• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.7-15
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• 2000

The purpose of this work is to evaluate the solderahility and characteristics of solder joints. Bridge defect of solder joint was examined in natural atmosphere and $N_2$ condition. Consequently, wettability was excellent for each of Sn-Pb plated Cu specimen, Sn plated Cu specimen, and Cu polished in $N_2$ condition. The wetting time in $N_2$ condition was shorter than that of natural atmosphere condition, showing the decreasing values of about 0.2~0.45 seconds. The max. wetting force under the $N_2$ condition was more increasing that of natural atmosphere condition, showing the increasing values of about 1.8~2.8 N. With the result of wetting balance test, the wetting time ($t_2$) and wetting farce according to increasing amount of $N_2$ from 10 1/min to 30 1/min, the wetting time ($t_2$) was reduced about 0.25 second and wetting force was increased about 2.3 N. In non-cleaning flux, when $N_2$ gas is applied, it is compensated to decrease of wettability. In the case of using the $N_2$ gas, the wettability was improved. The reason for improving wettability is due to preventing the formation of dross. The generation rate of bridge in $N_2$ condition decreased than that of natural atmosphere, and when the specimen had a fine pitch, the rate of bridge defects was considerably decreased in $N_2$ condition, showing the decreasing rate of 25~75%.

• Journal of the Korean institute of surface engineering
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• v.35 no.1
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• pp.11-16
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• 2002

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.327-327
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• 2011

DLC 필름은 바이오 적합성, 특히 생체 적합성이 뛰어나기 때문에 바이오 코팅분야에서 널리 이용된다. 많은 연구 결과에 의하면 세포와 장기 등이 바이오 재료 표면에 적절히 접합할 수 있도록, 재료 표면을 산소나 질소를 이용하여 플라즈마 처리로 초친수성 표면으로 개질하고 있다. 하지만, 시간이 지남에 따라서 친수성 표면은 점차 재료의 표면 처리 전의 성질인 소수성을 회복하게 된다. D실제 생체에 적용하기 위해서 이러한 시효 효과에 대한 정확한 평가가 이루어져야 한다. 따라서 산소와 질소 플라즈마 처리 후의 친수성 성질이 소수성 성질로 변해가는 거동을 조사하는게 중요하다. 13.56 MHz의 plasma assisted chemical vapor deposition (PACVD) 법을 이용하여 DLC와 Si-DLC를 500 ${\mu}m$ 두께의 P-type 실리콘(100) 기판에 증착하였다. 박막 증착 과정에 사용한 기체는 벤젠과 희석된 silane이 사용되었다(SiH4/H2=10:90). 박막 증착은 -400 V의 바이어스 전압을 인가하였으며, 이때 증착 압력은 1.33Pa으로 일정하게 유지하여, 두께 $0.55{\pm}0.01{\mu}m$로 증착하였다. X-ray Photoelectron Spectroscopy (XPS) 법을 이용하여 실리콘 함량을 측정하였으며, 증착 된 Si-DLC의 실리콘 함량은 0~4.88 at. %였다. 이후에 질소와 산소 플라즈마를 이용하여 챔버 압력을 1.33 Pa로 유지하여, -400 V의 바이어스 전압을 인가하여 10분간 표면 처리를 하였다. 표면 처리된 DLC와 Si-DLC 표면 위에서의 물방울(water droplet)의 젖음각을 20일간 측정하였다. 플라즈마 표면 처리 된 모든 시편에서 초기 젖음각은 $10{\sim}20^{\circ}$의 친수성 성질을 보였지만, 점차 젖음각이 상승하여 산소 플라즈마 처리 된 Si-DLC를 제외하고는 5일이 지나면서 거의 소수성 표면으로 회복되었다. 산소 플라즈마 처리 된 Si-DLC의 경우, 젖음 각 측정 기간(20일) 동안 $15^{\circ}$ 미만의 친수성 성질을 유지하였다.

• Polymer(Korea)
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• v.24 no.6
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• pp.877-885
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• 2000

PLA, PGA and PLGA films were treated with chloric acid mixture solution [70% perchloric acid (HClO$_4$)/potassium chlorate (KClO$_3$) aq. saturated solution, 3 : 2] to increase surface wettability and thus cell compatibility. The surface-treated PLA, PGA, and PLGA films were characterized by the measurement of water contact angle, electron spectroscopy for chemical analysis, and scanning electron microscopy. Surface wettability of chloric acid-treated PLA, PGA, and PLGA film surfaces was gradually increased with increase of treatment time. Unlike EtOH pre-treatment, chloric acid-treated polymer films maintain hydrophilic surface after drying. In cell adhesion test, fibroblasts were cultured on the chloric acid-treated film surfaces for 1 and 2 days. As the surface wettability increased, the cell adhesion on the surface were increased. In conclusion, this study demonstrated that the surface wettability of polymer plays an important role for cell adhesion and proliferation behavior.

• Polymer(Korea)
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• v.24 no.4
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• pp.499-504
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• 2000

The effect of anodic oxidation on high strength PAN-based carbon fibers has been studied in terms of surface functionality and surface energetics of the fiber surfaces, resulting in improving the mechanical properties of composites. According to FT-IR and XPS measurements, it reveals that the oxygen functional groups on fiber surfaces induced by an anodic oxidation largely influence the surface energetics of fibers or the mechanical interfacial properties of composites, such as the interlaminar shear strength (ILSS) of composites. According to the contact angle measurements based on the wicking rate of a test liquid, it is observed that anodic oxidation does lead to an increase in surface free energy of the carbon fibers, mainly due to the increase of its specific (or polar) component. From the surface energetic point of view, it is found that good wetting plays an important role in improving the degree of adhesion at interfaces between fiber and epoxy resin matrix of the resulting composites. Also, a direct linear relationship is shown between 01s/01s ratio and ILSS or between specific component and ILSS of the composites for this system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.3
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• pp.576-583
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• 2018

Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its band gap is larger than that of silicon and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, porous n-type SiC ceramics fabricated from ${\beta}-SiC$ powder have been found to show a high thermoelectric conversion efficiency in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$. For the application of SiC thermoelectric semiconductors, their figure of merit is an essential parameter, and high temperature (above $800^{\circ}C$) electrodes constitute an essential element. Generally, ceramics are not wetted by most conventional braze metals,. but alloying them with reactive additives can change their interfacial chemistries and promote both wetting and bonding. If a liquid is to wet a solid surface, the energy of the liquid-solid interface must be less than that of the solid, in which case there will be a driving force for the liquid to spread over the solid surface and to enter the capillary gaps. Consequently, using Ag with a relatively low melting point, the junction of the porous SiC semiconductor-Ag and/or its alloy-SiC and/or alumina substrate was studied. Ag-20Ti-20Cu filler metal showed promise as the high temperature electrode for SiC semiconductors.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.426-426
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• 2011

최근 들어 금속물질을 나노미터 단위로 구성할 수 있는 기술이 진보하면서, 금속 나노입자에 의해 발생되는 표면 플라즈몬에 대해서도 다양한 분야의 관심이 집중되고 있다. 유전체 물질을 기지상으로 하는 금속:유전체 나노복합체에서 금속 나노입자는 자유전자들의 집단 진동인 국소표면 플라즈몬 공진(Localized Surface Plasmon Resonance, LSPR)현상에 의해 국부전기장을 증대 시키고, 가시광 및 적외선 영역에서 특성 광흡수 거동을 보인다. 이와 같은 광학적 특성은 금속 나노입자들의 크기, 형태, 그리고 나노입자들의 주변을 구성하는 기지상 물질의 종류에 의해 조절된다. 금속:유전체 나노복합체에 나타나는 이러한 특성은 단순장식코팅 뿐만 아니라 광의 효율적 운용과 광을 매개로 한 기능발현을 필요로 하는 디스플레이, 광학 스위칭 소재 및 태양전지의 효율 향상을 위한 광흡수층 등 매우 다양한 응용이 가능하다. 본 연구에서는 다양한 굴절률을 갖는 재료들 중, 저굴절률을 갖는 SiO2와 고굴절률을 갖는 ZnS-SiO2를 기지상 재료로 선택하여 교번증착 스퍼터링법으로 Ag와 Au입자를 형성시켰다. Ag를 금속나노입자로 갖고, SiO2와 ZnS-SiO2를 기지상으로 하는 금속:유전체 나노복합체에서는 금속나노입자 형성에 따른 뚜렷한 표면 플라즈몬 공진 광흡수 피크가 관찰된 반면 Au나노입자는 기지상에 따라 각기 다른 광흡수 특성을 나타냈는데, SiO2기지상에서 명확한 광흡수 피크를 형성했던 경우와는 달리 ZnS-SiO2기지상에서는 특정파장에서의 흡수피크로 규정되기 어려운 넓은 파장범위에 걸친 완만한 광흡수 피크를 나타냈다. TEM 분석을 통해, ZnS-SiO2 기지상 내의 Au입자는 각각 독립되어 있는 Island형태가 아닌 유전체 기지상과 대칭적으로 혼합된 네트워크 형태의 Bruggeman 기하구조를 구성하고 있음을 확인하였고, 이는 Au입자가 형성되고 성장할 때 Au와 S의 높은 결합에너지로 인해 상당한 젖음 특성을 갖고 성장하였기 때문으로 판단됐다. 따라서 나노복합체를 구성하는 물질간의 광학적 특성뿐만 아니라 기지상 내에서의 금속입자의 성장거동에 대한 연구가 수반되었을 때, 금속:유전체 나노복합체의 표면 플라즈몬 공진 광흡수 특성을 보다 정확하게 제어할 수 있다.

• Clean Technology
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• v.15 no.3
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• pp.180-185
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• 2009

The ethylene-propylene rubber (EPDM) scrap generated from automobile weatherstrip manufacturing process was used to make a thermoplastic elastomer through blending with polypropylene. The surface activated EPDM powder was obtained by the high temperature and shear pulverizer. The addition of surfactant resulted in more surface activated EPDM powder and the optimum loading amounts of surfactant was 1.5 phr. Maleic anhydride was grafted onto polypropylene by reactive blending to give functionalized polypropylene. The wetting property between EPDM scrap and polypropylene was improved by the addition of poly (ethylene-co-acrylic acid) as a compatibilizing agent. Poly(ethylene-co-acrylic acid) decreased the surface tension of polypropylene and thus would contribute to the wettability with EPDM powder.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.1
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• pp.45-51
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• 2016

The present study uses an electron beam (e-beam) to modify the wetting characteristics of thermoplastic polymer surfaces. A high energy e-beam irradiated various polymer surfaces (PET, PMMA, and PC), with variations in irradiation time and applied current. The water contact angles were measured on the e-beam irradiated surfaces in order to investigate the changes in the surface energy and the relevant wettability. Furthermore, XPS analyses were performed to investigate the chemical composition change in the e-beam irradiated surfaces; the results showed that the hydrophilic groups (C-O) increased after the electron beam irradiation. Also, water collection tests were performed for various polymer samples in order to investigate the effect of the surface energy on the ability of water collection, from which it can be seen that the irradiated surfaces revealed better water-collecting capability than pure polymer surfaces.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.11
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• pp.35-40
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• 2019

Laser processing has been used in various fields. In this study, the feasibility of a hydrophobic surface was investigated through the laser cladding technique. A diode laser was used, and the output was set to 600-800 W. Seven different specimens were prepared with different cladding widths and spacings, and the contact angles for water droplets were evaluated. As a result, the contact angle of water droplets measured in the direction parallel to the cladding line was higher than that in the vertical direction. The wider the cladding width and the cladding space, the higher the contact angle in the parallel direction. It is thought that when a higher contact angle is formed in the parallel direction, more air can be placed in the valley between the cladding lines. In addition, for the hydrophobic coating effect, the contact angle of the coated cladding surface was increased by about $5-15^{\circ}$ as a whole compared to the coated smooth surface. It was confirmed that the wetting characteristics were improved through the cladding.