• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.104-104
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• 2009

금값 폭등과 에너지자원 고갈에 따라 폐 인쇄회로기판의 유가금속 및 에너지자원을 효과적으로 회수하고자, 최근 국내외 금 회수 및 폐백보드 활용방안을 제시하였다. 금을 회수하는 방법으로는 침적박리, 농축처리, 중화처리, 수용액환원처리, 이온교환수지, 전해채취 등의 방법이 있다. 금은 상온침적박리 회수하며 폐백보드는 이동식 건축내장재로 활용하고자 한다.

• Resources Recycling
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• v.19 no.1
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• pp.57-65
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• 2010

Recently, we have investigated the recovery of resources from the waste material of manufacturing printed circuit board. As printed circuit board or chip has become light, small, high reliability, it is necessary to reuse and recover resources from them. Especially, the printed circuit board that has been used for important mobile electronic pans are plated with min.0.03 ${\mu}m$ to max.50 ${\mu}m$. As increasing the cost of gold, raw material, chemicals, payments and waste material, it has been accelerated the competition for reuse and recovery. But, it is insufficiency of technician and equipments for the recovery of effective resource. In this paper, as analyzing the technical trend of gold recovery and waste back board from the manufacturing process of printed circuit board, it may be effective of recycling, further more it may be contributed to develop the valuable resources.