry
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• v.31 no.1
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• pp.85-91
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• 2004

The purpose of this study was to observe in vitro pulp chamber temperature rise during composite resin polymerization with various light-curing sources. The kinds of light-curing sources were plasma arc light(P), low heat plasma arc light, traditional low intensity halogen light, low intensity LED(L-LED), and high intensity LED(H-LED). Temperature at the tip of light guide was measured by a digital thermometer using K-type thermocouple. Occlusal cavities$(2{\times}2{\times}1.5mm)$ were so prepared in extracted human premolars as to the remaining dentin thickness was 1mm. Dentin adhesive was applied to all cavities. Experimental groups consisted of no base group, ionomer glass base group, and calcium hydroxide base group. Temperature before and after resin filling was measured. Temperature at the light guide tip was the highest with P and the lowest L-LED. Temperature before resin filling was the highest with H-LED and the lowest with L-LED. Temperature after resin filling was the highest with H-LED and the lowest with L-P and with L-LED. The lining of base partially reduced the temperature rise.

• Electrical & Electronic Materials
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• v.6 no.4
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• pp.339-346
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• 1993

정전결합 유동가스형 플라즈마 중합장치를 이용하여 여러가지 모노머에 대한 유기고분자 박막을 빗모양 전극위에 형성하고 이들 박막의 감습특성을 검토하기 위해 주파수범위를 60[kHz]-100[kHz]로 변화시켜 가면서 상대습도 20-90[%RH]범위에서 정전용량의 변화를 측정하였다. 상대습도가 증가함에 따라 정전용량은 일반적으로 증가했으며 방전조건중 방전전력이 낮을수록 그리고 중합시간이 짧을수록 정전용량의 증가폭이 크게 나타났다. 그리고 정전용량 측정시 박막에 인가한 전원의 주파수가 낮을수록 정전용량의 변화에 대한 선형성과 증가폭이 분명함을 알았다.

• Journal of the korean academy of Pediatric Dentistry
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• v.30 no.2
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• pp.229-237
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• 2003

The purpose of this study was to compare the effect of exposure time on the polymerization of surface and 2 mm below the surface of light-cured restorative materials cured with three different light sources; conventional halogen light curing unit(XL 3000, 3M, U.S.A.), plasma arc light curing unit(Flipo, LOKKI, France) and light emitting diode(LED) light curing unit(Elipar Free light, 3M, U.S.A.) and compare the uniformity of polymerization from the center to the periphery of resin surfaces according to polymerization diameter cure with three different light sources. From the experiment, the following results were obtained. 1. In Z-100, Plasma arc light exposure time of 6 to 9 seconds and LED light exposure time of 40 to 60 seconds produced microhardness values similar to those produced with 40 second exposure to a conventional halogen light(p>0.05). 2. In Tetric Flow, Plasma arc light exposure time of 9 seconds and LED light exposure time of 40 to 60 seconds produced microhardness values similar to those produced with 40 second exposure to a conventional halogen light(p>0.05). 3. In Dyract AP, Plasma arc light exposure time of 6 to 9 seconds and LED light exposure time of 20 to 40 seconds produced microhardness values similar to those produced with 40second exposure to a conventional halogen light(p>0.05). 4. In Fuji II LC, Plasma arc light exposure time of 9 seconds and LED light exposure time of 20 to 60 seconds produced microhardness values similar to those produced with 40second exposure to a conventional halogen light(p>0.05). 5. Except Fuji II LC, microhardness was decreased from the center to the periphery in all light sources(p<0.05).

• Electrical & Electronic Materials
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• v.3 no.2
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• pp.115-122
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• 1990

플라즈마중합 에틸메타아크릴레이트(PPMMA) 박막의 유전특성인 유전정접(tan .delta.)과 정전용량(C)을 관측하고 산화와 열처리 및 플라즈마처리로 인한 PPMMA의 tan .delta.와 C의 변화에 대하여 연구하였다. 측정온도 25.deg.C, 측정주파수 1KHz에서 1MHz의 범위에서 PPMMA 박막은 CO와 -OH같은 산화물의 생성으로 인하여 tan .delta. 와 C는 증가하고 tan .delta.는 측정주파수 내에서 피이크를 형성한다. 이는 PPMMA내에 잔류하는 저분자량 성분과 자유라디칼의 존재와 공기중에서의 산화가 그 원인이라 할 수 있다. 본연구에서는 PPMMA박마그이 열처리 및 플라즈마처리를 하여 저분자량 성분과 라디칼을 제거하고 산화를 방지하여 박막의 유전특성을 개선하였다.

• Pediatric Infection and Vaccine
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• v.30 no.3
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• pp.121-128
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• 2023

Purpose: This study aimed to investigate the recent age distribution of Mycoplasma pneumoniae in patients with respiratory infections and the differences in diagnostic usefulness according to the methods used in these patients. Methods: We retrospectively reviewed the medical records of patients aged ≤18 years with respiratory infectious diseases who underwent polymerase chain reaction (PCR) or a specific immunoglobulin M (IgM) test between July 2016 and February 2019. The diagnosis of M. pneumoniae infection was confirmed by a positive result in the PCR or IgM test. Results: Of the 2,721 patients tested for M. pneumoniae, 2,197 underwent IgM, and 1,144 underwent PCR, with positivity rates of 17% and 20%, respectively. Among the 620 patients tested for both IgM and PCR tests simultaneously, 35% had M. pneumoniae infection, with 14% under 1 year old and 13% under 1-2 years old. The positive rate increased with age in both tests. Higher positive rates were observed in the IgM test before 3 years of age and in the PCR test after 3 years of age. The agreement rate between the two tests was 77.9% (Cohen's kappa 0.402). Conclusions: As age increased, the rates of M. pneumoniae infection also increased. In patients under 2 years of age, 4¬-14% of infections were confirmed depending on the method used. The moderate agreement between the PCR and IgM tests suggests that the simultaneous use of PCR and the IgM test for the early diagnosis should be approached with caution.

• Electrical & Electronic Materials
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• v.6 no.5
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• pp.428-434
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• 1993

유기물 중에서 광기능성을 가지는 벤젠, 비닐 피리딘 및 스티렌 단량체를 채택하였다. 내정전결합 유동가스형 중합장치를 사용하여 플라즈마 박막을 제조하였으며 이들의 광학특성을 분석하였다. 중합시간, 압력 및 단량체 유량을 일정하게 유지하고 방전전력을 증가시키면 스티렌 박막의 중합률은 선형적으로 증가하나 벤젠 및 비닐 피리딘 박막의 증합률은 비선형적으로 증가한다. 그리고 파장이 변화에 따른 굴절률은 1.55~1.65 정도를 나타냈다. 박막의 굴절률은 방전전력의 증가에 따라 감소하게 된다. 또한 굴절률의 변화에 대한 소멸계수(K)의 계산이 $10^{-3}$정도의 범위에 있으므로 측정 결과가 타당함을 알 수 있다.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.43 no.5
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• pp.802-808
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• 1994

The purpose of this paper is to describe an application of plasma polymerized thin film as an electron beam resist. Plasma polymerized thin film was prepared using an interelectrode capacitively coupled gas-flow-type reactor, and chosen methylmethacrylate(MMA)and methylmethacrylate-tetrameth-yltin(MMA-TMT) as a monomer. This thin films were also delineated by the electron-beam apparatus with an acceleration voltage of 30kV and an expose dose ranging from 20 to 900$\mu$C/cmS02T. The delineated pattern in the resist was developed with the same reactor which is used for polymerization using an argon as etching gas. The growth rate and etching rate of the thin film is increased with increasing of discharge power. Thin films by plasma polymerization show polymerization rate of 30~45($\pm$3) A/min, and etching rate of 440($\pm$30) A/min during Ar plasma etching at discharge power of 100W. In apparently lower than that of conventional PMMA, but the plasma-etching rate of PP(MMA-TMT) was higher than that of PPMMA.

• Journal of the korean academy of Pediatric Dentistry
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• v.32 no.2
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• pp.332-343
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• 2005

The purpose of this study was to evaluate the influence of soft-start light curing on contraction stress and hardness of composite resin. Composite resin mold was cured using the one-step continuous curing method with three difference light sources; conventional halogen light curing for 40 seconds at $400\;mw/cm^2$, plasma arc light curing for 6 seconds at $1300\;mW/cm^2$ and LED light curing for 10 seconds at $7The purpose of this study was to evaluate the influence of soft-start light curing on contraction stress and hardness of composite resin. Composite resin mold was cured using the one-step continuous curing method with three difference light sources; conventional halogen light curing for 40 seconds at . For the soft-start curing method ; 2 seconds light exposure at $650\;mW/cm^2$ followed by 3 seconds at $1300\;mW/cm^2$ and exponential increase with 5 seconds followed by 10 seconds at $700\;mW/cm^2$ were used. Contraction stress was measured using strain gauge method and Vickers hardness was measured 24 hours after polymerization at the top and bottom of specimens. Resin-acrylic interfaces were observed using a scanning electron microscope(SEM). The results of present study can be summarized as follows: 1. Contraction stresses at 10 min after polymerization were significantly reduced with the soft-start curing both in plasma and LED light sources(P<0.05). 2. Plasma light curing with soft-start resulted in not only the lowest contraction stress, but also the lowest hardness(P<0.05) 3. LED light curing with soft-start showed lower contraction stress than the one-step continuous halogen and LED light curing(P<0.05). 4. Microhardness of specimens cured by LED light with soft-start was equivalent to that of cured by the one-step continuous halogen and LED light(P>0.05). 5. Curing by LED light with soft-start and conventional halogen light resulted in better marginal sealing than plasma light and one-step LED light curing.

• Electrical & Electronic Materials
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• v.7 no.5
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• pp.425-429
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• 1994

In this paper, we study on the plasma polymerized styrene as a negative electron-beam resist. Plasma polymerized thin film was prepared using an interelectrode inductively coupled gas-flow type reactor. We show that polymerization parameters of thin film affect sensitivity and etching resistance of the resist. Molecular weight distribution of plasma polymerized styrene is 1.41-3.93, and deposition rates of that are 32-383[.angs./min] with discharge power. Swelling and etching resistance becomes . more improved with increasing discharge power during plasma polymerization. Etch rate by RIE is higher than that by plasma etching.