• Proceedings of the Optical Society of Korea Conference
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• 2006.07a
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• pp.405-406
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• 2006

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.4
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• pp.393-400
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• 2012

In recent years, nano-structured thin film systems are often applied in industries such as MEMS/NEMS device, optical coating, semiconductor or like this. Thin films are used for many and varied purpose to provide resistance to abrasion, erosion, corrosion, or high temperature oxidation and also to provide special magnetic or dielectric properties. Quite a number of articles to evaluate the characterization of thin film structure such as film density, film grain size, film elastic properties, and film/substrate interface condition were reported. Among them, the evaluation of film adhesive to substrate has been of great interest. In this study, we fabricated the polymeric thin film system with different adhesive conditions to evaluate the adhesive condition of the thin film. The nano-structured thin film system was fabricated by spin coating method. And then V(z) curve technique was applied to evaluate adhesive condition of the interface by measuring the surface acoustic wave(SAW) velocity by scanning acoustic microscope(SAM). Furthermore, a nano-scratch technique was applied to the systems to obtain correlations between the velocity of the SAW propagating within the system including the interface and the shear adhesive force. The results show a good correlation between the SAW velocities measured by acoustic spectroscope and the critical load measured by the nano-scratch test. Consequently, V(z) curve method showed potentials for characterizing the adhesive conditions at the interface by acoustic microscope.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.43-45
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• 2005

A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted to heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated and heat transfer model was applied for obtaining the transient temperature profile. The transmission laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.4
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• pp.147-152
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• 2008

This paper describes the breakdown poperties of porcelain and polymer insulators using the UV camera. The experiment was carried out using condition of voltage at the KS C IEC 60060-1(2006). As these results, corona discharge in porcelain insulator was generated the weakness point of insulator union. And the corona discharge of polymer insulator happened in union of power source. Also, we could confirm easily weakness part of these insulators by ultraviolet image through the corona discharge. Besides, in the comparison with the exciting technique of ultrasonic detection, it confirmed that deterioration steps are corrected. These steps are possible to judge the deterioration of power facilities through reliable date. Hereafter, this study as the diagnostic technology suitable for the sites is used.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.55-55
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• 2008

압전폴리머 PVDF(polyvinylidene difluoride)의 기판소재를 기반으로 한 디스플레이 소자를 연구하였다. 압전 폴리머 PVDF의 양면은 두께 300nm정도의 ITO(Indium Tin Oxide)를 TCO(Transparent conducting oxide)로 R2R(roll to roll)증착하였으며, 이를 적외선 계열 Pulsed Laser로 상온 건식 에칭을 통해 패턴해내고, 이후 고진공 환경에서 Alq3 를 기반의 유기발광소자를 제작하였다. 전기적 신호에 대해서 기계적인 작동이 가능한 투명 압전 폴리머 재료를 디스플레이 발광소자의 기판 소재로 사용함으로써, 궁극적으로 발광기능과 더불어 압전효과에 의한 스피커 기능이 한 개의 개체내에서 독립적으로 구현될 수 있도록 설계하고, 기술적으로 실현시켰다는 점이 본 연구의 의의라고 할 수 있다. 이를 위해서, 섭씨 80도 이상의 온도에서 압전 성질을 상실하는 것으로 알려진 PVDF에 대해서 투명산화전극을 레이져를 이용한 비가열식 승화방법을 통해 패턴화하는 것을 사용했으며, 밀리미터 단위에서 수십 마이크로미터 수준까지 패턴화할 수 있었다. 제작된 복합형 유연 OLED소자는 기계적으로 휘어진 상태에서도 발광 성능과 스피커 성능을 각각 독립적으로 보였으며, Alq3에 의한 녹색발광을 보임을 확인하였고, 이 경우 양자효율은 약 3%이하의 값을 보였다. 또한 각주파수별 음압(SPL: Sound Pressure Level)측정 결과는 압번폴리머가 가청주파수 영역에서 작동함을 보였으며, 고주파영역에서의 SPL값이 증가하는 전형적인 PVDF사용 필름 스피커의 특성을 보였다. 이로부터 제작된 복합형 소자는 본 연구에서 제안된 목적에서 보인 것과 같이, 두 개의 기능이 서로간의 간섭없이 독립적으로 한 개의 개체 내에서 작동함을 확인할 수 있었다. 본 연구 결과로부터 새로운 유연 전자 소자에 대한 디자인 개념을 제시하고, 기타 다른 기능이 접합된 형태의 신개념 전자 소자를 제안하는 것도 가능할 것으로 기대된다.

• Journal of the Korea institute for structural maintenance and inspection
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• v.14 no.5
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• pp.128-135
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• 2010

Polymer-modified cement mortar(PCM) has been widely used for strengthening of the concrete structures due to its excellent physical properties such as high strength and durability. Adhesive strength or behavior, on the other hands, between PCM and concrete is very important in strengthening the concrete member using PCM. Therefore the adhesive failure mechanism between PCM and concrete should be fully verified and understood. This study was performed to evaluate adhesive strength of PCM to the concrete by the direct pull-out test. In the direct pull-out tests, the adhesive strength under the various pre-treatment conditions such as immersion, thunder shower, freezing and thawing are evaluated. Also, the field direct pull-out test are performed to investigate the adhesive strength of mock-up test specimens. In the results of the test, the adhesive strength value by field test are lower than those of the standard curing condition. From these comparison and investigation, field test result was similar with the thunder shower test result. The results of the test was used to evaluate the korean industrial standard of polymer modified cement mortars for maintenance in concrete.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.301-302
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• 2015

고 기계적 특성을 가지는 나노 임프린트 전극 구조체를 전극으로 이용하여 산화아연 나노와이어를 습식 도금하여 성장시키고, 열전 소자 특성을 분석하였다. 나노선 어레이 형상을 가진 몰드와 열 임프린트 방식을 이용하여 폴리머 기판 표면위에 나노선 어레이 형상을 임프린트 하고, 열 증착 방식으로 금속 박막을 올려 폴리머 기판-금속 간 높은 접합력을 가지는 금속 전극을 형성하였다. 나노 임프린트 전극 구조체를 음극으로 하여 산화아연 나노와이어를 전극 위에 도금하고, 열증착 방식으로 상부 전극을 형성하여 최종적으로 압전 소자를 제조하여, 습식으로만 형성된 산화아연 나노와이어 다발의 압전 특성을 확인하였다.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.06a
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• pp.47-51
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• 2006

레이저를 이용한 폴리머의 융착기술은, 자동차산업에서의 다양한 적용분야에 힘입어 새로운 접합기술로 각광을 받고 있다. 현재까지는, 대부분 작고 간단한 형상의 제품을 융착하는 분야에 많이 적용되어 왔으며, 튼 사이즈의 제품을 대량으로 생산하는 공정에서는 레이저융착이 가지는 다양한 장점에도 불구하고, 프로세스의 안정성, 사출후의 제품변형에 따른 갭의 관리, 작업속도등에 대한 이유로 본격적인 적용을 기피하고 있는 실정이다. 이러한 배경에 의하여 개발된 하이브리드방식(레이저빔+할로겐램프)의 폴리머융착 시스템은, 다이오드레이저에서 출력되는 $800{\sim}980nm$의 레이저파장과 할로겐 램프에서 방사되는 적외선영역의 파장을 동시에 사용함으로써 프로세스의 안장성과 융착효율을 향상시켰다.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.1-10
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• 2020

This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.

• Journal of Welding and Joining
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• v.23 no.5
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• pp.55-60
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• 2005

A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted into heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated. At the wavelength of 1100nm $87.5\%$ of incident laser energy was used for bonding process from the calculation. A heat transfer model was applied for obtaining the transient temperature profile. It was found that with the power of 29.5 mW, the interface begins to melt and bond each other in 3 sec and it is in a good agreement with experiment results. The transmission IR laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip applications.