• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.167-167
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• 2013

최근 발수 특성은 자동차 표면, 건축 구조물, 가전제품 및 모바일 기기 등 여러 분야에서 사용되고 점차 그 필요성이 대두되고 있다. 이러한 발수성의 표면은 연 잎이나 곤충의 날개, 도마뱀의 발바닥 등 자연계의 여러 곳에서 관찰 할 수 있다. 특히 연 잎의 표면에서 나타나는 초발수 특성이 마이크로와 나노 크기의 돌기 구조와 표피 왁스 성분에 기인한다는 것이 밝혀지면서 이를 응용한 다양한 연구가 진행되고 있다. 본 연구에서는 물리적인 표면처리로 마이크로와 나노 구조물을 형성하고 그 위에 표면에너지를 낮출 수 있는 물질을 증착하여, 발수 특성을 가지는 표면을 개발하였다. 알루미늄 표면에 마이크로 크기의 알루미나(Al2O3) 분말을 이용한 블라스트(blast) 공정으로 마이크로 구조를 형성하고, 선형 이온 소스(LIS)를 이용한 Ar 이온 빔 에칭으로 나노 구조를 형성하였다. FE-SEM 분석을 통해 수~수십 마이크로 구조 위에 나노 크기의 구조가 형성 된 것을 관찰하였다. 마이크로와 나노 구조가 형성된 알루미늄의 표면에너지를 낮추기 위해 trimethylsilane (TMS) 및 Ar을 이용한 플라즈마처리로 표면에 기능성 코팅막을 형성하였다. 그 결과 TMS처리 전에 비해 표면에너지가 99.75 mJ/m2에서 9.05 mJ/m2으로 급격히 낮아지고 접촉각이 $54^{\circ}$에서 $123^{\circ}$로 향상되었다.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.1-5
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• 2009

This investigation is applied Taguchi method and the analysis of variance(ANOVA) to the reactive ion etching(RIE) characteristics of $SiO_2$ film coated on a wafer with Experimental Analysis and Optimization of $CF_4/O_2$ Plasma Etching Process mixture. Plans of experiments via nine experimental runs are based on the orthogonal arrays. A $L_9$ orthogonal array was selected with factors and three levels. The three factors included etching time, RF power, gas mixture ratio. The etching rate of the film were measured as a function of those factors. In this study, the etching thickness mean and uniformity of thickness of the RIE are adopted as the quality targets of the RIE etching process. The partial factorial design of the Taguchi method provides an economical and systematic method for determining the applicable process parameters. The RIE are found to be the most significant factors in both the thickness mean and the uniformity of thickness for a RIE etching process.

• Journal of the Korean Society of Clothing and Textiles
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• v.27 no.7
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• pp.843-850
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• 2003

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless plated Cu layer and polyester (PET) film, the effect of pretreatment conditions such as etching method, mixed catalyst composition were investigated. Chemical etching and plasma treatment increased surface roughness in decreasing order of Ar＞HCl＞O$_2$＞NH$_3$. However, adhesion of Cu layer on PET film increased in the following order: $O_2$＜Ar＜HCl＜NH$_3$. It indicated that appropriate surface roughness and introduction of affinitive functional group with Pd were key factors of improving adhesion of Cu layer. PET film was more finely etched by HCI tolution, resulting in an improvement in adhesion between Cu layer and PET film. Plasma treatment with NH$_3$produced nitrogen atoms on PET film, which enhances chemisorption of Pd$^{2+}$ on PET film, resulting in improved adhesion and shielding effectiveness of Cu layer deposited on the Pd catalyzed surface. Surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$; SnCl$_2$from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, adhesion and shielding effectiveness of Cu plated PET film were increased.d.

• Journal of the Korean Vacuum Society
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• v.18 no.5
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• pp.390-393
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• 2009

We report on a new patterning technique for organic functional materials applicable to organic photovoltacis (OPVs). The unconventioal patterning technique, $O_2$ plsama-etching selectively perfluoro-alkyl fluorosilanes, is used for producing a bulk-heterojunction active layer with poly(3-hexylthiophene) as the electron donor and [6,6]-phenyl-$C_{61}$ butyric acid methyl ester as the electron acceptor. The patterning with reduced leakage path and parasitic capacitance suggests a way for fabrication of OPVs with higher energy conversion efficiency.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.24-24
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• 2018

One of the challenges in tissue engineering is the design of optimal biomedical scaffolds, which can be governed by topographical surface characteristics, such as size, shape, and direction. Of these properties, we focus on the effects of nano - to micro - sized hierarchical surface. To fabricate the hierarchical surface structure on poly(${\varepsilon}$-caprolactone) (PCL) film, we employed a nano/micro-casting technique (NCT) and modified plasma process. The micro size topography of PCL film was controlled by sizes of the micro structures on lotus leaf. Also, the nano-size topography and hydrophilicity of PCL film were controlled by modified plasma process. After the plasma treatment, the hydrophobic property of the PCL film was significantly changed into hydrophilic property, and the nano-sized structure was well developed, as increasing the plasma exposure time and applied power. The surface properties of the modified PCL film were investigated in terms of initial cell morphology, attachment, and proliferation using osteoblast-like-cells (MG63). In particular, initial cell attachment, proliferation and osteogenic differentiation in the hierarchical structure were enhanced dramatically compared to those of the smooth surface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.185-185
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• 2012

최근 자연모사를 이용한 연구가 다양한 분야에 적용되고 있다. 특히 연 잎의 표면에서 나타나는 초발수 특성이 마이크로 나노 크기의 구조와 표면에너지를 제어하는 에피큐티클 왁스에 기인하다는 것이 밝혀지면서 이를 응용한 연구가 진행되고 있다. 본 연구는 알루미늄 표면처리로 마이크로와 나노 구조물을 형성하고 그 위에 발수 특성을 가진 물질을 증착하여, 발수성을 가지는 표면을 개발하였다. 알루미늄 표면에 마이크로 크기의 알루미나($Al_2O_3$) 분말을 이용한 블라스트(blast) 공정으로 표면에 마이크로 구조를 형성하고, Linear Ion Source(LIS)를 적용한 Ar 이온빔 에칭으로 나노 구조를 형성하였다. FE-SEM 분석을 통해 수~수십 마이크로 구조 위에 나노 크기의 구조가 형성 된 것을 관찰하였다. 마이크로 나노 구조가 형성된 알루미늄의 표면에너지를 낮추기 위해 trimethylsilane(TMS) 및 Ar을 이용한 플라즈마처리로 표면에 기능성 코팅막을 형성하였다. 그 결과 TMS 발수 코팅하기 전에 비해 표면에너지가 $99.75mJ/m^2$에서 $9.05mJ/m^2$으로 급격히 낮아지고 접촉각 값이 $123^{\circ}$로 향상된 것을 확인하였다.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2074-2076
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• 2000

In this paper, RFICP equipment is designed and manufactured with the aid of high frequency discharge to produce uniform plasma with high density and large diameter. And $SF_6$ gas is used to investigate plasma characteristics. The electron density and temperature, potential dependence of $SF_6$ plasma in accordance with its operating pressure, gas flux and input power are measured by the method of Langmuir probe. The etching characteristics of the plasma is researched in accordance with operating pressure, gas flux, input power to apply to Silicon Wafer which is used in the field of semiconductor process. The proposed RFICP equipment, in this paper, has relatively excellent etching characteristics, and is thought to be element of oxidization-sheath etching facility in semiconductor manufacturing process.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.214.1-214.1
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• 2013

Tetra-ethoxysilane (TEOS)은 일반적으로 저온 게이트 산화막의 원료 널리 이용되고 있으나 as-deposited 상태에서는 필수적으로 생성된 높은 계면밀도와 고정전하를 제거하기 위하여 수소계면처리, forming gas annealing 등 후처리 공정을 필수적으로 거처야만 한다. 즉 후처리 공정 없이도 일정수준의 계면밀도와 고정전하를 갖을 수 있는 출발물질이 제안되면 산업적 의미를 갖을 것이다. 본 연구에서는 TEOS를 대체할 수 있는 후보재료로써 Tetra-iso-propoxysilane (T-iso-POS)을 제안하였다. T-iso-POS는 iso 구조의 3차원적 특수 구조를 가지므로 더 쉽게 분해 될 수 있어 탄소의 결합을 억제 할 수 있다고 사료된다. 용량 결합형 PECVD (13.56 MHz) 장비를 이용하여 RCA 세정을 실시 한 p-Si (100) 기판위에 TEOS 혹은 T-iso-POS (2 sccm)와 O2를 도입(50 sccm), 플라즈마 전원(20~100 W), 압력(0.1~0.5 torr), 온도 ($170{\sim}400^{\circ}C$), 전극 간 거리 (1~4.5cm)의 조건 하에서 증착하였다. 얻어진 각각의 SiO2 막에 대해, 성장 속도, 2% BHF 용액보다 에칭 속도, IV 특성과 C-V 특성, FT-IR에 의해 화학구조 평가를 실시했다. T-iso-POS원료로 사용하여 TEOS보다 낮은 약 $200^{\circ}C$에서 증착 된 산화막에서 후 처리 없이도 10 MV/cm 이상의 절연 파괴 특성을 나타내는 우수한 게이트 절연막 제작에 성공했다. 그 성장 속도도 약 20 nm/min로 높았다.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.143-146
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• 2002

Unsized AS-4 carbon fibers were etched by RF plasma and then coated via plasma polymerization in order to enhance adhesion to vinyl ester resin. The gases utilized for the plasma etching were Ar, $N_2 and O_2$, while the monomers used for the plasma polymerization coating were acetylene, butadiene and acrylonitrile. The conditions for the plasma etching and the plasma polymerization were optimized by measuring interfacial adhesion with vinyl ester resin via micro-droplet tests. Among the treatment conditions, the combination of Ar plasma etching and acetylene plasma polymerization provided greatly improved interfacial shear strength (IFSS) of 69MPa compared to 43MPa with as-received carbon fiber. Based on the SEM analysis of failure surface and load-displacement curve, it was assume that the failure might be occurred at the carbon fiber and plasma polymer coating. The plasma etched and plasma polymer coated carbon fibers were subjected to analysis with SEM, XPS, FT-IR or Alpha-Step, and dynamic contact angles and tensile strengths were also evaluated. Plasma polymer coatings did not change tensile strength and surface roughness of fibers, but decreased water contact angle except butadiene plasma polymer coating, possibly owing to the functional groups introduced, as evidenced by FT-IR and XPS.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.79-84
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• 2010

Formation of TSV (Through-Si-Via) with an Au seed layer and Cu filling to the via, simplification of bumping process for three dimensional stacking of Si dice were investigated. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process using $SF_6$ and $C_4F_8$ plasmas alternately. The vias were 40 ${\mu}m$ in diameter, 80 ${\mu}m$ in depth, and were produced by etching for 1.92 ks. On the via side wall, a dielectric layer of $SiO_2$ was formed by thermal oxidation, and an adhesion layer of Ti, and a seed layer of Au were applied by sputtering. Electroplating with pulsed DC was applied to fill the via holes with Cu. The plating condition was at a forward pulse current density of 1000 mA/$dm^2$ for 5 s and a reverse pulse current density of 190 mA/$dm^2$ for 25 s. By using these parameters, sound Cu filling was obtained in the vias with a total plating time of 57.6 ks. Sn bumping was performed on the Cu plugs without lithography process. The bumps were produced on the Si die successfully by the simplified process without serious defect.